262 patents
Page 12 of 14
Utility
Visualization of three-dimensional semiconductor structures
5 Oct 20
A semiconductor metrology tool inspects an area of a semiconductor wafer.
Aaron J. Rosenberg, Jonathan Iloreta, Thaddeus G. Dziura, Antonio Gellineau, Yin Xu, Kaiwen Xu, John Hench, Abhi Gunde, Andrei Veldman, Liequan Lee, Houssam Chouaib
Filed: 21 Feb 19
Utility
Hybrid design layout to identify optical proximity correction-related systematic defects
5 Oct 20
Defects can be identified using a hybrid design layout that includes a printable layer and a non-printed layer.
Allen Park, Ankit Jain
Filed: 25 Nov 18
Utility
Prediction based chucking and lithography control optimization
28 Sep 20
Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed.
Bin-Ming Benjamin Tsai, Oreste Donzella, Pradeep Vukkadala, Jaydeep Sinha
Filed: 29 Jul 18
Utility
Semi-supervised anomaly detection in scanning electron microscope images
28 Sep 20
Autoencoder-based, semi-supervised approaches are used for anomaly detection.
Shaoyu Lu, Li He, Sankar Venkataraman
Filed: 20 Aug 18
Utility
Scanning electron microscope objective lens calibration using X-Y voltages iteratively determined from images obtained using said voltages
28 Sep 20
Objective lens alignment of a scanning electron microscope review tool with fewer image acquisitions can be obtained using the disclosed techniques and systems.
Ichiro Honjo, Christopher Sears, Hedong Yang, Thanh Ha, Jianwei Wang, Huina Xu
Filed: 8 Aug 17
Utility
Imaging performance optimization methods for semiconductor wafer inspection
21 Sep 20
An inspection system may include an optical component configured to deliver inspection light to a subject and a detector configured to obtain an image of the subject based on the inspection light delivered to the subject.
Jeremy Nesbitt, Joshua Knight, Timothy Russin, Vadim Palshin, Suneet Luniya, Kevin Lai, Mike Murugan, Mark Bailey
Filed: 10 Jul 16
Utility
Dual-interferometry wafer thickness gauge
21 Sep 20
A thickness measurement system may include an illumination source, a beam splitter to split illumination from the illumination source into two beams, a translation stage configured to translate a reference sample along a measurement direction, a first interferometer to generate a first interferogram between a first surface of a test sample and a first surface of the reference sample, and a second interferometer to generate a second interferogram between a second surface of the test sample and a second surface of the reference sample.
Avner Safrani
Filed: 19 Jun 19
Utility
Process condition sensing device and method for plasma chamber
14 Sep 20
A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate.
Earl Jensen, Mei Sun
Filed: 20 Dec 17
Utility
Multi-column spacing for photomask and reticle inspection and wafer print check verification
14 Sep 20
A multi-column assembly for a scanning electron microscopy (SEM) system is disclosed.
Robert Haynes, Frank Chilese, Moshe E. Preil
Filed: 23 Jan 18
Utility
Full beam metrology for X-ray scatterometry systems
14 Sep 20
Methods and systems for characterizing dimensions and material properties of semiconductor devices by full beam x-ray scatterometry are described herein.
Antonio Arion Gellineau, Thaddeus Gerard Dziura, John J. Hench, Andrei Veldman, Sergey Zalubovsky
Filed: 29 Jan 17
Utility
Multiple column per channel CCD sensor architecture for inspection and metrology
14 Sep 20
A multiple-column-per-channel image CCD sensor utilizes a multiple-column-per-channel readout circuit including connected transfer gates that alternately transfer pixel data (charges) from a group of adjacent pixel columns to a shared output circuit at high speed with low noise.
Yung-Ho Alex Chuang, Jingjing Zhang, Sharon Zamek, John Fielden, Devis Contarato, David L. Brown
Filed: 11 Jun 19
Utility
Integrated use of model-based metrology and a process model
7 Sep 20
Methods and systems for performing measurements based on a measurement model integrating a metrology-based target model with a process-based target model.
Alexander Kuznetsov, Andrei V. Shchegrov, Stilian Ivanov Pandev
Filed: 15 Dec 13
Utility
Dual mode inspector
7 Sep 20
A dual mode inspector includes an optical inspector configured to detect a defect located at a first location on a sample, a microscope configured to capture an image of the defect at the first location on the sample, and a platform that is configured to support the sample.
Steven W. Meeks, Rusmin Kudinar, Ronny Soetarman, Hung P. Nguyen, James Jianguo Xu
Filed: 30 Jun 16
Utility
Generating high resolution images from low resolution images for semiconductor applications
7 Sep 20
Methods and systems for generating a high resolution image for a specimen from a low resolution image of the specimen are provided.
Saurabh Sharma, Amitoz Singh Dandiana, Mohan Mahadevan, Chao Fang, Amir Azordegan, Brian Duffy
Filed: 25 Jun 18
Utility
Dispersion model for band gap tracking
7 Sep 20
Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented.
Natalia Malkova, Leonid Poslavsky, Ming Di, Qiang Zhao, Dawei Hu
Filed: 31 Jul 19
Utility
Method and system for generating programmed defects for use in metrology measurements
7 Sep 20
A system for generating and implementing programmed defects includes a lithography tool configured to form a multi-pattern structure including a first array pattern and a second array pattern on a sample.
Hong Xiao, Nadav Gutman
Filed: 10 Oct 17
Utility
Method and system for edge-of-wafer inspection and review
7 Sep 20
An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample.
Xinrong Jiang, Christopher Sears, Harsh Sinha, David Trease, David Kaz, Wei Ye
Filed: 19 Aug 18
Utility
Transmission small-angle X-ray scattering metrology system
7 Sep 20
Methods and systems for characterizing dimensions and material properties of semiconductor devices by transmission small angle x-ray scatterometry (TSAXS) systems having relatively small tool footprint are described herein.
Andrei V. Shchegrov, Antonio Arion Gellineau, Sergey Zalubovsky
Filed: 10 Apr 18
Utility
Recipe optimization based zonal analysis
31 Aug 20
Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with respect to respective setup parameter(s) and/or metrology metric(s).
Roie Volkovich, Michael Adel, Liran Yerushalmi, Eitan Herzel, Mengmeng Ye, Eran Amit
Filed: 10 Dec 17
Utility
Rotated boundaries of stops and targets
31 Aug 20
A scatterometry metrology system, configured to measure diffraction signals from at least one target having respective at least one measurement direction, the scatterometry metrology system having at least one field stop having edges which are slanted with respect to the at least one measurement direction.
Tzahi Grunzweig, Alexander Svizher
Filed: 28 Mar 16