7578 patents
Page 33 of 379
Utility
Calibration of an electronics processing system
26 Sep 23
A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position.
Nicholas Michael Bergantz, Damon K. Cox, Alexander Berger
Filed: 28 Apr 20
Utility
ALD cycle time reduction using process chamber lid with tunable pumping
26 Sep 23
Process chamber lids having a pumping liner with a showerhead and gas funnel within an open central region are described.
Muhannad Mustafa, Muhammad M. Rasheed, Mario D. Sanchez, Anqing Cui
Filed: 22 Sep 20
Utility
High temperature vacuum seal
26 Sep 23
Gas distribution assemblies and process chambers comprising gas distribution assemblies are described.
Muhannad Mustafa, Muhammad M. Rasheed
Filed: 20 Sep 22
Utility
Parameter sensing and computer modeling for gas delivery health monitoring
26 Sep 23
A method includes receiving measurement data from multiple sensors positioned along a delivery line that delivers a liquid as a gas to one of a gas panel or a processing chamber; simulating, using a computer-generated model, one or more process parameters associated with the delivery line and a plurality of heater jackets positioned around the delivery line; comparing the measurement data with values of the one or more process parameters; and determining, based on at least a threshold deviation between the measurement data and the values of the one or more process parameters, that a fault exists that is associated with maintaining temperature within the delivery line consistent with a gaseous state of the liquid.
Ala Moradian, James Omer L'Heureux, Shuran Sheng, Rohit Mahakali, Karthik Ramanathan, Lin Zhang, Umesh Madhav Kelkar, Gopalakrishna B. Prabhu, Zheng Yuan, Jeonghoon Oh
Filed: 22 Sep 20
Utility
Ion source gas injection beam shaping
26 Sep 23
An ion source for extracting a ribbon ion beam with improved height uniformity is disclosed.
Adam M. McLaughlin
Filed: 28 Oct 21
Utility
Power device structures and methods of making
26 Sep 23
Exemplary semiconductor processing methods may include forming a p-type silicon-containing material on a substrate including a first n-type silicon-containing material defining one or more features.
Amirhasan Nourbakhsh, Raman Gaire, Tyler Sherwood, Lan Yu, Roger Quon, Siddarth Krishnan
Filed: 11 Jan 22
Utility
Selective deposition of silicon using deposition-treat-etch process
26 Sep 23
Methods for selective silicon film deposition on a substrate comprising a first surface and a second surface are described.
Rui Cheng, Fei Wang, Abhijit Basu Mallick, Robert Jan Visser
Filed: 19 Jul 21
Utility
Systems and methods for selective metal compound removal
26 Sep 23
Exemplary etching methods may include flowing a fluorine-containing precursor and a hydrogen-containing precursor into a remote plasma region of a semiconductor processing chamber.
Zhenjiang Cui, Anchuan Wang
Filed: 11 Sep 20
Utility
Chamber component with protective ceramic coating containing yttrium, aluminum and oxygen
26 Sep 23
A coated chamber component comprises a body and a protective ceramic coating deposited over a surface of the body, the protective ceramic coating being amorphous and comprising about 8-20% by weight yttrium, about 20-32% by weight aluminum, and about 60-70% by weight oxygen.
Wendell Glenn Boyd, Jr., Vijay D. Parkhe, Teng-Fang Kuo, Zhenwen Ding
Filed: 25 Apr 22
Utility
Wafer heater with backside and integrated bevel purge
26 Sep 23
Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described.
Tejas Ulavi, Vijay D. Parkhe, Naveen Kumar Nagaraja, Sanjeev Baluja, Surajit Kumar, Dhritiman Subha Kashyap, Ashutosh Agarwal
Filed: 13 Dec 22
Utility
Generating electric power for a robotic end effector
26 Sep 23
A robot device includes a first link and a second link coupled to the first link via an elbow.
Alexander Berger, Paul Lawrence Korff, William Paul Laceky, Jeffrey C. Hudgens, Rajkumar Thanu, Damon K. Cox, Matvey Farber
Filed: 23 Sep 20
Utility
Thin-film encapsulation
26 Sep 23
A method of encapsulating an organic light emitting diode (OLED) is provided.
Tae Kyung Won, Soo Young Choi, Sanjay D. Yadav
Filed: 25 Mar 21
Utility
Dual Channel Showerhead Assembly
21 Sep 23
Dual channel showerhead assemblies are described.
Prahallad Iyengar, Dhritiman Subha Kashyap, Parth Swaroop, Satish Radhakrishnan
Filed: 21 Mar 22
Utility
Methods of Growing Metal-containing Films
21 Sep 23
Methods of forming metal-containing films for electronic devices (e.g., logic devices and/or memory devices) and methods for reducing equivalent oxide thickness (EOT) penalty in electronic devices are disclosed.
Haoming Yan, Shih Chung Chen, Mandyam Sriram, EunKee Hong, Janardhan Devrajan, Lakmal C. Kalutarage, Yongjing Lin, Lisa Michelle Mandrell, Arkaprava Dan
Filed: 14 Apr 23
Utility
Electrostatic Chuck with Laser-machined Mesas
21 Sep 23
Electrostatic chucks (ESCs) for reactor or plasma processing chambers, and methods of fabricating ESCs, are described.
Vijay D. Parkhe
Filed: 21 Mar 22
Utility
Method of Forming Interconnect Structure
21 Sep 23
Srinivas Gandikota, Geetika Bajaj, Yixiong Yang, Seshadri Ganguli, Tuerxun Ailihumaer, Yogesh Sharma, Tianyi Huang
Filed: 2 May 23
Utility
Formulations for Advanced Polishing Pads
21 Sep 23
Methods and formulations for manufacturing polishing articles used in polishing processes are provided.
Sivapackia GANAPATHIAPPAN, Ankit VORA, Boyi FU, Venkat HARIHARAN, Mayu YAMAMURA, Mario CORNEJO, Igor ABRAMSON, Mo YANG, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA
Filed: 25 May 23
Utility
Chamber Configurations and Processes for Particle Control
21 Sep 23
Exemplary processing methods may include forming a plasma of a cleaning precursor in a remote region of a semiconductor processing chamber.
Fei Wu, Abdul Aziz Khaja, Sungwon Ha, Ganesh Balasubramanian, Vinay Prabhakar
Filed: 26 May 23
Utility
Dense Vertically Segmented Silicon Coating for Low Defectivity In High-temperature Rapid Thermal Processing
21 Sep 23
This application generally relates to a chamber component for a thermal processing chamber comprising a base component having a coating disposed thereon, the coating having a base component having a coating disposed thereon, the coating includes a surface, a thickness, and a plurality of cracks extending from the surface of the coating through at least 40 percent of the thickness of the coating.
David JORGENSEN, Jian WU, Abhilash J. MAYUR
Filed: 15 Mar 22
Utility
Ion Implantation for Reduced Hydrogen Incorporation In Amorphous Silicon
21 Sep 23
Exemplary methods of semiconductor processing may include forming a layer of amorphous silicon on a semiconductor substrate.
Rui Cheng, Rajesh Prasad, Karthik Janakiraman, Gautam K. Hemani, Krishna Nittala, Shan Tang, Qi Gao
Filed: 21 Jul 21