1538 patents
Page 4 of 77
Utility
Precursors for deposition of molybdenum-containing films
21 Nov 23
Molybdenum-containing films are deposited on semiconductor substrates using reactions of molybdenum-containing precursors in ALD and CVD processes.
Kyle Jordan Blakeney
Filed: 6 Mar 20
Utility
Faceless Showerhead
16 Nov 23
In some examples, a faceless showerhead comprises a body including a backing plate, the body devoid of a faceplate or plenum; a gas supply stem to admit gas into the showerhead; and a baffle supported adjacent the backing plate or the gas supply stem.
Shriram Vasant Bapat, Pankaj Ghanshyam Ramnani, Brian Joseph Williams, Christopher Matthew Jones, Curtis W. Bailey, Emile Draper, Nagraj Shankar
Filed: 8 Oct 21
Utility
Moveable Edge Rings for Plasma Processing Systems
16 Nov 23
A moveable edge ring system for a substrate processing system includes a top moveable ring including a first annular body arranged around a substrate support.
Christopher KIMBALL, Darrell EHRLICH, Yuma OHKURA
Filed: 29 Sep 21
Utility
Wear Compensating Confinement Ring
16 Nov 23
A confinement ring for use in a plasma processing chamber includes a lower horizontal section, a vertical section, and a upper horizontal section.
Adam Christopher Mace, Shahriar Memaran, Robert Charatan, Siwon Jang
Filed: 30 Oct 20
Utility
Profile Optimization for High Aspect Ratio Memory Using an Etch Front Metal Catalyst
16 Nov 23
A method for etching features in a silicon containing stack below a patterned mask in an etch chamber is provided.
Leonid BELAU, Eric HUDSON
Filed: 8 Dec 21
Utility
Systems and Methods for Metastable Activated Radical Selective Strip and Etch Using Dual Plenum Showerhead
16 Nov 23
Several designs of a gas distribution device for a substrate processing system are provided.
Dengliang YANG, Haoquan FANG, David CHEUNG, Gnanamani AMBUROSE, Eunsuk KO, Weiyi LUO, Dan ZHANG
Filed: 3 Jul 23
Utility
High Temperature Pedestal with Extended Electrostatic Chuck Electrode
16 Nov 23
A substrate support configured to support a substrate having a diameter D comprises a first inner electrode and a second inner electrode that are each D-shaped, define a first outer diameter that is less than D, and are configured to be connected to an electrostatic chuck voltage to clamp the substrate to the substrate support.
Feng BI, Yukinori SAKIYAMA, Niraj RANA, Pengyi ZHANG, Simran SHAH, Timothy Scott THOMAS, David FRENCH, Vincent BURKHART
Filed: 28 Sep 21
Utility
Preplating Edge Dry
16 Nov 23
A chamber in a substrate processing system comprises a substrate holder configured to support a substrate, a nozzle arranged above the substrate, the nozzle configured to inject a pre-wetting liquid onto a surface of the substrate during a pre-wetting period, and at least one gas injector arranged radially outward of the nozzle.
Kari THORKELSSON, Stephen J. BANIK, Bryan BUCKALEW
Filed: 29 Sep 21
Utility
Heat-transferring Valve Flexure and Methods
16 Nov 23
In some examples, a valve flexure for a flow control valve is provided.
Karl Frederick Leeser
Filed: 30 Aug 21
Utility
High Precision Edge Ring Centering for Substrate Processing Systems
16 Nov 23
An edge ring centering system for a plasma processing system includes a processing chamber including a substrate support and R edge ring lift pins, where R is an integer greater than or equal to 3.
Hui Ling HAN, Seetharaman RAMACHANDRAN, Marc ESTOQUE
Filed: 23 Mar 20
Utility
Electrostatic chuck for use in semiconductor processing
14 Nov 23
A semiconductor substrate processing apparatus includes a vacuum chamber having a processing zone in which a semiconductor substrate may be processed, a process gas source in fluid communication with the vacuum chamber for supplying a process gas into the vacuum chamber, a showerhead module through which process gas from the process gas source is supplied to the processing zone of the vacuum chamber, and a substrate pedestal module.
Troy Alan Gomm
Filed: 23 Feb 22
Utility
RF Pulsing Within Pulsing for Semiconductor RF Plasma Processing
9 Nov 23
A system and method for generating a radio frequency (RF) waveform are described.
Maolin Long, Yuhou Wang, Ying Wu, Alex Paterson
Filed: 6 Jul 23
Utility
High-conductance Vacuum Valves for Wafer Processing Systems
9 Nov 23
A semiconductor processing chamber performs various wafer processing operations that involve at least one of pumping the chamber to high vacuum states and regulating a vacuum (e.g., during introduction of process gases, as gas infiltrates the chamber, as reactions emit gases, as a wafer off-gases, etc.).
Gabriel Pioux, Allan Ronne
Filed: 23 Jul 21
Utility
Robust Ashable Hard Mask
9 Nov 23
Provided herein are methods and related apparatuses for forming an ashable hard mask (AHM).
Matthew Scott WEIMER, Ragesh PUTHENKOVILAKAM, Kapu Sirish REDDY
Filed: 23 Sep 21
Utility
Apparatus for Processing a Wafer
9 Nov 23
An apparatus for processing a wafer, the apparatus comprising: a rotatable chuck for receiving and rotating a wafer; a heating device arranged to heat a wafer received by the rotatable chuck; a plate that is transparent to radiation emitted by the heating device; and a plate holder that holds an outer periphery of the plate, so as to mount the plate in the plate holder; wherein the plate holder is mountable in the apparatus to position the plate between the heating device and a wafer when the wafer is received by the rotatable chuck.
Michael BRUGGER, Michael PUGGL, Christian PUTZI
Filed: 5 Feb 21
Utility
Deposition Rate Enhancement of Amorphous Carbon Hard Mask Film by Purely Chemical Means
9 Nov 23
Provided herein are methods and related apparatus for depositing an ashable hard mask (AHM) on a substrate at high temperatures using an additive that reduces a competing etch process.
Matthew Scott Weimer, Ragesh Puthenkovilakam, Kapu Sirish Reddy, Chin-Jui Hsu
Filed: 27 Sep 21
Utility
Wafer cleaning method and apparatus therefore
7 Nov 23
The present invention relates to a method for treating the surface of a wafer with multiple liquids, comprising rotating the surface of the wafer and discharging different liquid streams onto the rotating surface in a sequence from separate outlets, wherein the discharge of liquid streams which are contiguous in the sequence overlaps during a transition phase, and wherein during the transition phase the liquid streams merge after exiting said outlets to form a merged liquid stream before impacting the rotating surface.
Christoph Semmelrock, Ulrich Tschinderle, Reinhard Sellmer, Walter Esterl
Filed: 16 Sep 19
Utility
Additive Manufacturing of Silicon Components
2 Nov 23
A method of performing 3D printing of a silicon component includes adding powdered silicon to a 3D printing tool.
Seyedalireza TORBATISARRAF, Abhinav Shekhar RAO, Jihong CHEN, Yi SONG, Jerome HUBACEK, Vijay NITHIANANTHAN
Filed: 26 Apr 21
Utility
Systems for Controlling Plasma Density Distribution Profiles Including Multi-rf Zoned Substrate Supports
2 Nov 23
A substrate processing system includes a substrate support, N RF sources and a controller.
Juline SHOEB, Alexander Miller PATERSON
Filed: 12 Oct 21
Utility
Low Temperature Manifold Assembly for Substrate Processing Systems
2 Nov 23
A manifold assembly for a processing chamber in a substrate processing system includes a manifold.
Gabriel De Jesus SOTO
Filed: 5 May 22