3198 patents
Page 7 of 160
Utility
Calibration of an aligner station of a processing system
21 Nov 23
A calibration object is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber and placed in a load lock connected to the transfer chamber.
Nicholas Michael Bergantz, Andreas Schmid, Leon Volfovski, Sanggyum Kim, Damon Cox, Paul Wirth
Filed: 11 Aug 20
Utility
Apparatus and methods for processing chamber lid concentricity alignment
21 Nov 23
Methods for aligning a processing chamber using a centering ring and processing chambers having the centering ring are describes.
Kwok Feng Wong, Rakesh Ramadas, Ashutosh Agarwal
Filed: 21 Sep 21
Utility
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21 Nov 23
A drift tube may include a middle portion, arranged as a hollow cylinder, and coupled to receive an RF voltage signal.
William Davis Lee, Charles T. Carlson
Filed: 13 Sep 21
Utility
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21 Nov 23
The present invention relates to a method for manufacturing an electrostatic chuck comprising: a base member of a metal material; and a dielectric layer, formed on an upper surface of the base member, including an electrode layer to the inside of which a DC power is applied.
Saeng Hyun Cho
Filed: 1 Jun 16
Utility
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21 Nov 23
Embodiments of the present disclosure provide nanopore devices, such as nanopore sensors and/or other nanofluidic devices.
Ryan Scott Smith, Roger Quon, David Collins, George Odlum, Raghav Sreenivasan, Joseph R. Johnson
Filed: 20 Jul 20
Utility
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21 Nov 23
Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein.
Sumit Agarwal, Timothy Joseph Franklin, Joseph F. Sommers
Filed: 2 Aug 21
Utility
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21 Nov 23
Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein.
Chih Chung Chou, Anand Nilakantan Iyer, Ekaterina Mikhaylichenko, Christopher Heung-Gyun Lee, Erik Rondum, Tiffany Yu-Nung Cheung, Shou-Sung Chang
Filed: 25 Jun 21
Utility
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21 Nov 23
Methods of depositing metal films comprising exposing a substrate surface to a first metal precursor followed by a non-oxygen containing reducing agent comprising a second metal to form a zero-valent first metal film are described.
Nasrin Kazem, Muthukumar Kaliappan, Jeffrey W. Anthis, Michael Haverty
Filed: 11 Nov 20
Utility
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21 Nov 23
Methods of depositing a molybdenum sulfide film with increased sulfur:molybdenum ratio are described.
Keith T. Wong, HyoJin Kim
Filed: 22 Sep 20
Utility
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21 Nov 23
Exemplary methods of semiconductor processing may include forming a silicon oxide material on exposed surfaces of a processing region of a semiconductor processing chamber.
Xiaoquan Min, Byung Ik Song, Hyung Je Woo, Venkata Sharat Chandra Parimi, Prashant Kumar Kulshreshtha, Kwangduk Lee
Filed: 27 Oct 20
Utility
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21 Nov 23
Apparatus and methods for spatial atomic layer deposition including at least one first exhaust system and at least one second exhaust system.
Ning Li, Steven D. Marcus, Tai T. Ngo, Kevin Griffin
Filed: 28 Dec 21
Utility
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21 Nov 23
Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface are described.
Bhaskar Jyoti Bhuyan, Mark Saly, David Thompson, Tobin Kaufman-Osborn, Kurt Fredrickson, Thomas Knisley, Liqi Wu
Filed: 23 Feb 21
Utility
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21 Nov 23
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber.
Shu-Kwan Lau, Koji Nakanishi, Toshiyuki Nakagawa, Zuoming Zhu, Zhiyuan Ye, Joseph M. Ranish, Nyi O. Myo, Errol Antonio C. Sanchez, Schubert S. Chu
Filed: 26 May 21
Utility
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21 Nov 23
Methods, systems and apparatus for decreasing total distortion of a maskless lithography process are disclosed.
Joseph Johnson, Christopher Bencher
Filed: 10 May 22
Utility
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14 Nov 23
Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein.
Aniruddh Jagdish Khanna, Jason G. Fung, Puneet Narendra Jawali, Rajeev Bajaj, Adam Wade Manzonie, Nandan Baradanahalli Kenchappa, Veera Raghava Reddy Kakireddy, Joonho An, Jaeseok Kim, Mayu Yamamura
Filed: 29 Sep 20
Utility
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14 Nov 23
A method for finding a center of a process kit and/or a process kit ring is provided.
Ali Utku Pehlivan, Mohsin Waqar, Paul Zachary Wirth, Todd James Brill
Filed: 13 Oct 20
Utility
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14 Nov 23
Exemplary semiconductor processing chambers may include a gasbox.
Fang Ruan, Prashant Kumar Kulshreshtha, Jiheng Zhao, Diwakar Kedlaya
Filed: 27 Nov 19
Utility
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14 Nov 23
The present disclosure provides a holding arrangement.
Simon Lau
Filed: 18 Apr 22
Utility
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14 Nov 23
Certain embodiments of the present disclosure relate to chamber liners, processing chambers that include chamber liners, and methods of using the same.
James D. Carducci, Kenneth S. Collins, Kartik Ramaswamy
Filed: 31 Oct 22
Utility
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14 Nov 23
Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel.
Nolan Zimmerman, Gregory J. Wilson, Andrew Anten, Richard W. Plavidal, Eric J. Bergman, Tricia Youngbull, Timothy Gale Stolt, Sam Lee
Filed: 29 Mar 19