1577 patents
Page 2 of 79
Utility
Manufacturing Method of Semiconductor Device, Method of Testing the Semiconductor Device and Wafer Holding Member
21 Dec 23
A method of manufacturing a semiconductor device includes: a grind step of forming a small thickness portion and a large thickness portion surrounding the small thickness portion in plan view by grinding a back surface of a semiconductor wafer; a preparation step of preparing a wafer holding member including a wafer placement surface and a back surface opposite to the wafer placement surface and having a larger thickness than a difference between a thickness of the large thickness portion and a thickness of the small thickness portion; and a placement step of placing the semiconductor wafer on the wafer holding member so that the small thickness portion of the semiconductor wafer and the wafer placement surface of the wafer holding member are in contact with each other on the back surface side of the semiconductor wafer.
Tsuyoshi KANAO, Koji OGATA
Filed: 28 Mar 23
Utility
Semiconductor Device and Method of Manufacturing the Same
21 Dec 23
Wirings next to each other spaced apart by a first distance are formed in the uppermost layer of a multilayer wiring layer formed on a semiconductor substrate.
Tatsuya USAMI
Filed: 21 Apr 23
Utility
Metal Film and Manufacturing Method of the Metal Film, and Semiconductor Device and Method of Manufacturing the Semiconductor Device
21 Dec 23
A metal film, a manufacturing method of the metal film, semiconductor device, and a manufacturing method of semiconductor device are provided with high crack resistance (higher hardness) during wire bonding.
Tadashi YAMAGUCHI
Filed: 20 Apr 23
Utility
Semiconductor Device and Method of Manufacturing the Same
21 Dec 23
A dielectric layer has a first opening exposing a surface of a first conductive layer and a second opening exposing a surface of a second conductive layer and having an opening area smaller than an opening area of the first opening.
Etsuko WATANABE, Takashi TONEGAWA
Filed: 23 Mar 23
Utility
Semiconductor Device Including a Circuit for Transmitting a Signal
21 Dec 23
Reliability of a semiconductor device is improved.
Toshihiko AKIBA, Kenji SAKATA, Nobuhiro KINOSHITA, Yosuke KATSURA
Filed: 6 Sep 23
Utility
Semiconductor Device and Method of Manufacturing the Same
21 Dec 23
A semiconductor device includes an n-type semiconductor substrate, a trench, a gate electrode formed in the trench via the gate insulating film, a p-type base region formed in the semiconductor substrate, and an n-type emitter region formed in the base region.
Koji OGATA, Tetsuya YOSHIDA, Yukio TAKAHASHI
Filed: 16 Mar 23
Utility
Semiconductor Device and Method of Manufacturing the Same
21 Dec 23
An improved structure and a manufacturing method of a vertical type power MOSFET having a super junction configuration is disclosed.
Akihiro SHIMOMURA, Masami SAWADA
Filed: 24 Mar 23
Utility
Solid-state Image Sensor, Imaging Device, and Ad Converter
21 Dec 23
A solid-state image sensor includes a buffer circuit, and an AD conversion circuit.
Yoichi IIZUKA, Fukashi MORISHITA
Filed: 17 May 23
Utility
Semiconductor Device and Method of Manufacturing the Same
21 Dec 23
In a memory region, a memory-region first portion in which no raised epitaxial layer is formed, a memory-region second portion in which a first raised epitaxial layer is formed, and a memory-region third portion in which a second raised epitaxial layer is formed are defined.
Kazuhiko SEGI, Yoshiyuki KAWASHIMA
Filed: 20 Apr 23
Utility
Semiconductor device, electronic control unit, verification method of electronic control unit and manufacturing method of electronic control unit
19 Dec 23
A semiconductor device includes an operation resource which performs a plurality of ECU functions, a peripheral resource which is shared by the plurality of ECU functions and a control mechanism which controls a period in which one of the ECU functions uses the peripheral resource.
Masayuki Daito
Filed: 16 May 22
Utility
Semiconductor device and method for protecting bus
19 Dec 23
The master interface generates copy data by copying the first data, and generates an error detection code based on the copy data.
Sho Yamanaka, Toshiyuki Hiraki
Filed: 11 Jan 23
Utility
Semiconductor Device
14 Dec 23
A clamp element 46 applies a fixed potential to a bit line BL at a time of a readout operation.
Koichi TAKEDA, Akihiko KANDA, Takahiro SHIMOI
Filed: 15 May 23
Utility
Semiconductor Device
14 Dec 23
A semiconductor device capable of increasing readout margin in a nonvolatile resistive random access memory is provided.
Koichi TAKEDA
Filed: 8 May 23
Utility
Semiconductor Device
14 Dec 23
A semiconductor device includes: a first chip mounting portion; a second chip mounting portion; a first semiconductor chip mounted on the first chip mounting portion; second and third semiconductor chips mounted on the second chip mounting portion; and a sealing body for sealing them.
Yoshihiro MASUMURA, Takamichi HOSOKAWA, Keita TAKADA
Filed: 20 Apr 23
Utility
Semiconductor Device and Method of Manufacturing the Same
14 Dec 23
A semiconductor device includes a wiring layer, a dielectric layer covering the wiring layer, a thin film resistor provided on the dielectric layer, and a plug electrode connecting the thin film resistor to the wiring layer.
Nobuhito SHIRAISHI
Filed: 3 Apr 23
Utility
Semiconductor Device and Power Supply Control Processing Method for Control Circuit of Semiconductor Device
14 Dec 23
A semiconductor device includes a first regulator electrically connected to a first power supply line, a second regulator electrically connected to a second power supply line, a control circuit configured to control the first and second regulators, and at least two functional circuit modules electrically connectable to the first power supply line and the second power supply line.
Hiroshi UEKI
Filed: 6 Jun 23
Utility
Semiconductor device
12 Dec 23
A semiconductor device of the present invention includes: a P-type output transistor configured to have a source to which a power supply voltage is applied, and a drain connected to an external connection pad; a gate wiring configured to be connected to a gate of the output transistor; a signal transmitting portion configured to transmit an input signal to the gate wiring; and a voltage-breakdown protecting portion configured to apply the power supply voltage to a back gate of the output transistor if a voltage on the external connection pad is equal to or lower than the power supply voltage, or the voltage-breakdown protecting portion bringing the signal transmitting portion into a disconnection state and applies the voltage on the external connection pad to the gate and the back gate of the output transistor if the voltage applied on the external connection pad is higher than the power supply voltage.
Fumiaki Yanagihashi
Filed: 23 Dec 21
Utility
A/d Converter and Semiconductor Device
7 Dec 23
According to one embodiment, an A/D converter includes a successive approximation algorithm setting register that stores a plurality of successive approximation algorithms, an algorithm selection unit that selects a predetermined successive approximation algorithm from the plurality of successive approximation algorithms, a control circuit that generates a comparison value based on the selected predetermined successive approximation algorithm, a DAC that generates a comparison voltage from the comparison value, and a comparator that compares an analog input voltage with the comparison voltage.
Takumi KAWAGUCHI
Filed: 20 Apr 23
Utility
Message handler
5 Dec 23
A message handler is described.
Christian Mardmoeller, Dnyaneshwar Kulkarni, Thorsten Hoffleit
Filed: 28 Apr 21
Utility
Semiconductor Device
30 Nov 23
A semiconductor device includes a processor unit, a memory storing a boot program, a reset controller and an address check unit.
Yuki MORI, Yuji KUBO, Hiroshi MORITA
Filed: 31 May 22