1538 patents
Page 3 of 77
Utility
Showerhead faceplate having flow apertures configured for hollow cathode discharge suppression
5 Dec 23
A faceplate of a showerhead has a bottom side that faces a plasma generation region and a top side that faces a plenum into which a process gas is supplied during operation of a substrate processing system.
Michael John Selep, Patrick G. Breiling, Karl Frederick Leeser, Timothy Scott Thomas, David William Kamp, Sean M. Donnelly
Filed: 29 Nov 22
Utility
High power cable for heated components in RF environment
5 Dec 23
A substrate support includes an edge ring, one or more heating elements, and a cable configured to provide power from a power source to the edge ring and the one or more heating elements.
Seyed Jafar Jafarian-Tehrani, Kenneth Walter Finnegan, Sean O'Brien, Benson Q. Tong
Filed: 25 Jun 18
Utility
Carrier ring designs for controlling deposition on wafer bevel/edge
5 Dec 23
Various carrier ring designs and configurations to control an amount of deposition at a wafer's front side and bevel edge are provided.
Michael J. Janicki, Brian Joseph Williams
Filed: 16 Dec 21
Utility
Systems and methods for pulse width modulated dose control
5 Dec 23
A substrate processing system for treating a substrate includes a manifold, a plurality of injector assemblies located in a processing chamber, and a dose controller.
Mariusch Gregor
Filed: 2 Jan 23
Utility
Protective coating for electrostatic chucks
5 Dec 23
An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both.
Stephen Topping, Vincent Burkhart
Filed: 7 Jul 21
Utility
Determination of recipes for manufacturing semiconductor devices
5 Dec 23
Methods, systems, and computer programs are presented for determining the recipe for manufacturing a semiconductor with the use of machine learning (ML) to accelerate the definition of recipes.
Kapil Umesh Sawlani, Atashi Basu, David Michael Fried, Michal Danek, Emily Ann Alden
Filed: 22 Oct 20
Utility
Selective Deposition of Metal Oxides Using Silanes As an Inhibitor
30 Nov 23
The present disclosure relates to methods and apparatuses for selective deposition on a surface.
Kashish SHARMA, Paul C. LEMAIRE, Dennis M. HAUSMANN
Filed: 23 Sep 21
Utility
Oxidation Resistant Protective Layer In Chamber Conditioning
30 Nov 23
In some examples, a method for conditioning a wafer processing chamber comprises setting a pressure in the chamber to a predetermined pressure range, setting a temperature of the chamber to a predetermined temperature, and supplying a process gas mixture to a gas distribution device within the chamber.
Fengyuan LAI, Bo GONG, Guangbi YUAN, Chen-Hua HSU, Bhadri VARADARAJAN
Filed: 9 Aug 23
Utility
Axially Cooled Metal Showerheads for High Temperature Processes
30 Nov 23
A base portion of a showerhead is made of a first metallic material, has a first surface including a gas inlet and a second surface, and includes passages.
Lipyeow YAP, Nivin VIKRAMAN, Panya WONGSENAKHUM, Gary B. LIND
Filed: 2 Jun 21
Utility
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
28 Nov 23
A method includes arranging a substrate in a processing chamber, and exposing the substrate to a gas mixture including a first metal precursor gas and a second metal precursor gas to deposit a first metal precursor and a second metal precursor onto the substrate at the same time.
Ilanit Fisher, Raashina Humayun, Michal Danek, Patrick Van Cleemput, Shruti Thombare
Filed: 6 Dec 18
Utility
Carrier ring designs for controlling deposition on wafer bevel/edge
28 Nov 23
Various carrier ring designs and configurations to control an amount of deposition at a wafer's front side and bevel edge are provided.
Michael J. Janicki, Brian Joseph Williams
Filed: 16 Dec 21
Utility
Conformal damage-free encapsulation of chalcogenide materials
28 Nov 23
Methods and apparatuses for forming an encapsulation bilayer over a chalcogenide material on a semiconductor substrate are provided.
James Samuel Sims, Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn Merced Kelchner, John Hoang, Alexander Dulkin, Danna Qian, Vikrant Rai
Filed: 20 Dec 21
Utility
Compact Modular Gas Distribution Plumbing and Heating System for Multi-station Deposition Modules
23 Nov 23
A gas distribution arrangement to provide gas mixtures to processing stations in a substrate processing system comprises a first and second valve inlet blocks to supply first and second precursor gas mixtures.
Thadeous BAMFORD
Filed: 24 Sep 21
Utility
Vapor Delivery Device
23 Nov 23
An evaporator assembly for a processing chamber in a substrate processing system comprises a canister configured to store and heat precursor liquid and an evaporator valve block mounted the canister.
Thadeous BAMFORD, Jorgr REYES, Emile DRAPER
Filed: 5 Oct 21
Utility
Showerhead with Integral Divert Flow Path
23 Nov 23
A showerhead for a processing chamber comprises a body having upper, lower, and side surfaces defining a plenum; and a plurality of through holes provided on the lower surface of the body.
Gopinath BHIMARASETTI, Aaron Blake MILLER, Rachel E. BATZER
Filed: 30 Sep 21
Utility
Real-time control of temperature in a plasma chamber
21 Nov 23
Systems and methods for real-time control of temperature within a plasma chamber are described.
Changyou Jing
Filed: 26 Jul 21
Utility
Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structures
21 Nov 23
A gas mixture for treating a substrate in a substrate processing system includes hydrogen fluoride gas, a vapor of an alcohol, an additive consisting of a base, and a carrier gas.
Ji Zhu, Gerome Michel Dominique Melaet, Nathan Lavdovsky, Rafal Dylewicz, David Mui
Filed: 26 Sep 19
Utility
Selective processing with etch residue-based inhibitors
21 Nov 23
Selective deposition of a sacrificial material on a semiconductor substrate, the substrate having a surface with a plurality of regions of substrate materials having different selectivities for the sacrificial material, may be conducted such that substantial deposition of the sacrificial material occurs on a first region of the substrate surface, and no substantial deposition occurs on a second region of the substrate surface.
Kashish Sharma, Taeseung Kim, Samantha Tan, Dennis M. Hausmann
Filed: 15 Jan 19
Utility
Control of wafer bow in multiple stations
21 Nov 23
A system for controlling of wafer bow in plasma processing stations is described.
Edward Augustyniak, David French, Sunil Kapoor, Yukinori Sakiyama, George Thomas
Filed: 29 Oct 21
Utility
Knurling edge driving tool
21 Nov 23
A tool for driving a component with a knurling pattern around an outer surface of the component is provided.
Terrence George Bernier, Timothy Scott Thomas, Allan Jones, Jeffrey Simpson
Filed: 11 Dec 17