7578 patents
Page 25 of 379
Utility
Method for substrate registration and anchoring in inkjet printing
24 Oct 23
A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.
Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho, Han-Wen Chen
Filed: 2 May 22
Utility
Methods of use of a servo control system
24 Oct 23
Disclosed herein are embodiments of a lift apparatus and systems containing a support and at least one lift apparatus for moving a substrate between the support and a transfer plane, using a servo-control system.
Paul Wirth, Behzad Taheri
Filed: 26 Feb 20
Utility
t2cub0nqymfmqj5rybjibqycs3no24d9
24 Oct 23
Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton.
Xi Cen, Kai Wu, Min Heon, Wei Min Chan, Tom Ho Wing Yu, Peiqi Wang, Ju Ik Kang, Feihu Wang, Nobuyuki Sasaki, Chunming Zhou
Filed: 28 Oct 20
Utility
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24 Oct 23
A method for forming microvias for packaging applications is disclosed.
Chintan Buch, Roman Gouk, Steven Verhaverbeke
Filed: 20 Apr 22
Utility
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24 Oct 23
Methods may include providing a device structure including a well formed in an epitaxial layer, and forming a plurality of shielding layers in the device structure, wherein at least one shielding layer is formed between a pair of adjacent sacrificial gates of a plurality of sacrificial gates.
Qintao Zhang, Samphy Hong, Jason Appell, David J. Lee
Filed: 23 Apr 21
Utility
eare5kowrkx9jemaae2rusybfg137dd7eb3iuj2 dr3yymok6phtybpn4s1z
24 Oct 23
Methods of forming a stack without damaging underlying layers are discussed.
Maribel Maldonado-Garcia, Cong Trinh, Mihaela A. Balseanu
Filed: 24 Mar 21
Utility
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19 Oct 23
Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes.
Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
Filed: 24 Apr 23
Utility
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19 Oct 23
A method and circuit for performing vector operations may include, for each sequentially performed operation, operating a switch that corresponds to a current bit-order.
Xiaofeng Zhang, She-Hwa Yen
Filed: 20 Jun 23
Utility
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19 Oct 23
Embodiments of the present disclosure generally relate to optical devices having barrier layers for reduced hardmask diffusion and/or hardmask residue, and related methods of forming the optical devices.
Rui LI, Takashi KURATOMI, Alexia Adilene PORTILLO RIVERA
Filed: 10 Apr 23
Utility
ywjobz6ug8ysmgs245nzc973roc ofnr30tr1kh7mk7gc
19 Oct 23
A method of evaluating a region of interest of a sample including: positioning the sample within in a vacuum chamber of an evaluation tool that includes a scanning electron microscope (SEM) column and a focused ion beam (FIB) column; acquiring a plurality of two-dimensional images of the region of interest by alternating a sequence of delayering the region of interest with a charged particle beam from the FIB column and imaging a surface of the region of interest with the SEM column; generating an initial three-dimensional data cube representing the region of interest by stacking the plurality of two-dimensional images on top of each other in an order in which they were acquired; identifying distortions within the initial three-dimensional data cube; and creating an updated three-dimensional data cube that includes corrections for the identified distortions.
Ilya Blayvas
Filed: 22 Jun 23
Utility
23ool2q26jtg0kuborsw2u76ii7jn9r
19 Oct 23
Embodiments of the present disclosure generally relate to methods of forming a substrate having a target thickness distribution at one or more eyepiece areas across a substrate.
David Alexander SELL, Samarth BHARGAVA
Filed: 19 Jun 23
Utility
05pbf5j28h0cpa2km35sc3b9g5673yo8
19 Oct 23
A system may include a substrate stage, configured to support a substrate, where a main surface of the substrate defines a substrate plane.
Peter F. Kurunczi, Morgan Evans, Joseph C. Olson, Christopher A. Rowland, James Buonodono
Filed: 26 Jun 23
Utility
vienbgnoh4x8dhx6072u9c64xe95ldkvqs5hlmzqmx71rf1v
19 Oct 23
Embodiments disclosed herein include a method of developing a reduced order model (ROM) for a model based controller.
Preetham Rao, Raechel Tan, Ananda Sankar Kundu, Wolfgang Aderhold
Filed: 18 Apr 22
Utility
xuwhzb192tg5h8tjhrb1a0srk sc148qf6t1t1n20ubmsesoszf1l3q
19 Oct 23
Methods of selectively depositing a carbon-containing layer are described.
Xinke Wang, Bhaskar Jyoti Bhuyan, Zeqing Shen, Susmit Singha Roy, Abhijit Basu Mallik, Jiecong Tang, John Sudijono, Mark Saly
Filed: 18 Apr 22
Utility
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19 Oct 23
Apparatus provide plasma to a processing volume of a chamber.
Yang YANG, Fernando SILVEIRA, Kartik RAMASWAMY, Yue GUO, A N M Wasekul AZAD, Imad YOUSIF
Filed: 19 Apr 22
Utility
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19 Oct 23
Process chamber lid assemblies and process chambers comprising same are described.
Anqing Cui, Dien-Yeh Wu, Wei V. Tang, Yixiong Yang, Bo Wang
Filed: 12 Jun 23
Utility
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19 Oct 23
Methods and apparatus for substrate processing are described.
Anantha K. SUBRAMANI, Seyyed Abdolreza FAZELI, Yang GUO, Chandrashekara BAGINAGERE, Ramcharan SUNDAR, Yunho KIM, Rajasekhar PATIBANDLA
Filed: 15 Apr 22
Utility
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19 Oct 23
Exemplary device structures may include a light emitting diode structure.
Sivapackia Ganapathiappan, Kulandaivelu Sivanandan, Lisong Xu, Mingwei Zhu, Hou T. Ng, Nag Patibandla
Filed: 27 Mar 23
Utility
63ys2sm9tykrgfn4izq2j58dmavi37kt8i5naleyov0h5ihjto
19 Oct 23
Embodiments of the present disclosure generally relate to methods and apparatus for backside stress engineering of substrates to combat film stresses and bowing issues.
Chunming ZHOU, Jothilingam RAMALINGAM, Yong CAO, Kevin Vincent MORAES, Shane LAVAN
Filed: 19 Jun 23
Utility
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19 Oct 23
A method of processing a substrate is provided including flowing a deposition gas comprising a hydrocarbon compound and a dopant compound into a process volume having a substrate disposed positioned on a substrate support.
Eswaranand Venkatasubramanian, Rajaram Narayanan, Pramit Manna, Abhijit B. Mallick, Karthik Janakiraman, Jialiang Wang
Filed: 15 Apr 22