1538 patents
Page 5 of 77
Utility
Plasma-exclusion-zone Rings for Processing Notched Wafers
2 Nov 23
A plasma-exclusion-zone ring for a substrate processing system that is configured to process a substrate includes a ring-shaped body, an upper portion of the ring-shaped body, a base and a plasma-exclusion-zone ring notch.
Xuefeng HUA, Jack CHEN, Gnanamani AMBUROSE, Dan ZHANG, Chang-Wei HUANG, Chia-Shin LIN
Filed: 26 Mar 21
Utility
Multi-station Processing Tools with Station-varying Support Features for Backside Processing
2 Nov 23
Multi-station processing tools with station-varying support features for backside processing are provided.
Nick Ray Linebarger, JR., Fayaz A. Shaikh, Arul N. Dhas
Filed: 21 Jun 21
Utility
Matchless Plasma Source for Semiconductor Wafer Fabrication
2 Nov 23
A matchless plasma source is described.
Maolin Long, Yuhou Wang, Ricky Marsh, Alex Paterson
Filed: 23 Jun 23
Utility
Multi-layer Hardmask for Defect Reduction In Euv Patterning
26 Oct 23
Various embodiments herein relate to methods, apparatus, and systems that utilize a multi-layer hardmask in the context of patterning a semiconductor substrate using extreme ultraviolet photoresist.
Bhaskar NAGABHIRAVA, Phillip FRIDDLE, Ekimini Anuja DE SILVA, Jennifer CHURCH, Dominik METZLER, Nelson FELIX
Filed: 23 Feb 21
Utility
Anodization for Metal Matrix Composite Semiconductor Processing Chamber Components
26 Oct 23
A component of a semiconductor processing chamber formed of a metal matrix component having an anodized layer on a surface thereof.
Debanjan DAS, Eric SAMULON, Darrell EHRLICH
Filed: 23 Aug 21
Utility
Electrohydrodynamic Ejection Printing and Electroplating for Photoresist-free Formation of Metal Features
26 Oct 23
Methods, inks, apparatus, and systems for forming metal features on semiconductor substrates are provided herein.
Steven T. Mayer, Kari Thorkelsson
Filed: 27 Jan 21
Utility
Accurate Determination of Radio Frequency Power Through Digital Inversion of Sensor Effects
26 Oct 23
An apparatus may include one or more measurement sensors, which may measure power coupled to one or more process stations of the apparatus.
Ashish Saurabh, Karl Frederick Leeser
Filed: 22 Jun 21
Utility
Non-elastomeric, non-polymeric, non-metallic membrane valves for semiconductor processing equipment
24 Oct 23
An apparatus may be provided that includes a substrate having one or more microfluidic valve structures.
Mariusch Gregor, Theodoros Panagopoulos, Thorsten Bernd Lill
Filed: 23 Jul 20
Utility
Methods and apparatus for controlling plasma in a plasma processing system
24 Oct 23
Methods and apparatus for processing a substrate in a multi-frequency plasma processing chamber are disclosed.
John C. Valcore, Jr., Bradford J. Lyndaker
Filed: 29 Jun 18
Utility
Systems for reverse pulsing
24 Oct 23
Systems and methods for reverse pulsing are described.
Maolin Long, Zhongkui Tan, Ying Wu, Qian Fu, Alex Paterson, John Drewery
Filed: 11 Sep 17
Utility
Replaceable and/or collapsible edge ring assemblies for plasma sheath tuning incorporating edge ring positioning and centering features
24 Oct 23
A first edge ring for a substrate support is provided.
Alejandro Sanchez, Grayson Ford, Darrell Ehrlich, Aravind Alwan, Kevin Leung, Anthony Contreras, Zhumin Han, Raphael Casaes, Joanna Wu
Filed: 10 Sep 18
Utility
Spark Plasma Sintered Component for Plasma Processing Chamber
19 Oct 23
A method for making a component for use in a plasma processing chamber is provided.
Lin XU, Harmeet SINGH, Pankaj HAZARIKA, Satish SRINIVASAN, Robin KOSHY
Filed: 3 Nov 21
Utility
Remote Plasma Architecture for True Radical Processing
19 Oct 23
A showerhead comprises first, second, and third components.
Bhadri VARADARAJAN, Aaron DURBIN, Huatan QIU, Bo GONG, Rachel E. BATZER, Gopinath BHIMARASETTI, Aaron Blake MILLER, Patrick G. BREILING, Geoffrey HOHN
Filed: 21 Sep 21
Utility
Passivation Chemistry for Plasma Etching
19 Oct 23
Various embodiments herein relate to methods and apparatus for etching a recessed feature in a material on a substrate.
Eric A. Hudson
Filed: 17 Sep 21
Utility
Computational Representation of Deposition Processes
19 Oct 23
A system, method, and/or non-transitory computer readable medium may implement or be configured to implement the following computational operations associated with electrochemical or vapor phase deposition: (a) defining an interface of a substrate where deposition of a deposited material is to occur or is occurring; (b) using a computational model of the deposition to determine a local deposition rate of the deposited material at multiple locations on the interface, where the computational model of the deposition computes the local deposition rate as a function of one or more geometric parameters of the one or more recessed or protruding features; and (c) computationally adjusting the location of the interface to produce an adjusted interface.
Qing Peng Wang, Yu De Chen, Shi Hao Huang, Rui Bao, Joseph Ervin
Filed: 26 Jul 21
Utility
Self-aligned vertical integration of three-terminal memory devices
17 Oct 23
A three-dimensional (3D) memory structure includes memory cells and a plurality of oxide layers and a plurality of word line layers.
Thorsten Lill, Meihua Shen, John Hoang, Hui-Jung Wu, Gereng Gunawan, Yang Pan
Filed: 22 Oct 19
Utility
Confinement ring for use in a plasma processing system
17 Oct 23
An apparatus for confining plasma within a plasma processing chamber is provided.
Rajinder Dhindsa, Akira Koshiishi, Alexei Marakhatanov
Filed: 26 Apr 22
Utility
Low Resistivity Contacts and Interconnects
12 Oct 23
Methods of filling features including metal and dielectric surfaces with conductive materials involve cleaning the metal surfaces with little or no damage to the dielectric surfaces.
Raihan M. TARAFDAR, Chiukin Steven LAI, Jeong-Seok NA
Filed: 21 May 21
Utility
Rib Cover for Multi-station Processing Modules
12 Oct 23
In some examples, a rib cover is provided for a multi-station processing module having a rib disposed between adjacent processing chambers.
Keith Joseph Martin, Todd Schroeder, Kevin M. McLaughlin, Jiuyuan Nie, Jialing Yang, Chee Whye Woo
Filed: 30 Aug 21
Utility
Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity
12 Oct 23
A carrier wafer for receiving a wafer and supporting the wafer during semiconductor processing operations.
Fayaz A. Shaikh, Taide Tan
Filed: 22 May 23