3198 patents
Page 10 of 160
Utility
CD dependent gap fill and conformal films
31 Oct 23
A method of depositing a silicon-containing material is disclosed.
Jung Chan Lee, Praket P. Jha, Jingmei Liang, Jinrui Guo, Wenhui Li
Filed: 9 Nov 21
Utility
Channeled implants for SiC MOSFET fabrication
31 Oct 23
Methods for fabricating SiC MOSFETs using channeled ion implants are disclosed.
Qintao Zhang, Samphy Hong, Wei Zou, Hans-Joachim L. Gossmann
Filed: 4 May 21
Utility
prug41y7upqss4qh 8iygfe
31 Oct 23
A selector device may include a first electrode, a tunneling layer, and a ferroelectric layer.
Milan Pe{hacek over (s)}ić
Filed: 9 Aug 22
Utility
ytdv4vy8m5zyr3l223nemjhfpuli9ytu8y0wnjjrauxh618e i8ksl
31 Oct 23
A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system.
Hari Soundararajan, Shou-Sung Chang, Calvin Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar, Paul D. Butterfield, Chad Pollard, Haosheng Wu
Filed: 28 Jun 21
Utility
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31 Oct 23
A cooling chamber comprising a support plate connected to a cryo pump and turbo pump, a clamp ring with a plurality of clamp pads on the bottom thereof where each clamp pad has a beveled surface directed downward and a lift plate to move the clamp ring from a clamp position to a loading position are described.
Bharath Swaminathan, John Mazzocco, Hanbing Wu, Ashish Goel, Anantha K. Subramani
Filed: 12 Dec 17
Utility
g8r3s13sq1kqc9t2aip55vfdhy9y2w5p52c5ha tdvx9ncn8kt7cd5ie
31 Oct 23
Embodiments described herein include a method for depositing a material layer on a substrate while controlling a bow of the substrate and a surface roughness of the material layer.
Zihao Yang, Mingwei Zhu, Nag B. Patibandla, Yong Cao, Shumao Zhang, Zhebo Chen, Jean Lu, Daniel Lee Diehl, Xianmin Tang
Filed: 10 Sep 20
Utility
q2axnp3v04leb74xo3ws1f73a46tra8wlxitihfu
31 Oct 23
A method of optical device metrology is provided.
Jinxin Fu, Kazuya Daito, Ludovic Godet
Filed: 24 Nov 21
Utility
f23zkgqlz64edo7k55q4p99k8gjsac0q0bwn4nf
31 Oct 23
Methods and apparatus leverage dielectric barrier discharge (DBD) plasma to treat samples for surface modification prior to photomask application and for photomask cleaning.
Banqiu Wu, Khalid Makhamreh, Eliyahu Shlomo Dagan
Filed: 12 Apr 21
Utility
13mrvy8tf2y1gfimwhxk9mpkncq1e8hkru8maj4g71esvw20o2ug85vz
24 Oct 23
A method (100) of cooling a deposition source (200) is described.
Claire Armstrong, Frank Schnappenberger, Thomas Deppisch
Filed: 16 Nov 17
Utility
b340cbzof70wem glz6rs
24 Oct 23
Electroplating systems according to embodiments of the present technology may include a plating chamber configured to deposit metal material onto substrates positioned in the plating chamber.
Nolan L. Zimmerman
Filed: 15 Oct 20
Utility
gt43m8hzhu5dwwnjriafcicw0dqavjxydcuhqfxbf3b 0i1ok
24 Oct 23
An optical inspection system that may include an illumination optics configured to generate an illumination light beam and to illuminate a sample with the illumination light beam; at least one collection optics configured to collect light from the sample; at least one detector configured to detect at least one detected light beam outputted from the at least one collection optics; multiple polarizers that are configured to (a) set a polarization of the illumination light beam by selectively introducing, under a control of the control unit, at least one illumination optics polarization change, and (b) set a polarization of the at least one detected light beam by selectively introducing, under a control of the control unit, at least one collection optics polarization change.
Elad Eizner, Amir Shoham
Filed: 20 Oct 21
Utility
4sf8e7cq1rm8u7srzwbdxuqoruvh1nn2fw7zshw4dk6 92k2h8scslm25
24 Oct 23
Electrostatic chucks and method for forming the same are described herein.
Arvinder Chadha, Tomoaki Kohzu
Filed: 3 Feb 22
Utility
ti562cbv2 mttiu5m1yp6ryfndk08cf7xnk220
24 Oct 23
A method of chemical mechanical polishing includes bringing a conductive layer of a substrate into contact with a polishing pad, supplying a polishing liquid to the polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, and determining a sequence of thickness values for the conductive layer based on the sequence of signal values.
Kun Xu, Andrew Siordia
Filed: 15 Dec 20
Utility
vni97eecs8ycklrfrh9bptu0x1qsdcbn1ts 98huhkygoj22b5kfjyb7jdc
24 Oct 23
Embodiments herein generally relate to chemical mechanical polishing (CMP) systems and methods for reducing non-uniform material removal rate at or near the peripheral edge of a substrate when compared to radially inward regions therefrom.
Christopher Heung-Gyun Lee, Anand Nilakantan Iyer, Hyuen Karen Tran, Ghunbong Cheung
Filed: 28 Sep 20
Utility
9k9ltwjkowmtg5iuutt6zhxmbuu7sf9mj8tcmxlonrywil4 001g6mg
24 Oct 23
A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer.
Kasiraman Krishnan, Nag B. Patibandla, Periya Gopalan
Filed: 19 Jun 18
Utility
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24 Oct 23
Embodiments of the present disclosure generally relate to protective coatings on an aerospace component and methods for depositing the protective coatings.
David A. Britz
Filed: 16 Aug 19
Utility
h30n3b69j051kd99rfribcb057yi4pcz a9ab3i9oekpb6a69oeyz2g35
24 Oct 23
The present disclosure is a method of bonding an electrostatic chuck to a temperature control base.
Vijay D. Parkhe, Roger Alan Lindley
Filed: 11 Nov 21
Utility
4ru6mv5y4jaue910czo7zd 0to8sk3mmu3ti8ibgelv121at7g
24 Oct 23
There is provided a method and a system configured to compensate for image distortions.
Yehuda Cohen, Rafael Bistritzer
Filed: 7 Jul 20
Utility
4yjp11id0upvao y3be1bpkwh6x7nu7bfmw1liylc5mrvi7unbbyhrcu68x
24 Oct 23
One or more embodiments described herein generally relate to patterning semiconductor film stacks.
John O. Dukovic, Srinivas D. Nemani, Ellie Y. Yieh, Praburam Gopalraja, Steven Hiloong Welch, Bhargav S. Citla
Filed: 24 May 21
Utility
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24 Oct 23
Embodiments of the present disclosure generally relate to apparatus and methods for controlling an ion energy distribution during plasma processing.
Linying Cui, James Rogers
Filed: 16 Nov 20