1538 patents
Page 8 of 77
Utility
Tunable upper plasma-exclusion-zone ring for a bevel etcher
12 Sep 23
A tunable upper plasma exclusion zone (PEZ) ring adjusts a distance of plasma during processing in a processing chamber and includes: a lower surface that includes: a horizontal portion; and an upwardly tapered outer portion that is conical and that extends outwardly and upwardly from the horizontal portion at an upward taper angle of about 5° to 50° with respect to the horizontal portion, where an outer diameter of the upwardly tapered outer portion is greater than 300 millimeters (mm), and where an inner diameter where the upwardly tapered outer portion begins to extend upwardly is less than 300 mm.
Jack Chen, Adam Liron, Gregory Sexton
Filed: 29 Jan 21
Utility
Substrate Processing Systems Including Gas Delivery System with Reduced Dead Legs
7 Sep 23
A gas delivery system includes a 2-port valve including a first valve located between a first port and a second port.
Ramesh CHANDRASEKHARAN, Antonio Xavier, Frank Loren Pasquale, Ryan Blaquiere, Jennifer Leigh Petraglia, Meenakshi Mamunuru
Filed: 12 May 23
Utility
Removable Showerhead Faceplate for Semiconductor Processing Tools
7 Sep 23
Showerheads for semiconductor processing operations are disclosed that have removable faceplates and various features that provide additional benefit in the context of removable faceplates.
Manjesh Shankarnarayana, Bin Luo, Eric H. Lenz
Filed: 4 Jun 21
Utility
Remote Plasma Source Showerhead Assembly with Aluminum Fluoride Plasma Exposed Surface
7 Sep 23
A component of a processing chamber in a substrate processing system includes a base material comprising aluminum, the base material having one or more surfaces, a diffusion barrier layer formed on the surfaces of the base material, wherein the diffusion barrier layer includes magnesium and fluorine (F), and a coating formed on the surfaces.
Eric A. PAPE, Shih-Chung KON, Pankaj HAZARIKA, Lin XU
Filed: 24 Jun 21
Utility
Magnetic Field Control System
7 Sep 23
A substrate processing apparatus includes a vacuum chamber with a processing zone for processing a substrate using plasma and at least one magnetic field source configured to generate one or more active magnetic fields through the processing zone.
Alecia Chantalle Griffin, Anthony de la Llera, Peter Bradley Phillips, Bing Ji
Filed: 17 May 22
Utility
Pulsing RF Coils of a Plasma Chamber In Reverse Synchronization
7 Sep 23
Systems and methods for pulsing radio frequency (RF) coils are described.
Juline Shoeb, Tom A. Kamp, Alexander Miller Paterson
Filed: 1 Jul 21
Utility
Systems and Methods for Analyzing and Intelligently Collecting Sensor Data
7 Sep 23
A method for controlling a plasma tool is described.
John C. Valcore, JR., Travis Joseph Wong, Ying Wu, Sandeep Mudunuri, Bostjan Pust, Shreeram Jyoti Dash
Filed: 31 Aug 21
Utility
Removing bubbles from plating cells
5 Sep 23
An electroplating apparatus includes an electrode at the bottom of a chamber, an ionically resistive element with through holes arranged horizontally at the top of the chamber, with a membrane in the middle.
Stephen J. Banik, Bryan L. Buckalew, Gabriel Hay Graham, Alfred Bostick, Sean Wilbur, John Floyd Ostrowski
Filed: 23 Dec 21
Utility
Pedestal Thermal Profile Tuning Using Multiple Heated Zones and Thermal Voids
31 Aug 23
A substrate support includes a body and a thermal void.
Gary B. LIND, Alok MAHADEVA
Filed: 4 Jun 21
Utility
Automated Showerhead Tilt Adjustment
31 Aug 23
In some examples, an automated tilting system is provided for adjusting an orientation of a component in a substrate processing chamber.
Sam Jafarian Tehrani, Bryan Anthony Cmelak, Jacob Lee Hiester, Bin Luo, John Wiltse
Filed: 10 Jun 21
Utility
Vacuum-integrated Hardmask Processes and Apparatus
31 Aug 23
Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution.
Jeffrey MARKS, George Andrew ANTONELLI, Richard A. GOTTSCHO, Dennis M. HAUSMANN, Adrien LAVOIE, Thomas Joseph KNISLEY, Sirish K. REDDY, Bhadri N. VARADARAJAN, Artur KOLICS
Filed: 10 Apr 23
Utility
Solenoid Bank with Standby Solenoid Valves for Controlling Pneumatic Valves of a Substrate Processing System
31 Aug 23
A fluid control system for a substrate processing system includes (M + N) inlets configured to fluidly connect to (M) solenoid valves and (N) standby solenoid valves, respectively, where (M) and (N) are integers greater than zero. (M) outputs are configured to be fluidly connected to (M) pneumatic valves.
Swajeeth Pilot PANCHANGAM, Vinayakaraddy GULABAL, Yeshwanth SAGHI, Keerthi GOWDARU
Filed: 17 Aug 21
Utility
Etching of Indium Gallium Zinc Oxide
31 Aug 23
Indium gallium zinc oxide can be etched by providing a wafer having a layer of indium gallium zinc oxide to a processing chamber, heating the wafer to a first temperature, flowing a first chemical species comprising a fluoride to create a layer of indium gallium zinc oxyfluoride, and removing the layer of indium gallium zinc oxyfluoride by flowing a second chemical species comprising an alkyl aluminum halide, an aluminum alkalide, an organoaluminium compound, a diketone, silicon halide, silane, halogenated silane, or alkyl silicon halide.
Aaron Lynn Routzahn, Andreas Fischer, Thorsten Bernd Lill
Filed: 15 Mar 22
Utility
Cooling for a Plasma-based Reactor
31 Aug 23
In one embodiment, the disclosed apparatus is a heat-pipe cooling system that includes a conical structure having an upper portion that is configured to be formed above a dielectric window with the conical structure being configured to condense vapor from a heat-transfer fluid placed or incorporated within a volume formed between the dielectric window and the conical structure.
John Stephen Drewery, Neil Martin Paul Benjamin
Filed: 2 May 23
Utility
Low Frequency RF Generator and Associated Electrostatic Chuck
31 Aug 23
A system having the low frequency RF generator is described.
Alexei M. Marakhtanov, Felix Leib Kozakevich, Bing Ji, Ranadeep Bhowmick, John Patrick Holland, Alexander Matyushkin
Filed: 5 Nov 21
Utility
Controlling Temperature Profiles of Plasma Chamber Components Using Stress Analysis
31 Aug 23
A system for estimating stress on a component of a processing chamber during a process includes a plurality of sensors configured to sense temperatures at a plurality of locations of the component during the process and a controller a controller configured to interpolate the temperatures to estimate a temperature distribution across the component and to estimate the stress on the component during the process.
John DREWERY
Filed: 11 Aug 21
Utility
Atomic Layer Etching of a Semiconductor, a Metal, or a Metal Oxide with Selectivity to a Dielectric
31 Aug 23
Semiconductor processing methods and apparatuses are provided.
Thorsten Bernd Lill, Andreas Fischer, Aaron Lynn Routzahn
Filed: 20 Aug 21
Utility
Synchronization of RF Generators
31 Aug 23
Systems and methods for synchronization of radio frequency (RF) generators are described.
Ying Wu, John Stephen Drewery, Alexander Miller Paterson, Xiang Zhou, Zhuoxian Wang, Yoshie Kimura
Filed: 24 Sep 21
Utility
Adjustable Geometry Trim Coil
31 Aug 23
Methods, systems, apparatuses, and computer programs are presented for controlling etch rate and plasma uniformity using magnetic fields.
Andrew D. Bailey, III
Filed: 24 Jun 21
Utility
Substrate Supports with Multilayer Structure Including Coupled Heater Zones with Local Thermal Control
31 Aug 23
A substrate support assembly for supporting a substrate includes a baseplate, a ceramic plate arranged on the baseplate, and N resistive heaters arranged in X rows and Y columns and coupled to the ceramic plate.
Harmeet SINGH, Slobodan MITROVIC, Darrell EHRLICH, Benny WU
Filed: 2 Aug 21