2134 patents
Page 5 of 107
Utility
Semiconductor Apparatus and Method for Manufacturing Semiconductor Apparatus
16 Nov 23
A semiconductor apparatus includes an insulating substrate having a circuit board electrically connected to a semiconductor device, and a terminal member having a main terminal and a connection terminal bonded to the circuit board.
Yoshihiko KAWAKAMI
Filed: 15 Mar 23
Utility
Semiconductor Device and Method of Manufacturing the Same
16 Nov 23
Provided is a method of manufacturing a semiconductor device that can lead a surface of sinter paste to be flattened before depositing a power semiconductor chip so as to achieve high-density packaging.
Takashi SAITO
Filed: 27 Jul 23
Utility
Semiconductor Device and Method for Determining Deterioration of Semiconductor Device
16 Nov 23
A semiconductor device includes a first input conductive plate on which a plurality of first semiconductor chips arranged in a first direction, a first output conductive plate extending in the first direction and being provided adjacent to the first input conductive plate, a case having first to fourth side walls for accommodating the first input conductive plate and the first output conductive plate, first main current wiring members, each of which connects one of the first output electrodes to a front surface of the first output conductive plate, a first detection terminal disposed in the first side wall, and a first detection wiring member connecting the front surface of the first output conductive plate to the first detection terminal.
Motohito HORI, Yoshinari IKEDA, Takaaki TANAKA, Qichen WANG
Filed: 9 Mar 23
Utility
Semiconductor device and manufacturing method thereof
14 Nov 23
A manufacturing method of a semiconductor device includes sealing a metal plate on which a semiconductor chip and a control IC are mounted by injecting molding resin raw material into a cavity from an inlet, filling the cavity with the molding resin raw material, and discharging excessive molding resin raw material from an outlet.
Nobuhiro Higashi, Akira Furuta
Filed: 30 Aug 21
Utility
Semiconductor module
14 Nov 23
A semiconductor module including first and second transistors coupled in parallel to a first line receiving a power supply voltage, a driver circuit configured to apply, to a second line, a first voltage to turn on the first and second transistors in response to an input signal, a first resistor having two ends respectively coupled to the second line and a control electrode of the second transistor, a second resistor having two end respectively coupled to one of the two ends of the first resistor and a control electrode of the first transistor, a third resistor coupled to the second transistor, a third transistor coupled to one of the two ends of the second resistor, and a terminal coupled to the first to third transistors, the third resistor, and a load, such that the load receives a current from the first transistor.
Shigemi Miyazawa
Filed: 22 Jun 22
Utility
Semiconductor device
14 Nov 23
A semiconductor device includes pads arrayed between a region where a transistor portion or a diode portion is disposed and a first end side on an upper surface of a semiconductor substrate, and a gate runner portion that transfers a gate voltage to the transistor portion.
Tetsutaro Imagawa
Filed: 16 Feb 22
Utility
Semiconductor Device and Manufacturing Method
9 Nov 23
Provided is a semiconductor device comprising a semiconductor substrate containing oxygen.
Tomoyuki OBATA
Filed: 14 Jul 23
Utility
Semiconductor Device and Manufacturing Method Thereof
9 Nov 23
A semiconductor device including a semiconductor substrate having an upper surface and a lower surface is provided.
Yasunori AGATA, Takashi YOSHIMURA, Hiroshi TAKISHITA, Misaki MEGURO, Naoko KODAMA, Yoshihiro IKURA, Seiji NOGUCHI, Yuichi HARADA, Yosuke SAKURAI
Filed: 20 Jul 23
Utility
Semiconductor Device
9 Nov 23
A semiconductor device includes a semiconductor substrate having a first conductivity type drift region and a second conductivity type base region above the drift region, trench portions at an upper surface of the semiconductor substrate arrayed parallel to one another, each of them penetrating the base region, and mesa portions between respective trench portions.
Tatsuya NAITO
Filed: 18 Jul 23
Utility
Semiconductor device
7 Nov 23
Provided is a semiconductor device, comprising: a semiconductor substrate; a transistor portion including an emitter region on the top of the semiconductor substrate; a diode portion including a cathode region on the bottom of the semiconductor substrate and a second conductivity type overlap region in a region other than the cathode region and arranged alongside to the transistor portion a preset arrangement direction on the top of the semiconductor substrate; and an interlayer dielectric film provided between the semiconductor substrate and an emitter electrode and including a contact hole for connecting the emitter electrode and the diode portion.
Yosuke Sakurai, Seiji Noguchi, Toru Ajiki
Filed: 21 Oct 22
Utility
Semiconductor device
7 Nov 23
Provided is a semiconductor device having transistor and diode sections.
Tomoyuki Obata, Soichi Yoshida, Tetsutaro Imagawa, Seiji Momota
Filed: 17 Jan 22
Utility
Semiconductor device
7 Nov 23
A semiconductor device is provided, including: a semiconductor substrate; a first-conductivity-type drift region provided in the semiconductor substrate; a trench portion provided from an upper surface of the semiconductor substrate to an inside of the semiconductor substrate, and extending in a predetermined extending direction in a plane of the upper surface of the semiconductor substrate; a mesa portion provided in contact with the trench portion in an array direction orthogonal to the extending direction; a second-conductivity-type base region provided in the mesa portion above the drift region and in contact with the trench portion; and a second-conductivity-type floating region provided in the mesa portion below the base region, in contact with the trench portion, and provided in at least a part of the mesa portion in the array direction.
Tatsuya Naito
Filed: 15 May 22
Utility
Semiconductor Module
2 Nov 23
A semiconductor module includes a multilayer substrate having a main wiring layer formed therein, a main current flowing in the main wiring layer when the semiconductor device is turned on, a first and second semiconductor elements, each of which has a top electrode on a top surface thereof and a bottom electrode on a bottom surface thereof, and is disposed on a top surface of the main wiring layer to which the bottom electrode is conductively connected, a metal plate having an end portion, a bottom surface of the end portion being conductively connected to the top electrode of the first semiconductor element, and a control board including an insulating plate disposed on the top surface of the end portion and a control wiring layer disposed on a top surface of the insulating plate for controlling turning on and off of the first and second semiconductor elements.
Tadahiko SATO, Kenichiro SATO
Filed: 7 Jul 23
Utility
Semiconductor Device
2 Nov 23
A semiconductor device includes a main element and a sensing element each including a drift region of a first conductivity-type, a well region of a second conductivity-type provided at an upper part of the drift region, a first main electrode region of the first conductivity-type provided at an upper part of the well region, a gate electrode buried with a gate insulating film interposed in a trench, and a main electrode connected to the first main electrode region, the isolation region including an element-isolation insulating film provided on a top surface of a semiconductor base body interposed between the well regions, and a first wire provided on a top surface of the element-isolation insulating film and electrically connected to the main electrode of the main element.
Yuya ABE
Filed: 24 Jan 23
Utility
Motor Drive Device, Motor Driving Method, and Non-transitory Computer Readable Medium
2 Nov 23
A motor drive device is provided which includes: a first drive unit configured to drive a plurality of first motor phases; a second drive unit configured to drive a plurality of second motor phases; a common sensor configured to detect a total current flowing through a phase pair obtained by selecting one phase from the plurality of first motor phases and one phase from the plurality of second motor phases; at least one first motor phase sensor and at least one second motor phase sensor configured to detect each current flowing through each phase not included in the phase pair among the plurality of first motor phases and the plurality of second motor phases, respectively; and a drive control unit configured to control drive amounts of the first drive unit and the second drive unit for the plurality of first motor phases and the plurality of second motor phases.
Masaki HIRAKATA
Filed: 23 Jan 23
Utility
Semiconductor Device
26 Oct 23
A semiconductor device including: an output element connected to a load and configured to perform switching to operate the load; a drive circuit configured to output a drive signal to thereby cause the output element to perform the switching; an external terminal configured to be connected to a constant current source that is external to the semiconductor device, and to receive a constant current from the constant current source; a temperature sensor connected to the external terminal, and configured to operate with the constant current, detect a temperature of the output element, and output a temperature detection value; a temperature state detection circuit configured to output a temperature state of the output element, based on a result of comparing the temperature detection value with a reference threshold; and an abnormal level notification circuit configured to send out a notification upon determining that the temperature state is at an abnormal level.
Naoki SHIMIZU
Filed: 28 Mar 23
Utility
Power Conversion Device
26 Oct 23
A power conversion device includes a power converter, a power converter housing, an output terminal, a current sensor, and a terminal block.
Toshiaki AZUMA
Filed: 10 Apr 23
Utility
Semiconductor Device and Semiconductor Module
26 Oct 23
A semiconductor device includes a first semiconductor module and a second semiconductor module that are connected in parallel between the positive terminal and the negative terminal of a direct-current power source.
Seiki IGARASHI
Filed: 22 Feb 23
Utility
Power Converter
26 Oct 23
A power converter includes a semiconductor module, a capacitor module, a control board, and an insulating plate.
Toshiaki AZUMA
Filed: 10 Apr 23
Utility
Semiconductor Device
26 Oct 23
A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other.
Yoshihiro KODAIRA, Yusuke SEKINO, Taichi ITOH
Filed: 13 Mar 23