1577 patents
Page 30 of 79
Utility
Semiconductor device with improved signal transmission characteristics
16 Nov 21
The semiconductor device includes a solder ball connected to a pad, and located below the pad, a first wiring electrically connected to the pad, and located above the pad, and a second wiring electrically connected to the first wiring.
Ryuichi Oikawa
Filed: 31 Dec 19
Utility
Semiconductor device and method of manufacturing the same
16 Nov 21
A semiconductor device includes a semiconductor substrate SUB, a semiconductor layer EP formed on the semiconductor substrate SUB, a buried layer PBL formed between the semiconductor layer EP and the semiconductor substrate SUB, an isolation layer PiSO formed in the semiconductor layer EP so as to be in contact with the buried layer PBL, and a conductive film FG formed over the isolation layer PiSO via an insulating film IF, whereby a first capacitive element including the conductive film FG as an upper electrode, the insulating film IF as a capacitive insulating film, and the isolation layer PiSO as a lower electrode, is formed over the semiconductor substrate SUB.
Eisuke Kodama
Filed: 9 Mar 20
Utility
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16 Nov 21
A data communication system has an IoT device, an information processing device capable of performing communication with the IoT device, and a server capable of performing communication with the IoT device and the information processing device.
Takahide Todoroki, Koichi Sato, Kazuhiko Noto
Filed: 10 May 19
Utility
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11 Nov 21
A semiconductor device performs a software lock-step.
Atsushi NAKAMURA, Akihiro YAMAMOTO, Kazuaki TERASHIMA, Manabu KOIKE
Filed: 6 May 20
Utility
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11 Nov 21
An image processing device includes an application execution unit which executes an image processing application, an image processing circuit which performs image processing, a memory control circuit which is capable of accessing a plurality of memories and a memory allocation determination unit which determines a memory allocation of the image data on the basis of memory address management information, operation unit-specific information and application information.
Masaru HASE, Takashi SAITOU
Filed: 6 May 20
Utility
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11 Nov 21
A video encoding device includes a local decode generation unit for generating a reference image based on a result of encoding of a divided image, a compression unit for compressing the reference image to generate a compressed data, a reference image storage determination unit for determining whether to store the compressed data in a memory, and an inter-prediction unit for performing motion vector search for inter-coding based on a reference image stored in the memory.
Maiki HOSOKAWA, Toshiyuki KAYA, Tetsuya SHIBAYAMA, Seiji MOCHIZUKI, Tomohiro UNE, Kazushi AKIE
Filed: 20 Jul 21
Utility
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9 Nov 21
By changing the characteristic impedance of the transmission line depending on the location, the transmission line functions as a band-pass filter.
Ryuichi Oikawa
Filed: 7 Oct 19
Utility
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9 Nov 21
A semiconductor device includes a base member, a multilayer wiring layer, and a first resistive element.
Shunji Kubo, Koichi Ando, Eiji Io, Hideyuki Tajima, Tetsuya Iida
Filed: 2 Dec 19
Utility
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9 Nov 21
Cross talk among wirings formed in an interposer is reduced while increase in a parasitic capacitance among the wirings formed in the interposer is suppressed.
Ryuichi Oikawa
Filed: 18 Dec 18
Utility
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4 Nov 21
The visual inspection device comprises a first illumination device capable of illuminating an top surface of an inspection object, a second illumination device capable of illuminating a bottom surface opposite to the top surface of the inspection object and a first imaging device capable of capturing the top surface of the inspection object.
Hideki WADA
Filed: 30 Apr 20
Utility
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4 Nov 21
A semiconductor device has a first area in which first and third semiconductor elements are formed, a second area in which second and fourth semiconductor elements are formed, and a third area located between the first and second areas.
Shinichi KUWABARA, Yasutaka NAKASHIBA
Filed: 3 Mar 21
Utility
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2 Nov 21
Systems and methods for determining a likelihood of an occurrence of an anomaly in a sensor are described.
Christopher Semanson, Onkar Raut, James Page
Filed: 29 Mar 21
Utility
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28 Oct 21
A semiconductor device includes a first terminal receiving a first signal, a second terminal receiving a second signal, a noise extraction analysis unit extracting a signal of a specific frequency component from the first and the second signal, a feedback unit generating a feedback signal based on a magnitude of the signal of the specific frequency component to cancel the signal of the specific frequency component superimposed on the first and the second signal, and third terminal outputting to the feedback signal to outside.
Yasuhiro SHIRAI
Filed: 24 Apr 20
Utility
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28 Oct 21
The abnormal power supply voltage detection device has a function of accurately detecting the abnormal voltage in accordance with the characteristics of the semiconductor element for each semiconductor chip.
Tadashi KAMEYAMA, Masanori IKEDA, Masataka MINAMI, Kenichi SHIMADA, Yukitoshi TSUBOI
Filed: 22 Apr 20
Utility
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28 Oct 21
A semiconductor device includes: a sensor detecting electric capacitance of a touch key group comprising a plurality of touch keys arranged in a matrix; and a control device configured to perform character recognition based on a change in the electric capacitance of the plurality of touch keys detected by the sensor and on a sampling pattern that is time-series data of a loci.
Shoichi HAMADA, Koji HIRANO, Kakeru KIMURA
Filed: 3 Mar 21
Utility
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28 Oct 21
A semiconductor device has a timer unit and a processing unit.
Kiyoshi HAYASE, Shinichi SHIBAHARA, Yuki HAYAKAWA, Yoichi YUYAMA
Filed: 27 Apr 20
Utility
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28 Oct 21
The semiconductor device includes a first electrode, a second electrode electrically coupled to the first electrode, and a third electrodes electrically coupled to at least one of the first and the second electrode, a first plating deposition portion on the first electrode, a second and a third plating deposition portions formed on the second and the third electrode, respectively.
Takehiro UEDA
Filed: 24 Apr 20
Utility
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28 Oct 21
Reliability and performance of a semiconductor device are improved.
Atsushi YOSHITOMI
Filed: 3 Mar 21
Utility
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26 Oct 21
A semiconductor device includes an analog-digital conversion circuit that converts a voltage at a node between a reference resistor and a sensor resistor into output data, the reference resistor and the sensor resistor being connected in series.
Masuo Okuda, Akemi Watanabe
Filed: 18 Dec 19
Utility
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26 Oct 21
A semiconductor device includes first and second power supply terminals to which a first power supply voltage is supplied, a third power supply terminal to which a second power supply voltage is supplied, a power supply wiring coupled to the first and second power supply terminals, an abnormality detection circuit which diagnoses the first power supply terminal, a first current generation circuit which flows a current from the power supply wiring to the third power supply terminal in a diagnosis, and a second current generation circuit which couples to the power supply wiring at a vicinity of the first power supply terminal and flows a current from the power supply wiring to the third power supply terminal in the diagnosis.
Hirotsugu Nakamura
Filed: 24 Mar 20