1128 patents
Page 4 of 57
Utility
Semiconductor Device and Manufacturing Method Thereof
9 Nov 23
A semiconductor device including a semiconductor substrate having an upper surface and a lower surface is provided.
Yasunori AGATA, Takashi YOSHIMURA, Hiroshi TAKISHITA, Misaki MEGURO, Naoko KODAMA, Yoshihiro IKURA, Seiji NOGUCHI, Yuichi HARADA, Yosuke SAKURAI
Filed: 20 Jul 23
Utility
Semiconductor Device
9 Nov 23
A semiconductor device includes a semiconductor substrate having a first conductivity type drift region and a second conductivity type base region above the drift region, trench portions at an upper surface of the semiconductor substrate arrayed parallel to one another, each of them penetrating the base region, and mesa portions between respective trench portions.
Tatsuya NAITO
Filed: 18 Jul 23
Utility
Semiconductor Device and Manufacturing Method
9 Nov 23
Provided is a semiconductor device comprising a semiconductor substrate containing oxygen.
Tomoyuki OBATA
Filed: 14 Jul 23
Utility
Semiconductor Module
2 Nov 23
A semiconductor module includes a multilayer substrate having a main wiring layer formed therein, a main current flowing in the main wiring layer when the semiconductor device is turned on, a first and second semiconductor elements, each of which has a top electrode on a top surface thereof and a bottom electrode on a bottom surface thereof, and is disposed on a top surface of the main wiring layer to which the bottom electrode is conductively connected, a metal plate having an end portion, a bottom surface of the end portion being conductively connected to the top electrode of the first semiconductor element, and a control board including an insulating plate disposed on the top surface of the end portion and a control wiring layer disposed on a top surface of the insulating plate for controlling turning on and off of the first and second semiconductor elements.
Tadahiko SATO, Kenichiro SATO
Filed: 7 Jul 23
Utility
Semiconductor Device
2 Nov 23
A semiconductor device includes a main element and a sensing element each including a drift region of a first conductivity-type, a well region of a second conductivity-type provided at an upper part of the drift region, a first main electrode region of the first conductivity-type provided at an upper part of the well region, a gate electrode buried with a gate insulating film interposed in a trench, and a main electrode connected to the first main electrode region, the isolation region including an element-isolation insulating film provided on a top surface of a semiconductor base body interposed between the well regions, and a first wire provided on a top surface of the element-isolation insulating film and electrically connected to the main electrode of the main element.
Yuya ABE
Filed: 24 Jan 23
Utility
Motor Drive Device, Motor Driving Method, and Non-transitory Computer Readable Medium
2 Nov 23
A motor drive device is provided which includes: a first drive unit configured to drive a plurality of first motor phases; a second drive unit configured to drive a plurality of second motor phases; a common sensor configured to detect a total current flowing through a phase pair obtained by selecting one phase from the plurality of first motor phases and one phase from the plurality of second motor phases; at least one first motor phase sensor and at least one second motor phase sensor configured to detect each current flowing through each phase not included in the phase pair among the plurality of first motor phases and the plurality of second motor phases, respectively; and a drive control unit configured to control drive amounts of the first drive unit and the second drive unit for the plurality of first motor phases and the plurality of second motor phases.
Masaki HIRAKATA
Filed: 23 Jan 23
Utility
Semiconductor Device and Semiconductor Module
26 Oct 23
A semiconductor device includes a first semiconductor module and a second semiconductor module that are connected in parallel between the positive terminal and the negative terminal of a direct-current power source.
Seiki IGARASHI
Filed: 22 Feb 23
Utility
Power Conversion Device
26 Oct 23
A power conversion device includes a power converter, a power converter housing, an output terminal, a current sensor, and a terminal block.
Toshiaki AZUMA
Filed: 10 Apr 23
Utility
Semiconductor Device
26 Oct 23
A semiconductor device including: an output element connected to a load and configured to perform switching to operate the load; a drive circuit configured to output a drive signal to thereby cause the output element to perform the switching; an external terminal configured to be connected to a constant current source that is external to the semiconductor device, and to receive a constant current from the constant current source; a temperature sensor connected to the external terminal, and configured to operate with the constant current, detect a temperature of the output element, and output a temperature detection value; a temperature state detection circuit configured to output a temperature state of the output element, based on a result of comparing the temperature detection value with a reference threshold; and an abnormal level notification circuit configured to send out a notification upon determining that the temperature state is at an abnormal level.
Naoki SHIMIZU
Filed: 28 Mar 23
Utility
Semiconductor Device
26 Oct 23
A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other.
Yoshihiro KODAIRA, Yusuke SEKINO, Taichi ITOH
Filed: 13 Mar 23
Utility
Semiconductor Device
26 Oct 23
A wire protecting part partially encloses a first lead frame and a second lead frame and has an enclosing surface from which the first and second lead frames protrude.
Rikihiro MARUYAMA, Yoshinori ODA, Takahito HARADA
Filed: 30 Mar 23
Utility
Power Converter
26 Oct 23
A power converter includes a semiconductor module, a capacitor module, a control board, and an insulating plate.
Toshiaki AZUMA
Filed: 10 Apr 23
Utility
Semiconductor Unit
26 Oct 23
A laminated wiring has a first conductor which connects first terminals of one or more capacitors and each positive terminal of a plurality of semiconductor modules, a second conductor which connects second terminals of the one or more capacitors and each negative terminal of the plurality of semiconductor modules, and an insulator.
Seiki IGARASHI
Filed: 24 Mar 23
Utility
Power Conversion Device
26 Oct 23
A power conversion device includes a power converter and a housing to be attached to a motor and to house the power converter.
Toshiaki AZUMA
Filed: 10 Apr 23
Utility
Semiconductor Module
26 Oct 23
A semiconductor module includes a mounting substrate, a transistor mounted on the mounting substrate, a housing configured to house a semiconductor element, a first sealing layer filled in a space inside the housing to seal the transistor, a second sealing layer of a resin material softer than the first sealing layer and layered on the first sealing layer, and a wire electrically connected to the transistor, in which the wire includes a first portion covered with the first sealing layer and a second portion covered with the second sealing layer.
Nobuharu KUSAKARI
Filed: 22 Feb 23
Utility
Semiconductor Apparatus
19 Oct 23
A semiconductor apparatus includes: a base, an insulating substrate arranged on the base, a semiconductor element arranged on the insulating substrate, a case joined to the base and housing the semiconductor element, and a sealing material supplied in the case.
Tadahiko SATO
Filed: 24 Feb 23
Utility
Semiconductor Device
19 Oct 23
A semiconductor device includes: a baseplate; an insulating substrate on the baseplate; a semiconductor element on the insulating substrate; a case bonded to the baseplate by an adhesive, the case surrounding a space in which the semiconductor element is positioned; and an encapsulating material filling the space surrounded by the case, in which, the case includes a claw, the claw includes: a protrusion protruding from an inner wall surface of the case; and a hook inclined from the protrusion, a space being sandwiched between the hook and the inner wall surface of the case.
Taisuke FUKUDA
Filed: 22 Feb 23
Utility
Semiconductor Device and Semiconductor Device Manufacturing Method
19 Oct 23
A semiconductor device, including a cooling body, a semiconductor unit including a wiring portion electrically connected to a semiconductor chip, and a sealing member sealing the entire semiconductor unit over a cooling surface of the cooling body.
Takafumi YAMADA
Filed: 29 Mar 23
Utility
Semiconductor Module
19 Oct 23
A semiconductor module includes a laminate substrate including an insulating plate and first and second circuit boards on an upper surface of the insulating plate, the first semiconductor device on an upper surface of the first circuit board, a first main terminal, and a first metal wiring board that electrically connects the first semiconductor device to the first main terminal.
Tadahiko SATO
Filed: 28 Feb 23
Utility
Semiconductor Device
19 Oct 23
Provided is a semiconductor device including a bonding layer made from sintered material and having a configuration capable of avoiding a variation in life span.
Takashi SAITO
Filed: 26 Jun 23