7578 patents
Page 47 of 379
Utility
Semiconductor processing chamber
1 Aug 23
Exemplary semiconductor processing systems may include a pedestal configured to support a semiconductor substrate.
Greg Toland, Kenneth D. Schatz, Laksheswar Kalita, Dmitry Lubomirsky
Filed: 10 Sep 20
Utility
Actively clamped carrier assembly for processing tools
1 Aug 23
Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies.
Benjamin B. Riordon, James D. Strassner
Filed: 11 Dec 20
Utility
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1 Aug 23
Process chamber lid assemblies and process chambers comprising same are described.
Anqing Cui, Dien-Yeh Wu, Wei V. Tang, Yixiong Yang, Bo Wang
Filed: 14 Apr 22
Utility
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1 Aug 23
A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra.
Dominic J. Benvegnu, Jeffrey Drue David, Boguslaw A. Swedek
Filed: 18 Nov 21
Utility
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1 Aug 23
The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same.
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini, Vincent Dicaprio, Kyuil Cho
Filed: 12 Apr 21
Utility
rtp4t2w3bfsjkooz2b628fxeumlrfnzkcg03t78vr0w5 xkk9
1 Aug 23
Methods for integrating an image sensor and a light emitting diode (LED) leverage conformal depositions to achieve a single-sided, same height arrangement of contacts.
Taichou Papo Chen
Filed: 30 Dec 20
Utility
joomohx30pc5tm45h9ps3ionxjn3u4811eu643aee7hldyw
1 Aug 23
Processing methods may be performed to form an airgap in a semiconductor structure.
Angada B. Sachid
Filed: 19 Oct 20
Utility
53q6omqagjzccysespjuz a9rves
27 Jul 23
The present technology encompasses plasma sources including a first plate defining a first plurality of apertures arranged in a first set of rows.
Vladimir Nagorny
Filed: 24 Feb 23
Utility
l0d7h46tx4o6kxo9mg044s5l3y4yzqz8mjnq4z45
27 Jul 23
A method includes receiving trace sensor data associated with a first manufacturing process of a manufacturing chamber.
Sejune Cheon, Jeong Jin Hong, Mikyung Shim, Xiaoqun Zou, Jinkyeong Lee, Sang Hong Kim
Filed: 27 Jan 22
Utility
e9k2v6aatr5n48rzg0ppvboh99u10b0df7b71s09951
27 Jul 23
Molybdenum-DAD precursors are described.
Thomas Joseph Knisley, Martha Serna Villacis, Mark Saly, Lakmal C. Kalutarage, Charles H. Winter, Matthew Bertram Edward Griffiths, Shalini Tripathi
Filed: 24 Jan 23
Utility
m5istz2p020d406 wcelxi8ddpikowm14uuqc76w90nm
27 Jul 23
One or more images of a portion of a wafer with fabricated devices are acquired using an imaging tool.
Xinhuo Xiao, Stephanie W. Chen, Waheb Bishara, Bin Lin
Filed: 10 Jan 22
Utility
n7j2rsgsa476ceot1rkppygbv7b83vypxp5fc1th8ihil2nj r2de8q
27 Jul 23
Methods of depositing a nanocrystalline diamond film are described.
Sze Chieh Tan, Vicknesh Sahmuganathan, Eswaranand Venkatasubramanian, Abhijit Basu Mallick, John Sudijono
Filed: 27 Jan 22
Utility
scn7pqreos52h85 l6nbtm40wt0cxx60gd1ny2x2b570h0b
27 Jul 23
A system and method for controlling an amount of outgassing caused by implanting ions into a photoresist disposed on a workpiece.
Nevin Clay, David Roger Timberlake, Christopher R. Campbell
Filed: 24 Jan 22
Utility
mekl90ydv6fxp38lugo5phjzshng9je fz3o1hetmkmm5ie3eyu
27 Jul 23
Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system.
Joel L. Cannone, Gregory J. Wilson, Douglas William Carr, James E. Brown
Filed: 26 Jan 23
Utility
2aaw9a59krwfdgpjaug3ymhf8eonucz2lp32g3r74bk653b9l
27 Jul 23
A system and method for etching workpieces in a uniform manner are disclosed.
Kevin R. Anglin, Simon Ruffell
Filed: 31 Mar 23
Utility
hx454z0lvf1vduzfcaqfy5dwyzsjrqtyehheoavlpa42pdfipfgn71zggrq
27 Jul 23
An apparatus includes a substrate holder, a first actuator to rotate the substrate holder, a second actuator to move the substrate holder linearly, a first sensor to generate one or more first measurements or images of the substrate, a second sensor to generate one or more second measurements of target positions on the substrate, and a processing device.
Patricia Schulze, Gregory John Freeman, Michael Kutney, Arunkumar Ramachandraiah, Chih Chung Chou, Zhaozhao Zhu, Ozkan Celik
Filed: 25 Jan 22
Utility
n6wt9bgghhnfgml7otqicebpaqdh65l9ndja3v4wztx42ro5x2t1hq
27 Jul 23
Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck.
Ramesh GOPALAN, Robert Toshiharu HIRAHARA, Stanley WU, Michael Prestoza DECENA, Wendell BOYD, Siamak SALIMIAN, Thomas BREZOCZKY
Filed: 26 Jan 22
Utility
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27 Jul 23
The present disclosure relates to heating a substrate in a rapid thermal processing (RTP) chamber.
Wolfgang R. ADERHOLD, Dongming IU
Filed: 21 Jan 22
Utility
dwo72nxkxo3v146oiqwd6y0kwnrvkq43
27 Jul 23
Methods and apparatus for processing a first substrate and a second substrate are provided herein.
Prayudi LIANTO, Guan Huei SEE, Arvind SUNDARRAJAN, Muhammad Avicenna NARADIPA, Andrivo RUSYDI
Filed: 26 Jan 22
Utility
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27 Jul 23
Methods and systems are described for generating assessment maps.
Wenjiao Wang, Joshua Maher, Xinhai Han, Deenesh Padhi, Tza-Jing Gung
Filed: 4 Apr 23