7578 patents
Page 31 of 379
Utility
Plasma erosion resistant thin film coating for high temperature application
3 Oct 23
An article such as a susceptor includes a body of a thermally conductive material coated by a first protective layer and a second protective layer over a surface of the body.
Vahid Firouzdor, Biraja P. Kanungo, Jennifer Y. Sun, Martin J. Salinas, Jared Ahmad Lee
Filed: 30 Sep 20
Utility
Small batch polishing fluid delivery for CMP
3 Oct 23
In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers.
Robert D. Tolles, Kirk Liebscher
Filed: 27 Feb 20
Utility
Reactive cleaning of substrate support
3 Oct 23
Methods of cleaning a substrate support comprise: introducing a cleaning gas into a processing chamber containing the substrate support; applying a radio frequency (RF) power to a remote plasma source that is in fluid communication with the processing chamber to establish a reactive etching plasma from the cleaning gas in the processing chamber; reacting deposits on the substrate support with the reactive etching plasma to form a by-products phase; and evacuating the by-products phase from the processing chamber.
Xi Chen, Shreesha Yogish Rao, Sheng Guo, Chi H. Ching, Thomas Blasius Brezoczky, Cheng-Hsiung Tsai
Filed: 23 Jul 21
Utility
Mass flow control based on micro-electromechanical devices
3 Oct 23
Disclosed herein are embodiments of a mass flow control apparatus, systems incorporating the same, and methods using the same.
Nir Merry, Paul Wirth, Ming Xu, Sushant Koshti, Raechel Chu-Hui Tan
Filed: 14 Sep 21
Utility
Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
3 Oct 23
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same.
Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
Filed: 11 Mar 19
Utility
Wordline contact formation in NAND devices
3 Oct 23
Disclosed are approaches for 3D NAND structure fabrication.
Armin Saeedi Vahdat, Tristan Y. Ma, Johannes M. van Meer, John Hautala, Naushad K. Variam
Filed: 3 May 21
Utility
Method and apparatus for deposition of multilayer device with superconductive film
3 Oct 23
A physical vapor deposition system includes a chamber, three target supports to targets, a movable shield positioned having an opening therethrough, a workpiece support to hold a workpiece in the chamber, a gas supply to deliver nitrogen gas and an inert gas to the chamber, a power source, and a controller.
Mingwei Zhu, Zihao Yang, Nag B. Patibandla, Ludovic Godet, Yong Cao, Daniel Lee Diehl, Zhebo Chen
Filed: 8 Aug 22
Utility
Multi-step pre-clean for selective metal gap fill
3 Oct 23
Methods for pre-cleaning substrates having metal and dielectric surfaces are described.
Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos, David T. Or, Kevin Kashefi, Yu Lei, Lin Dong, He Ren, Yi Xu, Mehul Naik, Hao Chen, Mang-Mang Ling
Filed: 12 May 22
Utility
Wet cleaning of electrostatic chuck
3 Oct 23
Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface.
Tuochuan Huang, Gang Peng, David W. Groechel, Vijay D. Parkhe, Shinnosuke Kawaguchi, David Benjaminson
Filed: 2 May 19
Utility
Pulsed voltage boost for substrate processing
3 Oct 23
Embodiments provided herein generally include apparatus, plasma processing systems and methods for boosting a voltage of an electrode in a processing chamber.
Yang Yang, Yue Guo, Kartik Ramaswamy
Filed: 28 Jun 21
Utility
Selective oxidation and simplified pre-clean
3 Oct 23
Method for selectively oxidizing the dielectric surface of a substrate surface comprising a dielectric surface and a metal surface are discussed.
Bencherki Mebarki, Joung Joo Lee, Yi Xu, Yu Lei, Xianmin Tang, Kelvin Chan, Alexander Jansen, Philip A. Kraus
Filed: 10 Mar 21
Utility
Methods of parallel transfer of micro-devices using treatment
3 Oct 23
A method of transferring micro-devices includes selectively treating a first adhesive layer to form a treated portion and an untreated portion while micro-devices are attached the first adhesive layer.
Manivannan Thothadri, Arvinder Chadha
Filed: 20 Sep 21
Utility
Thickness measurement of substrate using color metrology
3 Oct 23
A layer thickness measurement system includes a support to hold a substrate, an optical sensor to capture a color image of at least a portion of the substrate, and a controller.
Nojan Motamedi, Dominic J. Benvegnu, Boguslaw A. Swedek, Martin A. Josefowicz
Filed: 29 Jul 21
Utility
Plasma processing assembly using pulsed-voltage and radio-frequency power
3 Oct 23
Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber.
Leonid Dorf, Rajinder Dhindsa, James Rogers, Daniel Sang Byun, Evgeny Kamenetskiy, Yue Guo, Kartik Ramaswamy, Valentin N. Todorow, Olivier Luere, Linying Cui
Filed: 3 Oct 22
Utility
Plasma source with ceramic electrode plate
3 Oct 23
A plasma source assembly for use with a substrate processing chamber is described.
Robert B. Moore, Jared Ahmad Lee, Marc David Shull, Tsutomu Tanaka, Alexander V. Garachtchenko, Dmitry A. Dzilno
Filed: 13 Nov 20
Utility
Electrostatic chuck assembly for cryogenic applications
3 Oct 23
Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications.
Vijay D. Parkhe
Filed: 11 May 21
Utility
Selective deposition of carbon on photoresist layer for lithography applications
3 Oct 23
A method for etching a hardmask layer includes forming a photoresist layer comprising an organometallic material on a hardmask layer comprising a metal-containing material, exposing the photoresist layer to ultraviolet radiation through a mask having a selected pattern, removing un-irradiated areas of the photoresist layer to pattern the photoresist layer, forming a passivation layer comprising a carbon-containing material selectively on a top surface of the patterned photoresist layer, and etching the hardmask layer exposed by the patterned photoresist layer having the passivation layer formed thereon.
Larry Gao, Nancy Fung
Filed: 15 Mar 21
Utility
Power supply signal conditioning for an electrostatic chuck
3 Oct 23
Exemplary semiconductor processing systems may include a processing chamber and an electrostatic chuck disposed at least partially within the processing chamber.
Zheng John Ye, Daemian Raj Benjamin Raj, Rana Howlader, Abhigyan Keshri, Sanjay G. Kamath, Dmitry A. Dzilno, Juan Carlos Rocha-Alvarez, Shailendra Srivastava, Kristopher R. Enslow, Xinhai Han, Deenesh Padhi, Edward P. Hammond
Filed: 29 Sep 20
Utility
Methods for reflector film growth
3 Oct 23
Methods and apparatus for forming reflector films are described A liner is formed on a substrate surface followed by formation of the reflector layer so that there is no oxygen exposure between liner and reflector layer formation.
Luping Li, Jacqueline S. Wrench, Wen Ting Chen, Yixiong Yang, In Seok Hwang, Shih Chung Chen, Srinivas Gandikota
Filed: 13 Mar 20
Utility
Laser Drilled Faceplate
28 Sep 23
Exemplary methods of fabricating a faceplate for a processing chamber may include drilling a first portion of each of a plurality of apertures in a first surface of a faceplate.
Chidambara A. Ramalingam, Shawyon Jafari
Filed: 24 Mar 22