7578 patents
Page 44 of 379
Utility
Process kit with adjustable tuning ring for edge uniformity control
15 Aug 23
Process kits, processing chambers, and methods for processing a substrate are provided.
Yogananda Sarode Vishwanath
Filed: 25 Sep 20
Utility
Ultra-high modulus and etch selectivity boron-carbon hardmask films
15 Aug 23
Implementations of the present disclosure generally relate to the fabrication of integrated circuits.
Prashant Kumar Kulshreshtha, Ziqing Duan, Karthik Thimmavajjula Narasimha, Kwangduk Douglas Lee, Bok Hoen Kim
Filed: 1 Apr 21
Utility
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15 Aug 23
A system includes a substrate support on which to receive a transparent substrate, a non-contact sensor adapted to detect and image a dot pattern etched on a front surface of the transparent substrate, and a processing device attached to the non-contact sensor.
Michelle Alejandra Wong, Sanjay Rajaram
Filed: 5 May 20
Utility
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15 Aug 23
A method may include providing a device structure in the semiconductor device.
Sipeng Gu, Wei Zou
Filed: 7 Jun 21
Utility
twvdarktn0z23ss64ar7mr7738ed5tj00hs97l0384t6 6ek9u9fnj863dd7
15 Aug 23
A P-type field effect transistor (PFET) device and a method for fabricating a PFET device using fully depleted silicon on insulator (FDSOI) technology is disclosed.
Sipeng Gu, Wei Zou, Kyu-Ha Shim, Qintao Zhang
Filed: 25 Sep 20
Utility
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15 Aug 23
Embodiments of the present disclosure relate to photovoltaic devices, CIGS containing films, and methods of manufacturing CIGS containing films and photovoltaic devices to improve quantum efficiency, reduce interface charges, electron losses, and electron re-combinations.
Philip Hsin-hua Li, Seshadri Ramaswami
Filed: 3 Dec 19
Utility
ovpwze27nfrb8b2w1ejt5r5cx jvr7l3cbr1u5wemxqpez99
10 Aug 23
A chemical mechanical polishing system includes a platen to support a polishing pad, a boiler, a component that is movable between a first position spaced from the polishing pad and a second position in contact with the polishing pad, a plurality of nozzles to direct steam from the boiler onto the component of the polishing system when located at the first position, an actuator to move the component from the first position to the second position in contact with the polishing pad, and a controller configured to cause the treatment station to direct the steam onto the component to clean the component, and cause the actuator to move the cleaned component from the treatment station into contact with the polishing pad.
Haosheng Wu, Jianshe Tang, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou, Alexander John Fisher, Paul D. Butterfield
Filed: 17 Apr 23
Utility
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10 Aug 23
A method of depositing titanium nitride is disclosed.
Hanhong CHEN, Arkaprava DAN, Joseph AUBUCHON, Kyoung Ha KIM, Philip A. KRAUS
Filed: 11 Apr 23
Utility
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10 Aug 23
A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a consumable part when the consumable part moves away from the polishing pad, and a controller configured to perform an image processing algorithm on the image to determine whether the consumable part is damaged.
Thomas H. Osterheld, Dominic J. Benvegnu
Filed: 1 Feb 23
Utility
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10 Aug 23
Chalcogen silane precursors are described.
Chandan Kr Barik, Michael Haverty, Muthukumar Kaliappan, Cong Trinh, Bhaskar Jyoti Bhuyan, John Sudijono, Anil Kumar Tummanapelli, Richard Ming Wah Wong, Yingqian Chen
Filed: 14 Apr 23
Utility
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10 Aug 23
Embodiments described herein relate to an optical device metrology system including a light source to emit a light and a non-polarizing beam splitter to split the light into a first photodetector light path and an optical light path.
Baochen WU, Yangyang SUN, Ravi KOMANDURI, Jinxin FU, Ludovic GODET
Filed: 2 Feb 23
Utility
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10 Aug 23
Disclosed herein are approaches for reducing buried channel recess depth using a non-doping ion implant prior to formation of the buried channel.
Qintao Zhang, Wei Zou
Filed: 4 Feb 22
Utility
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10 Aug 23
A method for forming a device structure is disclosed.
Peter KURUNCZI, Joseph C. OLSON, Morgan EVANS, Rutger MEYER TIMMERMAN THIJSSEN
Filed: 21 Apr 23
Utility
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10 Aug 23
Methods of forming devices comprise forming a dielectric layer on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom.
Yang Zhou, Yong Jin Kim, Ge Qu, Zhiyuan Wu, Carmen Leal Cervantes, Feng Chen, Kevin Kashefi, Bhaskar Jyoti Bhuyan, Drew Phillips, Aaron Dangerfield
Filed: 8 Mar 23
Utility
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10 Aug 23
A fluorescent in-situ hybridization imaging system includes a flow cell to contain a sample, a fluorescence microscope, and a control system.
Yun-Ching Chang, Dan Xie, Chloe Kim
Filed: 17 Apr 23
Utility
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10 Aug 23
Methods of forming and processing semiconductor devices are described.
Yongjing Lin, Karla M Bernal Ramos, Shih Chung Chen, Yixiong Yang, Lin Dong, Steven C.H. Hung, Srinivas Gandikota
Filed: 3 Apr 23
Utility
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10 Aug 23
A method of imaging a sample with a charged particle beam device, comprising: determining a first focusing strength of an objective lens of the charged particle beam device, the first focusing strength being adapted to focus a charged particle beam on a first surface region of the sample; determining a first focal subrange of a plurality of focal subranges such that the first focusing strength is within the first focal subrange, wherein the plurality of focal subranges is associated with a set of values of a calibration parameter; determining a first value of the calibration parameter, the first value being associated with the first focal subrange; and imaging the first surface region with the first value.
Kulpreet Singh VIRDI, Bernhard G. MUELLER, Bernhard SCHÜLER
Filed: 29 Jul 20
Utility
rvo5in25fu99cmo018tce7i4esnevw10xey5kt2vjlkxbqqgzk2
10 Aug 23
Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same.
Wendell Glenn BOYD, Jr., Govinda RAJ, Matthew James BUSCHE
Filed: 19 Apr 23
Utility
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10 Aug 23
Embodiments of the present disclosure generally relate to methods for forming features having small and large line widths on the same substrate or device.
Yongan XU, Wei WU, Ludovic GODET
Filed: 17 Nov 22
Utility
3kdbh3lh5ot40pbp1p9up ltbhame22cybde9ju9z14dkz7udk0a1q0k
10 Aug 23
A semiconductor processing system includes a first component forming a first chamber.
Michael Robert Rice, Jeffery C. Hudgens
Filed: 3 Apr 23