3198 patents
Page 9 of 160
Utility
Slurry distribution device for chemical mechanical polishing
7 Nov 23
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system.
Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
Filed: 22 Mar 21
Utility
Multifunctional printhead service station with multi-axis motions
7 Nov 23
Embodiments described herein relate to an inkjet service station and methods of servicing an inkjet printer with the inkjet service station.
Daihua Zhang, Kang Luo, Kazuya Daito, Kenneth S. Ledford, Elsa Massonneau, Alexey Stepanov, Ludovic Godet, Mahendran Chidambaram, Visweswaren Sivaramakrishnan, Bahubali S. Upadhye, Hemantha Raju
Filed: 12 Jan 22
Utility
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7 Nov 23
An ion source having an extraction plate with a variable thickness is disclosed.
Alexandre Likhanskii, Alexander S. Perel, Jay T. Scheuer, Bon-Woong Koo, Robert C. Lindberg, Peter F. Kurunczi, Graham Wright
Filed: 13 Sep 21
Utility
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7 Nov 23
A system and method for optimizing a ribbon ion beam in a beam line implantation system is disclosed.
Eric D. Hermanson, Nevin Clay, Antonella Cucchetti, Philip Layne, Sudhakar Mahalingam, Michael Simmons
Filed: 9 Dec 21
Utility
aaw3427tqxvbag3627jotohfsna0k gjcgvul87qs74j8opi
7 Nov 23
Aspects of the disclosure relate to apparatus for the fabrication of waveguides.
Ludovic Godet, Joseph C. Olson, Rutger Meyer Timmerman Thijssen
Filed: 17 Dec 19
Utility
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7 Nov 23
Embodiments provided herein generally include apparatus, plasma processing systems and methods for generation of a waveform for plasma processing of a substrate in a processing chamber.
Yang Yang, Yue Guo, Kartik Ramaswamy
Filed: 16 Jun 21
Utility
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7 Nov 23
A reactive particles supply system that may include an adjustable gas supply unit that is arranged to supply gas and to set a gas condition, a reactive particles supply unit that may be arranged to receive the gas, and an adjustable reactive particles output unit that may include a reactive particles input, a second reactive particles output, and a reactive particles path.
Asaf Gutman, Irit Ruach-Nir, Kfir Luria, Sven Ruhle, Guy Eytan
Filed: 21 Dec 20
Utility
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7 Nov 23
Exemplary semiconductor processing chambers may include a gasbox.
Fang Ruan, Prashant Kumar Kulshreshtha, Rajaram Narayanan, Diwakar Kedlaya
Filed: 23 Apr 20
Utility
7asenuxp11fquq66dy7oxdu8pl1f7kaqxsv0flo21pev8e06rfzn206g45lx
7 Nov 23
Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber.
Karthikeyan Balaraman, Sathyanarayana Bindiganavale, Rajasekhar Patibandla, Balamurugan Ramasamy, Kartik Shah, Umesh M. Kelkar, Mats Larsson, Kevin A. Papke, William M. Lu
Filed: 2 May 19
Utility
3ark8mwpy6xcqv6m0ysurj44ce6pr8cs9bnyl7i94ivcteh5w6hn9ea406b6
7 Nov 23
Embodiments described herein provide methods and apparatus used to control a processing result profile proximate to a circumferential edge of a substrate during the plasma-assisted processing thereof.
James Rogers, Linying Cui, Rajinder Dhindsa
Filed: 18 Jun 21
Utility
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7 Nov 23
Methods and apparatus for processing substrates are disclosed.
Xiaodong Wang, Joung Joo Lee, Fuhong Zhang, Martin Lee Riker, Keith A. Miller, William Fruchterman, Rongjun Wang, Adolph Miller Allen, Shouyin Zhang, Xianmin Tang
Filed: 30 Sep 21
Utility
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7 Nov 23
Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.
Douglas Brian Baumgarten, Russell Kaplan, Amitabh Puri, Paul B. Reuter
Filed: 9 Jul 20
Utility
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7 Nov 23
Susceptor assemblies comprising a susceptor base and a plurality of pie-shaped skins thereon are described.
Kaushal Gangakhedkar, Kallol Bera, Joseph Yudovsky
Filed: 12 Dec 22
Utility
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7 Nov 23
Methods for forming light emitting diodes (LEDs) that leverage cavity profiles and induced stresses to alter emitted wavelengths of the LEDs.
Taichou Papo Chen
Filed: 30 Dec 20
Utility
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7 Nov 23
An exciter for a high frequency resonator.
Costel Biloiu, David T. Blahnik, Wai-Ming Tam, Charles T. Carlson, Frank Sinclair
Filed: 20 Oct 21
Utility
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7 Nov 23
Embodiments described herein generally relate to apparatus for fabricating semiconductor devices.
Shu-Kwan Lau, Lit Ping Lam, Preetham Rao, Kartik Shah, Ian Ong, Nyi O. Myo, Brian H. Burrows
Filed: 6 Oct 22
Utility
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7 Nov 23
A concentration sensor assembly can include a vaporization chamber having a compound.
Vivek B. Shah, Varoujan Chakarian, Upendra Ummethala
Filed: 1 Jul 21
Utility
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7 Nov 23
A method and a system for adding a floating analog voltage signal over a reference analog voltage signal.
Shem Yehoyda Prazot Ofenburg, Pavel Komissarov
Filed: 30 Mar 22
Utility
0m5hphk9zafq0sjw5d9hemomhoqwpbq7gq83qywt5b9w
31 Oct 23
Disclosed herein is s computer-based method for obtaining and analyzing multi-die scan data of a patterned wafer.
Ron Naftali, Yariv Simovitch, Guy Shwartz, Ido Almog
Filed: 6 Oct 21
Utility
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31 Oct 23
Exemplary semiconductor processing chambers may include an inlet manifold defining a central aperture.
Fang Ruan, Diwakar Kedlaya, Truong Van Nguyen, Mingle Tong, Sherry L. Mings, Venkata Sharat Chandra Parimi
Filed: 4 Nov 20