7578 patents
Page 37 of 379
Utility
Gas delivery system for high pressure processing chamber
12 Sep 23
A high-pressure processing system for processing a layer on a substrate includes a first chamber, a support to hold the substrate in the first chamber, a second chamber adjacent the first chamber, a foreline to remove gas from the second chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, a gas delivery system configured to increase the pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, an exhaust system comprising an exhaust line to remove gas from the first chamber, and a common housing surrounding both the first gas delivery module and the second gas delivery module.
Qiwei Liang, Srinivas D. Nemani, Sean S. Kang, Adib Khan, Ellie Y. Yieh
Filed: 29 Nov 22
Utility
Carrier FOUP and a method of placing a carrier
12 Sep 23
A carrier FOUP and a method of placing a carrier are provided.
Steven Trey Tindel, Alexander N. Lerner, Kim Ramkumar Vellore
Filed: 12 Sep 19
Utility
j1b2i0qdai5j9kkvxzcrrbipj4lhd9zzacw8gnlfpyx8dj2y89nai
12 Sep 23
Methods and apparatus for processing a substrate are provided herein.
Ying Wang, Ruiping Wang
Filed: 22 Oct 21
Design
iuavzu10wzicfpjolyonux0z7wt4klib4v d8d0byki1hpjb6y82uw8b
12 Sep 23
Martin Lee Riker, Fuhong Zhang, Lanlan Zhong, Kishor Kumar Kalathiparambil
Filed: 7 Apr 20
Utility
hjs4vyqvnnvqdy y7zsl9wro6zsrh23lmxr3egdjkz3
12 Sep 23
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system.
Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang
Filed: 15 Apr 20
Utility
7ji9wnhwc1j8dcczgy4be3b9
12 Sep 23
Apparatus and methods for supplying a vapor to a processing chamber are described.
Kenric Choi, William J. Durand
Filed: 5 Jun 20
Utility
o1ofpkgfw9g5cg6acjzex43u8vw1jihuhn lbe6vfdqp6x
12 Sep 23
Using the systems and methods discussed herein, CMAS corrosion is inhibited via CMAS interception in an engine environment and/or is prevented or reduced by the formation of a metal oxide protective coating on a hot engine section component.
David Britz, Pravin K. Narwankar, David Thompson, Yuriy Melnik, Sukti Chatterjee
Filed: 6 May 21
Utility
fyytg6o0i3pgunzrg6z16gtgt64nz0nb1t4r
12 Sep 23
Using the systems and methods discussed herein, CMAS corrosion is inhibited via CMAS interception in an engine environment and/or is prevented or reduced by the formation of a metal oxide protective coating on a hot engine section component.
David Britz, Pravin K. Narwankar, David Thompson, Yuriy Melnik, Sukti Chatterjee
Filed: 6 May 21
Utility
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12 Sep 23
Extreme ultraviolet (EUV) mask blanks, methods for their manufacture and production systems therefor are disclosed.
Vibhu Jindal
Filed: 12 Apr 21
Utility
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12 Sep 23
The present disclosure generally relates to methods of forming optical devices comprising nanostructures disposed on transparent substrates.
Yongan Xu, Jinxin Fu, Jhenghan Yang, Ludovic Godet
Filed: 23 Nov 21
Utility
un7aa34v98njj6dvmu4gsucpna0o38di76csf9cefo1j7vu
12 Sep 23
Exemplary methods of semiconductor processing may include etching one or more features partially through a dielectric material to expose material from one or more layer pairs formed on a substrate.
Bhaskar Jyoti Bhuyan, Zeqing Shen, Susmit Singha Roy, Abhijit Basu Mallick
Filed: 20 Aug 21
Utility
fc212llf6 woagy5yailv9btpm7hph5fa6ydkwiyxqy7iekbnqker5pfyl41
12 Sep 23
A method may include providing a substrate having, on a first surface of the substrate, a low dielectric constant layer characterized by a layer thickness.
Rajesh Prasad, Martin Seamons, Shan Tang, Qi Gao, Deven Raj Mittal, Kyuha Shim
Filed: 12 May 21
Utility
98uqhqtg9raz9y2nn5z07i8quczrv5hb3s9s
12 Sep 23
In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield.
Shantanu Rajiv Gadgil, Sumit Subhash Patankar, Nathan Arron Davis, Allen L. D'Ambra
Filed: 29 Dec 22
Utility
6sl6s5oon3zly25dmr3urrhg8znpfuu9vqh35e9586xbicgra
12 Sep 23
Embodiments of the present disclosure generally relate to apparatus and methods for reducing substrate backside damage during semiconductor device processing.
Liangfa Hu, Abdul Aziz Khaja, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Yoichi Suzuki
Filed: 22 Apr 20
Utility
zvulzrs3q1qsfjcofrzr9pojaxr78296
12 Sep 23
Methods for forming a transition metal material on a substrate and thermal processing such metal containing material in a cluster processing system are provided.
Keith Tatseun Wong, Srinivas D. Nemani, Ellie Y. Yieh
Filed: 20 Nov 18
Utility
fdz84ub6n0cg5v 8r6g1ch6j6k3ogwirfhxvu43fyiz903i1b9acyav0v06
12 Sep 23
A method of transferring micro-devices includes attaching micro-devices to one surface of a first body with a first adhesive layer, and selectively forming a masking layer on an opposite surface of the first body.
Manivannan Thothadri, Arvinder Chadha
Filed: 20 Sep 21
Utility
wt55xjnmg4khu0hxyc2lw 619073vel7jfpzcvnc92g2wr
12 Sep 23
Flexible display devices, such as flexible cover lens films, are discussed and provided herein.
Manivannan Thothadri, Daniel Paul Forster, Robert F. Praino, Jr., Harvey You
Filed: 15 Apr 21
Utility
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7 Sep 23
A showerhead with an embedded nut is disclosed.
Kenneth Brian Doering
Filed: 12 May 23
Utility
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7 Sep 23
Apparatuses and methods for forming a film on a substrate are described.
Vicknesh Sahmuganathan, Jiteng Gu, Zhongxin Chen, Kian Ping Loh, John Sudijono, Haisen Xu, Sze Chieh Tan, Yuanxing Han, Jiecong Tang, Eswaranand Venkatasubramanian, Abhijit Basu Mallick
Filed: 15 Dec 21
Utility
zcqh9hgbadaz9 4om0kf206sy9l9r4i46oteqeze2xbuyy7qp5lozijgb
7 Sep 23
A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section.
Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
Filed: 3 Apr 23