2134 patents
Page 17 of 107
Utility
Semiconductor Devcie and Manufacturing Method for Semiconductor Device
23 Mar 23
A semiconductor device includes a heatsink, an insulating resin layer on the heatsink, and a metallic plate including a first surface in contact with a first region of the insulating resin layer and a second surface to which a semiconductor chip is adhered.
Masashi HOYA
Filed: 25 Jul 22
Utility
Semiconductor Unit and Semiconductor Device
23 Mar 23
A semiconductor unit includes a plurality of semiconductor chips, and an insulated circuit board including an insulating plate having, in a plan view of the semiconductor unit, a rectangular shape surrounded by first and second sides opposite to each other and third and fourth sides perpendicular to the first and second sides and opposite to each other, an output circuit pattern and an input circuit pattern on a front surface of the insulating plate.
Taichi ITOH
Filed: 25 Nov 22
Utility
Drive Device for Voltage-controlled Semiconductor Element
23 Mar 23
A drive device for driving a voltage-controlled semiconductor element.
Hiroaki ICHIKAWA
Filed: 25 Nov 22
Utility
Integrated Circuit and Power Supply Circuit
23 Mar 23
An integrated circuit for a power supply circuit, including: a first command value output circuit outputting a first command value to turn on a transistor of the power supply circuit for a first time period; an on signal output circuit outputting an on signal to turn on the transistor; a delay circuit delaying the on signal by a predetermined time period; a correction circuit correcting the first command value, to output a second command value to turn on the transistor for a second time period; and a driver circuit turning on and off the transistor based respectively on the delayed on-signal and the second command value.
Ryuunosuke ARAUMI, Ryuji YAMADA
Filed: 28 Jul 22
Utility
Control device for mobile body, control method therefor, and mobile body
21 Mar 23
A control device for a mobile body is equipped with a charging and electrical power supplying unit including a first smoothing capacitor positioned on a connector side and a second smoothing capacitor positioned on a battery side, and a control unit configured to control the charging and electrical power supplying unit.
Mitsuteru Yano, Shinichi Yokoyama, Masahiko Sato, Tomoki Nakahara
Filed: 23 Sep 21
Utility
Insulated-gate semiconductor device
21 Mar 23
An insulated-gate semiconductor device, which has trenches arranged in a chip structure, the trenches defining both sidewalls in a first and second sidewall surface facing each other, includes: a first unit cell including a main-electrode region in contact with a first sidewall surface of a first trench, a base region in contact with a bottom surface of the main-electrode region and the first sidewall surface, a drift layer in contact with a bottom surface of the base region and the first sidewall surface, and a gate protection-region in contact with the second sidewall surface and a bottom surface of the first trench; and a second unit cell including an operation suppression region in contact with a first sidewall surface and a second sidewall surface of a second trench, wherein the second unit cell includes the second trench located at one end of an array of the trenches.
Keiji Okumura
Filed: 28 Sep 21
Utility
Silicon carbide semiconductor device
21 Mar 23
A semiconductor device includes a semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a second semiconductor layer of a second conductivity type, first semiconductor regions of the first conductivity type, second semiconductor regions of the second conductivity type, gate insulating films, gate electrodes, an insulating film, first electrodes, a second electrode, and trenches.
Hiroyuki Fujisawa, Akimasa Kinoshita
Filed: 26 Jan 21
Utility
Semiconductor module
21 Mar 23
A semiconductor module is provided with: a case having a frame that surrounds a substrate and a terminal block formed extending inward from an inner wall surface of the frame; a terminal having one end extending outward from the frame, and another end extending inward from the frame and being secured to a top face of the terminal block; a wiring member that electrically connects the terminal and a semiconductor element on the substrate; and an encapsulating resin that encapsulates the other end of the terminal, the wiring member, and the semiconductor element inside the case.
Naoyuki Kanai, Yuichiro Hinata, Yuta Tamai
Filed: 30 Jun 21
Utility
Semiconductor Device and Manufacturing Method
16 Mar 23
Provided is a semiconductor device including a semiconductor substrate having a first dopant of a first conductivity type and a second dopant of a second conductivity type, both the first dopant and the second dopant being distributed in an entire part of the semiconductor substrate, the semiconductor substrate including a drift region of the first conductivity type, a dielectric film provided on an upper surface of the semiconductor substrate, a high concentration region of the first conductivity type provided in contact with the dielectric film below the dielectric film and having a higher doping concentration than the drift region, and a fall off region that is provided in contact with the dielectric film below the dielectric film and in which a concentration of the dopant of the second conductivity type decreases toward the dielectric film.
Koh YOSHIKAWA, Kosuke YOSHIDA, Nao SUGANUMA
Filed: 22 Aug 22
Utility
Power Converter
16 Mar 23
A power converter, includes: a first line to which a first voltage is applied; a second line to which a second voltage lower than the first voltage is applied; a third line to which a third voltage lower than the second voltage is applied; a first bridge circuit that is provided between the first line and the second line, the first bridge circuit including a plurality of first switching elements; a second bridge circuit that is provided between the second line and the third line, the second bridge circuit including a plurality of second switching elements; and a voltage output circuit configured to generate a predetermined direct current (DC) voltage based on operations of the first and second bridge circuits.
Motoyoshi KUBOUCHI
Filed: 28 Jul 22
Utility
Manufacturing Method for Semiconductor Device
16 Mar 23
Provided is a manufacturing method for a semiconductor device including forming a first electrode layer on a front surface of a wafer, implanting, into an outer peripheral region of the front surface of the wafer, a heavy ion of an element in third and subsequent rows of a periodic table, forming an oxide film in the outer peripheral region into which the heavy ion has been implanted, and forming a second electrode layer on the first electrode layer by plating.
Tatsuya HASHIMOTO
Filed: 13 Jul 22
Utility
Semiconductor Element
16 Mar 23
A semiconductor element includes: a first resistive layer; a second resistive layer provided separately from the first resistive layer and having a resistance value different from that of the first resistive layer; a first external connection electrode electrically connected to one end of the first resistive layer; a second external connection electrode provided separately from the first external connection electrode and electrically connected to one end of the second resistive layer; and a passivation film provided to cover the first and second external connection electrodes and having a first opening and a second opening to which top surfaces of the first and second external connection electrodes are partly exposed, wherein the first opening and the second opening having planar patterns with shapes different from each other.
Taichi KARINO
Filed: 27 Jul 22
Utility
Wiring Board and Power Conversion Apparatus
16 Mar 23
A wiring board includes a pair of hard substrates provided for each of a plurality of semiconductor elements connected in parallel; a soft substrate provided so as to be at least partially sandwiched between all of the pairs of hard substrates; a first electrode configured to connect a control terminal of the semiconductor element and the hard substrate or the soft substrate; a second electrode configured to connect a reference potential terminal of the semiconductor element and the hard substrate or the soft substrate; a first wiring configured to connect in parallel the first electrodes of each of the plurality of semiconductor elements, at least part of the first wiring being provided on the soft substrate; and a second wiring configured to connect in parallel the second electrodes of each of the plurality of semiconductor elements, at least part of the second wiring being provided on the soft substrate.
Ryoga KIGUCHI, Hiromu TAKUBO
Filed: 22 Nov 22
Utility
Semiconductor Device and Manufacturing Method
16 Mar 23
Provided is a semiconductor device including: a semiconductor substrate having a drift region of a first conductivity type; an active portion, in which at least one of a transistor portion and a diode portion is provided, in the semiconductor substrate; and an edge termination structure portion provided farther outward than the active portion in the semiconductor substrate, wherein the edge termination structure portion has a plurality of guard rings of a second conductivity type provided in contact with an upper surface of the semiconductor substrate, and an embedded dielectric film arranged between two guard rings and at least partially embedded in the semiconductor substrate, and the guard rings are provided up to a position below the embedded dielectric film.
Kosuke YOSHIDA, Koh Yoshikawa, Nao Suganuma
Filed: 22 Aug 22
Utility
Semiconductor Module
16 Mar 23
A semiconductor module including: a plurality of first semiconductor chips; a resin case provided surrounding an accommodation space for accommodating the plurality of first semiconductor chips; a first gate terminal connected to a gate pad of the plurality of first semiconductor chips; a plurality of first main gate wirings provided in the accommodation space, each of which is connected to the gate pad of the plurality of first semiconductor chips; and a first adjusting gate wiring arranged between at least one of the plurality of first main gate wirings and the first gate terminal, and configured to adjust a difference in wiring lengths between the plurality of first semiconductor chips and the first gate terminal is provided.
Masayoshi NAKAZAWA
Filed: 20 Nov 22
Utility
Beverage dispensing apparatus and beverage dispensing method
14 Mar 23
A beverage dispensing apparatus for preparing a beverage and dispensing the prepared beverage into a container.
Yuki Ninomiya, Koichi Ito
Filed: 28 Feb 20
Utility
Semiconductor device
14 Mar 23
A semiconductor device includes a wiring board that includes a first insulating layer, a first conductive layer arranged over the first insulating layer, a second conductive layer arranged under the first insulating layer, the wiring board further including a magnetic layer that is arranged between the first insulating layer and the first or second conductive layer and that has a higher specific magnetic permeability than the first and second conductive layers, and a carbon layer that is arranged between the first insulating layer and the first or second conductive layer and that has a higher thermal conductivity in a planary direction than the first and second conductive layers; a semiconductor chip electrically connected to the first and second conductive layers; and an insulating circuit board arranged separately from the wiring board and that has the semiconductor chip mounted thereon.
Takahiro Mitsumoto, Akira Hirao, Motohito Hori
Filed: 2 Aug 21
Utility
Linear motor
14 Mar 23
A linear motor includes an armature that includes a coil and a core made of a soft magnetic material, and a field magnet that includes a permanent magnet generating a magnetic field for the armature.
Terukazu Akiyama, Satoshi Imamori, Yusuke Konno
Filed: 22 Jun 21
Utility
Semiconductor device
14 Mar 23
Provided is a semiconductor device comprising a high-side switching device, a low-side switching device, a high-side driver configured to turn on/off the high-side switching device, a low-side driver configured to turn on/off the low-side switching device, a high-side driving external terminal configured to supply a power supply voltage for driving the high-side driver, and a protection circuit section connected to the high-side driving external terminal.
Masashi Hoya
Filed: 28 Sep 21
Utility
Data compression method, data compression device, data decompression method, and data decompression device
14 Mar 23
A data compression method includes inputting a data sequence that includes first data strings and second data strings alternating with each other, each of the first data strings containing one or more first data all of which have a same predetermined value, each of the second data strings containing one or more second data different from the predetermined value, determining first numbers and second numbers from a beginning of the input data sequence sequentially, each of the first numbers being a number of the first data in a respective one of the first data strings, and each of the second numbers being a number of the second data in a respective one of the second data strings, and arranging the first numbers, the second numbers, and the second data strings in a cyclic manner to generate compressed data.
Kenji Takatsukasa
Filed: 26 Jul 21