7578 patents
Page 26 of 379
Utility
Steam-assisted Single Substrate Cleaning Process and Apparatus
19 Oct 23
The present disclosure relates to a method and apparatus for cleaning a substrate.
Jianshe TANG, Wei LU, Haosheng WU, Taketo SEKINE, Shou-Sung CHANG, Hari N. SOUNDARARAJAN, Chad POLLARD
Filed: 23 Jun 23
Utility
Chemical mechanical polishing with applied magnetic field
17 Oct 23
Xingfeng Wang, Jianshe Tang, Feng Q. Liu, David M. Gage, Stephen Jew
Filed: 18 Dec 20
Utility
ey5a02dv1i559j1w6qde
17 Oct 23
Exemplary electroplating apparatuses may include a system head operable to clamp a substrate.
Sam Lee, Kyle M. Hanson, Eric J. Bergman
Filed: 3 May 22
Utility
ygqplhtu6vtkic d63r0xt3nkj8rhd715c5d0tg5msxtjzle64s26d1rfdo
17 Oct 23
A method for setting memory elements in a plurality of states includes applying a set signal to a memory element to transition the memory element from a low-current state to a high-current state; applying a partial reset signal to the memory element to transition the memory element from the high-current state to a state between the high-current state and the low-current state; determining whether the state corresponds to a predetermined state; and applying one or more additional partial reset signals to the memory element until the state corresponds to the predetermined current state.
Deepak Kamalanathan, Siddarth Krishnan, Archana Kumar, Fuxi Cai, Federico Nardi
Filed: 24 May 21
Utility
q94fxlkiivhiux1vwkj8lrxzc3yjbr7em mlnaspmoqt2m
17 Oct 23
A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.
Peng Suo, Yu Gu, Guan Huei See, Arvind Sundarrajan
Filed: 11 Apr 21
Utility
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17 Oct 23
An apparatus for directional processing is disclosed.
Alexandre Likhanskii
Filed: 27 Aug 19
Utility
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17 Oct 23
In one embodiment, at least a processing chamber includes a perforated lid, a gas blocker disposed on the perforated lid, and a substrate support disposed below the perforated lid.
Sanjeev Baluja, Yi Yang, Truong Nguyen, Nattaworn Boss Nunta, Joseph F. Aubuchon, Tuan Anh Nguyen, Karthik Janakiraman
Filed: 26 Apr 21
Utility
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17 Oct 23
Embodiments of the present disclosure relate to a system for pulsed direct-current (DC) biasing and clamping a substrate.
Linying Cui, James Rogers, Leonid Dorf
Filed: 12 May 21
Utility
vcl0n09hqgefwbwwwj72k 9r4a17j2
17 Oct 23
Examples of the present technology include semiconductor processing methods to form diffusion barriers for germanium in a semiconductor structure.
Huiyuan Wang, Susmit Singha Roy, Takehito Koshizawa, Bo Qi, Abhijit Basu Mallick, Nitin K. Ingle
Filed: 27 Aug 20
Utility
5ng4e34k2mwpth8vtzvewfy5a54tf5iqv8wog0d7cmmki
17 Oct 23
Methods for depositing a silicon germanium tin boron (SiGeSn:B) film on a substrate are described.
Chen-Ying Wu, Yi-Chiau Huang
Filed: 17 Jan 22
Utility
hw6kqvrozq1i3wsp9d jwyr
17 Oct 23
Gas distribution apparatus to provide uniform flows of gases from a single source to multiple processing chambers are described.
Mauro Cimino, Arkaprava Dan, Paul Z. Wirth
Filed: 18 Jun 20
Utility
e10y72mcqu0p9dgqhvw3n7 ymx9b4d8nysfu4cm0cvlewrpjmwhmeh4hds7d
17 Oct 23
Apparatus and methods to process one or more wafers are described.
Michael Honan, David Blahnik, Robert Brent Vopat, Jeffrey Blahnik, Charles Carlson
Filed: 28 Oct 19
Utility
xsusk8uuocry7lzdz9kf2c3gs0waut1plb3o20kqt8cfzgoyboofxvk
17 Oct 23
Electronic device processing systems including an equipment front end module (EFEM) with at least one side storage pod are described.
Paul B. Reuter, Dean C. Hruzek
Filed: 11 Nov 22
Utility
44bwgkgf3dly2nz2jbb6m1tfxl2jjjokwqb13l56o2bkhuv
17 Oct 23
Substrate supports, substrate support assemblies and methods of using the substrate supports are described.
Tejas Ulavi, Arkaprava Dan, Mike Murtagh, Sanjeev Baluja
Filed: 7 May 21
Utility
3raqb1vtogbxzfa4mxsbhtltzupq37qt5
17 Oct 23
A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements.
Kun Xu, Kiran Lall Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian, Jun Qian, Harry Q. Lee
Filed: 11 May 21
Utility
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17 Oct 23
A superconducting nanowire single photon detector (SNSPD) device includes a substrate, a distributed Bragg reflector on the substrate, a seed layer of a metal nitride on the distributed Bragg reflector, and a superconductive wire on the seed layer.
Zihao Yang, Mingwei Zhu, Nag B. Patibandla, Nir Yahav, Robert Jan Visser, Adi de la Zerda
Filed: 29 Jan 21
Utility
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17 Oct 23
Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies.
Manivannan Thothadri, Harvey You, Helinda Nominanda, Neil Morrison, Daniel Paul Forster, Arvinder Chadha
Filed: 16 Jun 20
Utility
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17 Oct 23
Extreme ultraviolet (EUV) mask blanks and methods for their manufacture, and production systems therefor are disclosed.
Wen Xiao, Vibhu Jindal, Weimin Li, Sanjay Bhat, Azeddine Zerrade
Filed: 20 Apr 21
Utility
6jrlg3wkd9cyynrr8jfr4bbtss2v10n53dgh8t6t14vefj
17 Oct 23
A method includes receiving one or more fingerprint dimensions to be used to generate a fingerprint.
James Robert Moyne, Jimmy Iskandar
Filed: 26 Oct 21
Utility
yym0t62lhloca1rc26qan8loi7ytyi
17 Oct 23
A system for classifying a pattern of interest (POI) on a semiconductor specimen is disclosed.
Irad Peleg, Ran Schleyen, Boaz Cohen
Filed: 23 May 22