1538 patents
Page 6 of 77
Utility
Control of Plasma Formation by RF Coupling Structures
12 Oct 23
An apparatus for forming a plasma may include one or more coupling ports to accept a radiofrequency (RF) current.
Hema Swaroop Mopidevi, Lee Chen, Thomas W. Anderson, Shaun Tyler Smith, Neil M.P. Benjamin
Filed: 7 Jun 21
Utility
Etch Selectivity Control In Atomic Layer Etching
12 Oct 23
Apparatuses and methods are provided.
Andreas Fischer, Thorsten Bernd Lill
Filed: 10 Dec 21
Utility
Tin oxide thin film spacers in semiconductor device manufacturing
10 Oct 23
Thin tin oxide films can be used in semiconductor device manufacturing.
David Charles Smith, Richard Wise, Arpan Pravin Mahorowala, Patrick A. van Cleemput, Bart J. van Schravendijk
Filed: 22 Apr 21
Utility
Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal
10 Oct 23
An isolation system includes an input junction coupled to one or more RF power supplies via a match network for receiving radio frequency (RF) power.
Hyungjoon Kim, Sunil Kapoor, Karl Leeser, Vince Burkhart
Filed: 11 Jan 22
Utility
Edge seal for lower electrode assembly
10 Oct 23
An edge seal for sealing an outer surface of a lower electrode assembly configured to support a semiconductor substrate in a plasma processing chamber, the lower electrode assembly including an annular groove defined between a lower member and an upper member of the lower electrode assembly.
David Schaefer, Ambarish Chhatre, Keith William Gaff, Sung Je Kim, Brooke Mesler Lai
Filed: 15 Dec 17
Utility
Plating-deplating Waveform Based Contact Cleaning for a Substrate Electroplating System
5 Oct 23
An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller.
Liu YANG, Quan MA, Zhian HE, Shantinath GHONGADI
Filed: 13 Aug 21
Utility
Shield Body System for a Process Fluid for Chemical And/or Electrolytic Surface Treatment of a Substrate
5 Oct 23
The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid.
Herbert Ă–TZLINGER, Marianne KOLITSCH-MATALN, Harald OKORN-SCHMIDT, Andreas GLEISSNER
Filed: 25 Mar 21
Utility
Method of Forming Photo-sensitive Hybrid Films
5 Oct 23
The present disclosure relates to a film formed with a metal precursor and an organic precursor, as well as methods for forming and employing such films.
Eric Calvin Hansen, Timothy William Weidman, Chenghao Wu, Qinghuang Lin, Kyle Jordan Blakeney, Adrien LaVoie, Sivananda Krishnan Kanakasabapathy, Samantha S.H. Tan, Richard Wise, Yang Pan, Younghee Lee, Katie Lynn Nardi, Kevin Li Gu, Boris Volosskiy
Filed: 16 Jul 21
Utility
Dry Backside and Bevel Edge Clean of Photoresist
5 Oct 23
Dry backside and bevel edge clean is performed without exposure to plasma to remove unwanted photoresist material from a substrate.
Daniel PETER, Jengyi YU, Samantha Siamhwa TAN, Meng XUE, Da LI, Keith Edward DAWSON, Clint Edward THOMAS, John Danny Baterina PACHO
Filed: 17 Jun 21
Utility
Pulsed Plasma Chamber In Dual Chamber Configuration
5 Oct 23
Embodiments for processing a substrate in a pulsed plasma chamber are provided.
Alexei Marakhtanov, Rajinder Dhindsa, Eric Hudson, Andrew D. Bailey, III
Filed: 6 Jun 23
Utility
Vacuum Pump Protection Against Deposition Byproduct Buildup
5 Oct 23
A processing chamber such as a plasma etch chamber can perform deposition and etch operations, where byproducts of the deposition and etch operations can build up in a vacuum pump system fluidly coupled to the processing chamber.
John Stephen DREWERY, Tom A. KAMP, Haoquan YAN, John Edward DAUGHERTY, Ali Sucipto TAN, Ming-Kuei TSENG, Bruce Edmund FREEMAN
Filed: 6 Jun 23
Utility
Impurity Reduction In Silicon-containing Films
5 Oct 23
Various embodiments herein relate to methods and apparatus for depositing doped and undoped silicon-containing films having a high degree of purity.
Awnish Gupta, Bart J. Van Schravendijk, Jason Alexander Varnell, Joseph R. Abel, Jennifer Leigh Petraglia, Adrien LaVoie
Filed: 27 Jul 21
Utility
Systems and Methods for Use of Low Frequency Harmonics in Bias Radiofrequency Supply to Control Uniformity of Plasma Process Results Across Substrate
5 Oct 23
First, second, third, and fourth radiofrequency (RF) signal generators generate first, second, third, and fourth RF signals, respectively, having first, second, third, and fourth frequencies, respectively.
Alexei Marakhtanov, Felix Leib Kozakevich, Ranadeep Bhowmick, John Holland
Filed: 23 Jun 21
Utility
Magnesium Aluminum Oxynitride Component for Use In a Plasma Processing Chamber
5 Oct 23
A component for use in a plasma processing chamber system is START provided.
Pankaj HAZARIKA, Joel HOLLINGSWORTH, Matthew Brian SCHICK, Pratima G.N. RAO
Filed: 27 Oct 21
Utility
Erosion Resistant Plasma Processing Chamber Components
5 Oct 23
A component for use in a plasma processing chamber is provided.
Harmeet SINGH, Robin KOSHY, Adrian RADOCEA, Lin XU, Justin Charles CANNIFF, Simon GOSSELIN
Filed: 17 Aug 21
Utility
Wafer Edge Deposition for Wafer Level Packaging
5 Oct 23
Semiconductor processing methods and apparatuses are provided.
Xuefeng Hua, Jack Chen, Ian Scot Latchford, Chia-Shin Lin, Chanthavisa Keovisai
Filed: 13 Aug 21
Utility
Selective Etching and Deposition of Memory Layers to Provide Capacitor-to-active Silicon Electrical Coupling
5 Oct 23
A substrate processing system includes a memory that stores a recipe of an electrical coupling process for electrical coupling a capacitor to an active silicon region of a memory structure.
Ratndeep SRIVASTAVA, Hui GAO, Samantha DOAN, Ganesh UPADHYAYA, Gowri Channa KAMARTHY
Filed: 16 Mar 22
Utility
Wafer Level Uniformity Control In Remote Plasma Film Deposition
28 Sep 23
An assembly for use in a process chamber for depositing a film on a wafer.
Geoffrey HOHN, Huatan QIU, Rachel E. BATZER, Guangbi YUAN, Zhe GUI
Filed: 1 Jun 23
Utility
Reducing Intralevel Capacitance In Semiconductor Devices
28 Sep 23
Methods of forming air gaps in hole and trench structures are disclosed.
Joseph R. ABEL, Bart J. VAN SCHRAVENDIJK, Ian John CURTIN, Douglas Walter AGNEW, Dustin Zachary AUSTIN, Awnish GUPTA
Filed: 28 Jun 21
Utility
Apparatus for thermal control of tubing assembly and associated methods
26 Sep 23
Tubing structures are connected to each other to form a tubing assembly having one or more fluid pathways from a fluid entrance to a fluid exit.
Karl F. Leeser
Filed: 13 Mar 20