3198 patents
Page 36 of 160
Utility
Systems and methods for depositing low-κdielectric films
7 Mar 23
Embodiments of the semiconductor processing methods to form low-κ films on semiconductor substrates are described.
Bo Xie, Ruitong Xiong, Sure K. Ngo, Kang Sub Yim, Yijun Liu, Li-Qun Xia
Filed: 15 Sep 20
Utility
Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process
7 Mar 23
Electrostatic chucks with reduced current leakage and methods of dicing semiconductor wafers are described.
Sai Abhinand, Michael Sorensen, Karthik Elumalai, Dimantha Rajapaksa, Cheng Sun, James S. Papanu, Gaurav Mehta, Eng Sheng Peh, Sri Thirunavukarasu, Onkara Korasiddaramaiah
Filed: 10 Dec 19
Utility
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7 Mar 23
A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source.
Bhaskar Prasad, Kirankumar Neelasandra Savandaiah, Srinivasa Rao Yedla, Nitin Bharadwaj Satyavolu, Thomas Brezoczky
Filed: 9 Sep 20
Utility
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7 Mar 23
Replaceable contact pads of end effectors are provided.
Whitney Kroetz, Damon Keith Cox, Leon Volfovski, Jeffrey C. Hudgens, Balamurali Murugaraj
Filed: 24 Feb 20
Utility
oc3i2uufz36oq09hv7q9cd8220mvw7z0ok7s2b 4q5mns3vqcuinwf
7 Mar 23
Embodiments of the present disclosure generally relate to a layer stack including a high K dielectric layer formed over a first dielectric layer and a metal electrode.
Xiangxin Rui, Soo Young Choi, Shinichi Kurita, Yujia Zhai, Lai Zhao
Filed: 27 May 21
Utility
m5gqw nuvg71ssiz5mx4p8mrhjs6duu3mwzy3vm828bud491
7 Mar 23
The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.
Daniele Gislon, Luigi De Santi, Thomas Micheletti, Andrea Baccini, Mirko Galassi, Roberto Boscheratto
Filed: 20 Jul 20
Utility
m6cu7jy1me37eo528ih134
7 Mar 23
A superconducting device includes a substrate, a metal oxide or metal oxynitride seed layer on the substrate, and a metal nitride superconductive layer disposed directly on the seed layer.
Zihao Yang, Mingwei Zhu, Shriram Mangipudi, Mohammad Kamruzzaman Chowdhury, Shane Lavan, Zhebo Chen, Yong Cao, Nag B. Patibandla
Filed: 17 Feb 21
Utility
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7 Mar 23
Process assemblies and cable management assemblies for managing cables in tight envelopes.
Akshay Gunaji, Uday Pai, Timothy J. Roggenbuck, Sanjeev Baluja, Kalesh Panchaxari Karadi, Tejas Ulavi
Filed: 1 Sep 20
Utility
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7 Mar 23
A web coating platform for depositing molten metal on flexible substrates is provided.
Bernard Frey, Subramanya P. Herle
Filed: 3 Jun 22
Utility
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7 Mar 23
Methods of removing native oxide layers and depositing dielectric layers having a controlled number of active sites on MEMS devices for biological applications are disclosed.
Ranga Rao Arnepalli, Colin Costano Neikirk, Yuriy Melnik, Suresh Chand Seth, Pravin K. Narwankar, Sukti Chatterjee, Lance A. Scudder
Filed: 21 Sep 18
Utility
r1rldvpx71sqyx4wk7pe22tbi0ketu81tiw8bp9q5l2gyelt
7 Mar 23
A web coating platform for depositing molten metal on flexible substrates is provided.
Bernard Frey, Subramanya P. Herle
Filed: 3 Jun 22
Utility
vtaawxmn4smpdnigz18daz50olmeu0vg6
7 Mar 23
Apparatus for processing a substrate are provided herein.
Faruk Gungor, Dien-Yeh Wu, Joel M. Huston, Mei Chang, Xiaoxiong Yuan, Kazuya Daito, Avgerinos V. Gelatos, Takashi Kuratomi, Yu Chang, Bin Cao
Filed: 12 Sep 17
Utility
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7 Mar 23
The present disclosure relates to a lid assembly apparatus and related methods for substrate processing chambers.
Hanish Kumar Panavalappil Kumarankutty, Prashant A. Desai, Diwakar N. Kedlaya, Sumit Agarwal, Vidyadharan Srinivasa Murthy Bangalore, Truong Nguyen, Zubin Huang
Filed: 26 Feb 20
Utility
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7 Mar 23
Connector assemblies for holding two tubes together and methods of use are described.
Muhannad Mustafa, Muhammad M. Rasheed
Filed: 23 Jan 20
Utility
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7 Mar 23
Analyzing a buried layer on a sample includes milling a spot on the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along a sidewall of the spot.
Alexander Mairov, Gal Bruner, Yehuda Zur
Filed: 19 Jul 21
Utility
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7 Mar 23
A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed.
Vibhu Jindal, Wen Xiao, Sanjay Bhat
Filed: 16 Dec 21
Utility
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7 Mar 23
Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.
Uwe Hollerbach, Thomas L. Laidig
Filed: 28 Aug 19
Utility
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7 Mar 23
Embodiments disclosed herein include a method for auto-tuning a system.
Mauro Cimino, Arkaprava Dan, Sanjeev Baluja
Filed: 3 Sep 21
Utility
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28 Feb 23
Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions.
Paul Z. Wirth, Charles T. Carlson, Jason M. Schaller
Filed: 13 Sep 21
Utility
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28 Feb 23
One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties.
Mats Larsson, Kevin A. Papke, Chirag Shaileshbhai Khairnar, Rajasekhar Patibandla, Karthikeyan Balaraman, Balamurugan Ramasamy, Kartik Shah, Umesh M. Kelkar
Filed: 14 Feb 20