3198 patents
Page 39 of 160
Utility
Structure and method of advanced LCoS back-plane having robust pixel via metallization
21 Feb 23
Processing methods may be performed to form a pixel material in a semiconductor substrate.
Lan Yu, Benjamin D. Briggs, Tyler Sherwood, Raghav Sreenivasan
Filed: 20 Nov 20
Utility
Reducing substrate surface scratching using machine learning
21 Feb 23
Methods and systems for reducing substrate particle scratching using machine learning are provided.
Kartik B Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
Filed: 28 Jun 21
Utility
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21 Feb 23
A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body.
Phillip A. Criminale, Zhiqiang Guo, Philip A. Kraus, Andrew Myles, Martin Perez-Guzman
Filed: 2 Jun 20
Utility
1693 pnwlmvz0plhkg6do5tqwlkhz
14 Feb 23
During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system.
Benjamin Cherian, Jun Qian, Nicholas Wiswell, Dominic J. Benvegnu, Boguslaw A. Swedek, Thomas H. Osterheld
Filed: 28 Aug 19
Utility
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14 Feb 23
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly.
Surajit Kumar, Hui Chen, Chih Chung Chou, Shou-Sung Chang
Filed: 17 Jul 20
Utility
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14 Feb 23
A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface.
Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
Filed: 1 Feb 22
Utility
bxbmulmbgc2byf0d1hfzfek01fnalgzo0of515 f2drciqv95qfh5
14 Feb 23
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller.
Sivakumar Dhandapani, Sameer Deshpande, Jason Garcheung Fung
Filed: 6 Mar 19
Utility
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14 Feb 23
Apparatus and methods for lifting loads are described.
Abhishek Chowdhury, Kevin Griffin, Kenneth Brian Doering, Santhoshkumar Doddegowdanapalya Nanjundegowda, Somashekhar Kosthi, Abhijit Ghosh
Filed: 8 Aug 20
Utility
s1wxsox383r69qib9f5x803othm5di2gj68k4wgv 1nfbsv7
14 Feb 23
Methods and apparatus for depositing material on a continuous substrate are provided herein.
David Masayuki Ishikawa, Brian H. Burrows
Filed: 2 Jun 17
Utility
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14 Feb 23
An article includes a body having a plasma-sprayed ceramic coating on a surface thereof.
Jennifer Y. Sun, Yikai Chen, Biraja Prasad Kanungo
Filed: 19 Feb 20
Utility
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14 Feb 23
Ampoules for a semiconductor manufacturing precursors and methods of use are described.
Carl White, Mohith Verghese, David Marquardt, Jose Alexandro Romero
Filed: 8 Dec 20
Utility
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14 Feb 23
PECVD methods for depositing a film at a low deposition rate comprising intermittent activation of the plasma are disclosed.
Shishi Jiang, Pramit Manna, Abhijit Basu Mallick
Filed: 8 Jun 20
Utility
k6m1mip500g2tal5c7j3tx2rgu5c6 y6zo87ibdya718a9d1psr3vvmoyr
14 Feb 23
An electroplating system has a vessel assembly holding an electrolyte.
Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
Filed: 24 Jan 22
Utility
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14 Feb 23
Implementations described herein generally relate to flexible display devices and cover lens assemblies with flexible cover lens.
Manivannan Thothadri, Ali Salehpour, John D. Busch, Robert Jan Visser
Filed: 8 May 19
Utility
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14 Feb 23
The present technology includes improved gas distribution designs for forming uniform plasmas during semiconductor processing operations or for treating the interior of semiconductor processing chambers.
Saravjeet Singh, Kenneth D. Schatz, Alan Tso, Marlin Wijekoon, Dimitri Kioussis
Filed: 25 Jan 21
Utility
0m4zbv9gk9osv6jqzf2b5y9wji0a9ul61w
14 Feb 23
Embodiments of deposition rings for use in a process chamber are provided herein.
Kirankumar Neelasandra Savandaiah, Jiao Song, David Gunther, Irena H. Wysok, Anthony Chih-Tung Chan
Filed: 31 Jul 20
Utility
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14 Feb 23
Embodiments of process kits are provided herein.
David Gunther, Siew Kit Hoi, Kirankumar Neelasandra Savandaiah
Filed: 18 Jun 21
Utility
gbkrhv1pnmpuqobkbqeg9127w4xff531u0l16t5j4ega4tbp0u
14 Feb 23
Embodiments described herein provide for post deposition anneal of a substrate, having an amorphous carbon layer deposited thereon, to desirably reduce variations in local stresses thereacross.
Bhargav S. Citla, Mei-Yee Shek, Srinivas D. Nemani
Filed: 4 Mar 21
Utility
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14 Feb 23
Embodiments described herein relate to methods forming optical device structures.
Ludovic Godet, Rutger Meyer Timmerman Thijssen
Filed: 10 Jun 21
Utility
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14 Feb 23
The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space.
Jacob Newman, Andrew J. Constant, Michael R. Rice, Paul B. Reuter, Shay Assaf, Sushant S. Koshti
Filed: 3 Aug 21