1538 patents
Page 2 of 77
Utility
Reflectometer to Monitor Substrate Movement
28 Dec 23
Various embodiments include a reflectometer and a reflectometry system for monitoring movements of a substrate, such as a silicon wafer.
Eric A. Pape, Dmitry Opaits, Jorge Luque, Jeffrey D. Bonde, Siyuan Tian
Filed: 11 Sep 23
Utility
MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY
28 Dec 23
Semiconductor processing tools with multi-station processing chambers are provided that include a rotational bearing mechanism that allows a top plate assembly thereof to be rotated during maintenance and service operations.
Karl Frederick Leeser, Adrien LaVoie
Filed: 26 Oct 21
Utility
Apparatuses and Methods for Avoiding Electrical Breakdown from RF Terminal to Adjacent Non-rf Terminal
28 Dec 23
An isolation system includes an input junction coupled to one or more RF power supplies via a match network for receiving radio frequency (RF) power.
Hyungjoon Kim, Sunil Kapoor, Karl Leeser, Vince Burkhart
Filed: 11 Sep 23
Utility
Process Kit De-bubbling
21 Dec 23
In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate.
James Isaac Fortner, Steven T. Mayer, Stephen J. Banik
Filed: 30 Nov 21
Utility
Ceramic Component with Channels
21 Dec 23
A method for forming a component for a plasma processing chamber is provided.
John Michael KERNS, David Joseph WETZEL, Lin XU, Pankaj HAZARIKA, Douglas DETERT, Lei LIU, Eric A. PAPE
Filed: 1 Nov 21
Utility
Apparatus for Processing a Wafer-shaped Article
21 Dec 23
An apparatus for processing a wafer-shaped article, the apparatus comprising: a support for supporting the wafer-shaped article; and a liquid dispenser for dispensing a processing liquid onto a surface of the wafer-shaped article supported by the support; wherein the liquid dispenser comprises a nozzle assembly, the nozzle assembly comprising: an inlet portion; a dispensing nozzle; and a static throttle between the inlet portion and the dispensing nozzle, the static throttle comprising a plurality of flow passages through which the processing liquid can flow from the inlet portion to the dispensing nozzle.
Karl-Heinz HOHENWARTER, Bhaskar BANDARAPU, Christian PUTZI
Filed: 14 Oct 21
Utility
Multi-plate electrostatic chucks with ceramic baseplates
19 Dec 23
An electrostatic chuck for a substrate processing system is provided.
Feng Wang, Keith Gaff, Christopher Kimball
Filed: 23 Feb 18
Utility
Doped or undoped silicon carbide deposition and remote hydrogen plasma exposure for gapfill
19 Dec 23
A doped or undoped silicon carbide (SiCxOyNz) film can be deposited in one or more features of a substrate for gapfill.
Guangbi Yuan, Ieva Narkeviciute, Bo Gong, Bhadri N. Varadarajan
Filed: 10 Oct 19
Utility
Alternating etch and passivation process
19 Dec 23
Tin oxide films are used as spacers and hardmasks in semiconductor device manufacturing.
Seongjun Heo, Jengyi Yu, Chen-Wei Liang, Alan J. Jensen, Samantha S. H. Tan
Filed: 17 Nov 22
Utility
Sublimation Control Using Downstream Pressure Sensing
14 Dec 23
A system to control gas flow includes an ampoule to store a solid precursor.
Marvin Clayton BREES, Davinder SHARMA, Panya WONGSENAKHUM
Filed: 17 Nov 21
Utility
Tunable Upper Plasma-exclusion-zone Ring for a Bevel Etcher
14 Dec 23
A tunable upper plasma exclusion zone (PEZ) ring adjusts a distance of plasma during processing in a processing chamber and includes: a lower surface that includes: a horizontal portion; and an upwardly tapered outer portion that is conical and that extends outwardly and upwardly from the horizontal portion at an upward taper angle of about 5° to 50° with respect to the horizontal portion, where an outer diameter of the upwardly tapered outer portion is greater than 300 millimeters (mm), and where an inner diameter where the upwardly tapered outer portion begins to extend upwardly is less than 300 mm.
Jack CHEN, Adam LIRON, Gregory SEXTON
Filed: 24 Aug 23
Utility
Localized Plasma Arc Prevention Via Purge Ring
14 Dec 23
A purge ring including a supply port configured for receiving gas.
Karl Frederick Leeser, Bradley John Baker, Arun Keshavamurthy, Sassan Roham
Filed: 22 Oct 21
Utility
Carrier Ring for Floating TCP Chamber Gas Plate
14 Dec 23
A gas distribution assembly for a processing chamber in a substrate processing system includes a gas plate including a plurality of holes configured to supply a gas mixture into an interior of the processing chamber and a carrier ring configured to support the gas plate.
Gordon PENG, Ambarish CHHATRE, Craig ROSSLEE, Dan MAROHL, David SETTON
Filed: 14 Sep 21
Utility
Substrate Processing System Tools for Monitoring, Assessing and Responding Based on Health Including Sensor Mapping and Triggered Datalogging
14 Dec 23
A health monitoring, assessing and response system includes an interface and a controller.
Bridget Hill FREESE, Scott BALDWIN, Justin TANG, Raymond CHAU, Thor Andreas RAABE, Robert J. STEGER, Lin ZHU
Filed: 3 Nov 21
Utility
Predictive Maintenance for Semiconductor Manufacturing Equipment
14 Dec 23
Various embodiments herein relate to systems and methods for predictive maintenance for semiconductor manufacturing equipment.
Jian Guo, Sassan Roham, Kapil Sawlani, Xiaoqiang Jin, Michal Danek, Brian Joseph Williams, Natan Solomon
Filed: 9 Nov 21
Utility
Removing metal contamination from surfaces of a processing chamber
12 Dec 23
A method for cleaning surfaces of a substrate processing chamber includes a) supplying a first gas selected from a group consisting of silicon tetrachloride (SiCl4), carbon tetrachloride (CCl4), a hydrocarbon (CxHy where x and y are integers) and molecular chlorine (Cl2), boron trichloride (BCl3), and thionyl chloride (SOCl2); b) striking plasma in the substrate processing chamber to etch the surfaces of the substrate processing chamber; c) extinguishing the plasma and evacuating the substrate processing chamber; d) supplying a second gas including fluorine species; e) striking plasma in the substrate processing chamber to etch the surfaces of the substrate processing chamber; and f) extinguishing the plasma and evacuating the substrate processing chamber.
Jengyi Yu, Samantha SiamHwa Tan, Seongjun Heo, Ge Yuan, Siva Krishnan Kanakasabapathy
Filed: 30 Dec 22
Utility
Cold Edge Low Temperature Electrostatic Chuck
7 Dec 23
An electrostatic chuck is provided.
Ambarish Chhatre, Patrick Chung, Dan Marohl, Craig A. Rosslee, David A. Setton, Mohammad Sohail Shaik
Filed: 9 Sep 21
Utility
Auto-calibration to a Station of a Process Module That Spins a Wafer
7 Dec 23
A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process.
Jacob L. Hiester, Richard Blank, Peter Thaulad, Paul Konkola
Filed: 11 Aug 23
Utility
Wafer handling robot with radial gas curtain and/or interior volume control
5 Dec 23
A collar may be provided having an aperture through it through which the turret of a wafer handling robot may be extended or retracted.
Charles N. Ditmore, Richard M. Blank
Filed: 23 Feb 21
Utility
Depositing a carbon hardmask by high power pulsed low frequency RF
5 Dec 23
Methods and related apparatus for depositing an ashable hard mask (AHM) on a substrate include pulsing a low frequency radio frequency component at a high power.
Matthew Scott Weimer, Pramod Subramonium, Ragesh Puthenkovilakam, Rujun Bai, David French
Filed: 28 May 20