3198 patents
Page 35 of 160
Utility
Capacitive method of detecting wafer chucking and de-chucking
21 Mar 23
Exemplary support assemblies may include an electrostatic chuck body defining a support surface that defines a substrate seat.
Job George Konnoth Joseph, Syam Sundeep Boosa, Gopu Krishna, Rupankar Choudhury
Filed: 22 Mar 21
Utility
Methods and apparatus for cleaving of semiconductor substrates
21 Mar 23
Methods and apparatus for cleaving a substrate in a semiconductor chamber.
Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada, Clinton Goh
Filed: 11 Apr 21
Utility
k3s4w56bpupks3aimj2onnfwry7qd2br84yiijafc9fuudu57
21 Mar 23
An imaging system and a method of creating composite images are provided.
Jinxin Fu, Yongan Xu, Ludovic Godet, Naamah Argaman, Robert Jan Visser
Filed: 27 Apr 20
Utility
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21 Mar 23
Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display.
Ji-young Choung, Dieter Haas, Yu Hsin Lin, Jungmin Lee, Seong Ho Yoo, Si Kyoung Kim
Filed: 5 Mar 21
Utility
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14 Mar 23
In some embodiments, a sonic cleaning system includes a tank configured to receive a liquid that enables propagation of sonic waves and a cylindrical insert located within the tank.
Michael J. Coughlin, Jianqi Wang
Filed: 6 Jan 20
Utility
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14 Mar 23
Methods and systems for the production and delivery of lithium metal of high purity are provided herein.
Jean Delmas, Bernard Frey
Filed: 7 Dec 21
Utility
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14 Mar 23
Methods for depositing an amorphous carbon layer onto a substrate, including over previously formed layers on the substrate, use a plasma-enhanced chemical vapor deposition (PECVD) process.
Eswaranand Venkatasubramanian, Yang Yang, Pramit Manna, Kartik Ramaswamy, Takehito Koshizawa, Abhijit B. Mallick
Filed: 16 Oct 18
Utility
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14 Mar 23
Methods for depositing protective coatings on aerospace components are provided and include sequentially exposing the aerospace component to a chromium precursor and a reactant to form a chromium-containing layer on a surface of the aerospace component by an atomic layer deposition process.
Thomas Knisley, Mark Saly, David Alexander Britz, David Thompson
Filed: 26 May 21
Utility
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14 Mar 23
An electronic device manufacturing system includes: a gas supply; a mass flow controller (MFC) coupled to the gas supply; an inlet coupled to the MFC; an outlet; a control volume serially coupled to the inlet to receive a gas flow; and a flow restrictor serially coupled to the control volume and the outlet.
Zhiyuan Ye, Justin Hough, Marcel E. Josephson
Filed: 30 Nov 20
Utility
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14 Mar 23
Apparatus and methods for measuring surface topography are described.
Weimin Li, Wen Xiao, Vibhu Jindal, Sanjay Bhat
Filed: 18 May 22
Utility
gr1nw7jzp3yk9gvzrbfa9fzg7gkor3gyhu4459ecn1lwhjdh8l6n7czovnkn
14 Mar 23
Methods and architectures for refreshing memory elements in a memory array may initialize a reference array that stores each of the possible values stored in the memory element.
Christophe J. Chevallier
Filed: 23 Apr 21
Utility
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14 Mar 23
Embodiments of the present disclosure generally relate to methods and systems for cleaning a surface of a substrate.
Schubert S. Chu, Errol Antonio C. Sanchez
Filed: 18 Sep 20
Utility
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14 Mar 23
Exemplary methods of forming a semiconductor structure may include forming a layer of metal on a semiconductor substrate.
Joshua S. Holt, Lan Yu, Tyler Sherwood, Archana Kumar, Nicolas Louis Gabriel Breil, Siddarth Krishnan
Filed: 23 Nov 20
Utility
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7 Mar 23
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface.
Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj, Andrew Siordia
Filed: 21 Jun 19
Utility
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7 Mar 23
A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection.
Mayu Felicia Yamamura, Jason Garcheung Fung, Daniel Redfield, Rajeev Bajaj, Hou T. Ng
Filed: 17 Sep 21
Utility
3z7yxvf0pdqcgf838b3mj08jquyvtbadzfto6u1wcozo3l6xy6nk7hhzdy
7 Mar 23
Embodiments described herein relate to gas line systems with a multichannel splitter spool.
Madhu Santosh Kumar Mutyala, Sanjay G. Kamath, Deenesh Padhi, Arkajit Roy Barman
Filed: 21 Jan 20
Utility
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7 Mar 23
Exemplary semiconductor processing chambers may include a chamber body including sidewalls and a base.
Venkata Sharat Chandra Parimi, Satish Radhakrishnan, Xiaoquan Min, Sarah Michelle Bobek, Sungwon Ha, Prashant Kumar Kulshreshtha, Vinay Prabhakar
Filed: 27 Dec 19
Utility
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7 Mar 23
An ion source having an electrically isolated extraction plate is disclosed.
Svetlana B. Radovanov, Bon-Woong Koo, Alexandre Likhanskii
Filed: 15 Jan 21
Utility
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7 Mar 23
A deposition system, and a method of operation thereof, includes: a cathode; a shroud below the cathode; a rotating shield below the cathode for exposing the cathode through the shroud and through a shield hole of the rotating shield; and a rotating pedestal for producing a material to form a carrier over the rotating pedestal, wherein the material having a non-uniformity constraint of less than 1% of a thickness of the material and the cathode having an angle between the cathode and the carrier.
Anantha K. Subramani, Deepak Jadhav, Ashish Goel, Hanbing Wu, Prashanth Kothnur, Chi Hong Ching
Filed: 18 Oct 21
Utility
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7 Mar 23
Embodiments of process shield for use in process chambers are provided herein.
Kirankumar Neelasandra Savandaiah, Shane Lavan, Sundarapandian Ramalinga Vijayalakshmi Reddy, Randal Dean Schmieding, Yong Cao
Filed: 14 Dec 20