1577 patents
Page 4 of 79
Utility
Semiconductor device, electronic device and electronic system
21 Nov 23
A semiconductor device according to an embodiment includes a holding circuit including a buffer configured to obtain a heat stress information having a temperature dependency every predetermined period and a stress counter configured to accumulate the heat stress information and hold the accumulated value as a cumulative stress count value, a control circuit including an operation determination threshold value, and a wireless communication circuit.
Kan Takeuchi, Yoshio Takazawa, Fumio Tsuchiya, Daisuke Oshida, Naoya Ota, Masaki Shimada, Shinya Konishi
Filed: 2 Sep 20
Utility
Semiconductor Device
16 Nov 23
A semiconductor device includes a semiconductor package having a differential signal terminal pair, and a wiring board.
Yoshikazu TANAKA, Tadashi KAMEYAMA, Takafumi BETSUI
Filed: 12 May 22
Utility
Semiconductor Device
16 Nov 23
A semiconductor device includes: a first semiconductor chip mounted on a chip mounting portion via a first bonding material; and a second semiconductor chip mounted on the first semiconductor chip.
Yasutaka NAKASHIBA, Toshiyuki HATA
Filed: 12 May 22
Utility
Semiconductor Device and Method of Manufacturing the Same
16 Nov 23
Semiconductor device has a cell region and a peripheral region, and has a drift layer, a trench, an gate dielectric film on an inner wall of the trench, a gate electrode, and a p-type first semiconductor region below the trench in the cell region on a semiconductor substrate.
Atsushi SAKAI, Katsumi EIKYU, Yasuhiro OKAMOTO, Kenichi HISADA, Nobuo MACHIDA
Filed: 25 Jul 23
Utility
Semiconductor Device and Method of Manufacturing the Same
16 Nov 23
A second gate electrode is adjacent, in a Y direction, to a first tip of a semiconductor layer in a first active region such that a protruding distance of a second tip of the second gate electrode protruded, in a X direction, from the semiconductor layer in the first active region is greater than or equal to 0.
Yoshiki YAMAMOTO
Filed: 20 Mar 23
Utility
Semiconductor Device
16 Nov 23
A package construction includes: a die pad, and a suspension lead remaining portion connected to the die pad.
Toshiyuki HATA
Filed: 16 Feb 23
Utility
Semiconductor Device
16 Nov 23
A semiconductor device includes: a die pad having an upper surface facing a semiconductor chip, a metal film formed on the upper surface, and a bonding material formed so as to cover the metal film.
Katsuhiko KITAGAWA, Takehiko MAEDA, Kuniharu MUTO, Takeshi MIYAKOSHI
Filed: 22 Feb 23
Utility
Semiconductor Device
16 Nov 23
A semiconductor device includes a first semiconductor chip, a second semiconductor chip, and a redistribution layer.
Yasutaka NAKASHIBA, Hiroshi MIYAKI
Filed: 9 Mar 23
Utility
Semiconductor device
14 Nov 23
A semiconductor device is configured so that two or more master devices access a slave device via a bus.
Koki Higuchi, Tsutomu Matsuzaki, Masafumi Inoue, Masakatsu Uneme
Filed: 12 May 21
Utility
Semiconductor device and control method
14 Nov 23
The semiconductor device includes a control unit having redundant processors, a memory storing target data, a secure memory storing a key used for encryption or decryption processing, an cryptographic unit, a secure processor instructing cryptographic processing to the cryptographic unit in response to a request from the control unit, a first bus coupled to the control unit, the memory, the cryptographic unit, and the secure processor, and a second bus coupled to the secure memory, the cryptographic unit, and the secure processor.
Kenichi Ito, Akihiro Yamate, Akira Hosotani
Filed: 17 Sep 19
Utility
Oscillator frequency adjustment
14 Nov 23
Oscillator circuitry is disclosed.
Volker Langer, Thomas Kattwinkel
Filed: 19 Aug 19
Utility
Semiconductor Device and Power Management Ic
9 Nov 23
Semiconductor device has a regulator circuit having an even number of switching regulators that generate output power from an input power supply and a power management IC that controls the output potential generated by the switching regulator. semiconductor device is characterized in that a group of half of the even number of switching regulators is arranged on a first surface of semiconductor device system board, and a group of switching regulators, which is the remaining half, is arranged on a second surface that is in front-back relation with the first surface.
Takafumi BETSUI
Filed: 13 Jul 23
Utility
Semiconductor device having a contents addressable memory
7 Nov 23
The plurality of CAM cells MC are configured to discriminate a match or mismatch between stored data stored in advance and search data.
Yohei Sawada, Masao Morimoto, Makoto Yabuuchi
Filed: 21 Jul 21
Utility
Semiconductor device and method of manufacturing the same
7 Nov 23
A semiconductor device with improved reliability is provided.
Kazuo Tomita, Hiroki Takewaka
Filed: 21 Sep 22
Utility
Semiconductor device
7 Nov 23
Improving a reliability of a semiconductor device.
Yoshiki Yamamoto
Filed: 29 Oct 21
Utility
Time-sensitive networking
7 Nov 23
A network device comprising a set of queues and a time-aware shaper which comprises a set of transmission gates and gate control instructions.
Christian Mardmoeller, Thorsten Hoffleit
Filed: 24 Jan 18
Utility
Semiconductor device and method of manufacturing the same
7 Nov 23
A semiconductor device includes: a semiconductor substrate; an insulating layer formed on the semiconductor substrate; an optical waveguide formed on the insulating layer, extending in a first direction in a plan view, and being made of silicon; and an interlayer insulating film formed on the insulating layer to cover the optical waveguide.
Yasutaka Nakashiba, Shinichi Watanuki
Filed: 8 Feb 22
Utility
Method of Manufacturing Semiconductor Device
2 Nov 23
In a frame member including a first region and a second region that are extending in a first direction in parallel to each other while being spaced apart from each other, first and second plating films are formed in the first and second regions, respectively.
Toshiyuki HATA
Filed: 17 Feb 23
Utility
Semiconductor Device
2 Nov 23
A wiring substrate includes a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third conductive layer, a third insulating layer, and a fourth conductive layer.
Takashi KARASHIMA
Filed: 17 Feb 23
Utility
Semiconductor Device and Method of Manufacturing the Semiconductor Device
2 Nov 23
A semiconductor device in which a resistance film and a MIM capacitor can be arranged within an interlayer insulating film without increasing the thickness of the interlayer insulating film is provided.
Eiji HIRAIWA
Filed: 1 Mar 23