3198 patents
Page 38 of 160
Utility
Machine learning based smart process recipe builder to improve azimuthal flow and thickness uniformity
21 Feb 23
Methods, software systems and processes to develop surrogate model-based optimizers for controlling and optimizing flow and pressure of purges between a showerhead and a heater having a substrate support to control non-uniformity inherent in a processing chamber due to geometric configuration and process regimes.
Dhritiman Subha Kashyap, Chaowei Wang, Kartik Shah, Kevin Griffin, Karthik Ramanathan, Hanhong Chen, Joseph AuBuchon, Sanjeev Baluja
Filed: 7 Apr 21
Utility
Semiconductor processing tools with improved performance by use of hybrid learning models
21 Feb 23
Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes.
Stephen Moffatt, Sheldon R. Normand, Dermot P. Cantwell
Filed: 30 Jul 20
Utility
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21 Feb 23
Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film.
Srinivas Gandikota, Tza-Jing Gung, Samuel E. Gottheim, Timothy Joseph Franklin, Pramit Manna, Eswaranand Venkatasubramanian, Edward Haywood, Stephen C. Garner, Adam Fischbach
Filed: 1 Nov 19
Utility
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21 Feb 23
A method of reducing reflected Radio Frequency (RF) power in substrate processing chambers may include accessing input parameters for a processing chamber that are derived from a recipe to perform a process on a substrate.
Soonwook Jung, Kenneth D. Schatz
Filed: 22 Nov 20
Utility
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21 Feb 23
The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.
Kartik Ramaswamy, Igor Markovsky, Zhigang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
Filed: 21 Jun 21
Utility
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21 Feb 23
A chamber component comprises a body and a plasma sprayed ceramic coating on the body.
Jennifer Y. Sun, Biraja P. Kanungo, Dmitry Lubomirsky
Filed: 17 May 18
Utility
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21 Feb 23
A substrate pedestal includes a thermally conductive substrate support including a mesh, a thermally conductive shaft including a plurality of conductive rods therein, each conductive rod having a first end and a second end, and a sensor.
Viren Kalsekar, Vinay K. Prabhakar, Venkata Sharat Chandra Parimi
Filed: 10 Mar 20
Utility
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21 Feb 23
Provided herein are approaches for performing electrodynamic mass analysis with a radio frequency (RF) biased ion source to reduce ion beam energy spread.
Alexandre Likhanskii, Joseph C. Olson, Frank Sinclair, Peter F. Kurunczi
Filed: 3 Nov 20
Utility
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21 Feb 23
The present disclosure provides systems and methods for processing channel structures of substrates that include positioning the substrate in a first processing chamber having a first processing volume being in fluid communication with a plasma source.
Xinming Zhang, Abhilash J. Mayur, Shashank Sharma, Norman L. Tam, Matthew Spuller, Zeqiong Zhao
Filed: 16 Dec 20
Utility
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21 Feb 23
Memory devices and methods of manufacturing memory devices are provided.
Chang Seok Kang, Tomohiko Kitajima, Sung-Kwan Kang
Filed: 13 Jan 21
Utility
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21 Feb 23
Methods and apparatus for processing a substrate are provided herein.
Chien-Kang Hsiung, Yuichi Wada, Glen T. Mori
Filed: 27 Jul 20
Utility
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21 Feb 23
Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface.
Jian Li, Zheng J. Ye, Dmitry A. Dzilno, Juan Carlos Rocha-Alvarez
Filed: 21 Oct 20
Utility
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21 Feb 23
Described are methods for controlling the doping of metal nitride films such as TaN, TiN and MnN.
Annamalai Lakshmanan, Ben-Li Sheu, Guodan Wei, Nicole Lundy, Paul F. Ma
Filed: 7 Jan 21
Utility
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21 Feb 23
Described are microelectronic devices comprising a dielectric layer formed on a substrate, a feature comprising a gap defined in the dielectric layer, a barrier layer on the dielectric layer, a two metal liner film on the barrier layer and a gap fill metal on the two metal liner.
Gang Shen, Feng Chen, Yizhak Sabba, Tae Hong Ha, Xianmin Tang, Zhiyuan Wu, Wenjing Xu
Filed: 23 Jun 20
Utility
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21 Feb 23
Memory devices incorporating bridged word lines are described.
Chang Seok Kang, Tomohiko Kitajima, Nitin K. Ingle, Sung-Kwan Kang
Filed: 27 Jan 21
Utility
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21 Feb 23
Methods for DRAM device with a buried word line are described.
Yixiong Yang, Jacqueline S. Wrench, Yong Yang, Srinivas Gandikota, Annamalai Lakshmanan, Joung Joo Lee, Feihu Wang, Seshadri Ganguli
Filed: 1 Jun 21
Utility
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21 Feb 23
Separators, high performance electrochemical devices, such as, batteries and capacitors, including the aforementioned separators, systems and methods for fabricating the same.
Connie P. Wang, Wen Si, Yin Let Sim, Torsten Dieter, Roland Trassl, Subramanya P. Herle, Christoph Daube, Jian Zhu, James Cushing
Filed: 21 Aug 18
Utility
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21 Feb 23
Apparatus and methods for providing high velocity gas flow showerheads for deposition chambers are described.
Jared Ahmad Lee, Sanjeev Baluja, Joseph AuBuchon, Dhritiman Subha Kashyap, Michael Rice
Filed: 3 Sep 21
Utility
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21 Feb 23
Molybdenum(0) coordination complexes comprising an arene ligand and one or more neutral ligands which coordinate to the metal center by carbon, nitrogen or phosphorous are described.
Andrea Leoncini, Paul Mehlmann, Nemanja Dordevic, Han Vinh Huynh, Doreen Wei Ying Yong
Filed: 12 Jan 21
Utility
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21 Feb 23
Aspects of the present disclosure relate generally to pedestals, components thereof, and methods of using the same for substrate processing chambers.
Sarah Michelle Bobek, Venkata Sharat Chandra Parimi, Prashant Kumar Kulshreshtha, Vinay K. Prabhakar, Kwangduk Douglas Lee, Sungwon Ha, Jian Li
Filed: 16 Dec 19