7578 patents
Page 38 of 379
Utility
Plating and Deplating Currents for Material Co-planarity In Semiconductor Plating Processes
7 Sep 23
A method of plating substrates may include placing a substrate in a plating chamber comprising a liquid, and applying a current to the liquid in the plating chamber to deposit a metal on exposed portions of the substrate, where the current may include alternating cycles of a forward plating current and a reverse deplating current.
Paul R. McHugh, Charles Sharbono, Jing Xu, John L. Klocke, Sam K. Lee, Keith Edward Ypma
Filed: 3 Mar 22
Utility
Printing a Chemical Mechanical Polishing Pad
7 Sep 23
A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
Rajeev Bajaj, Barry Lee Chin, Terrance Y. Lee
Filed: 11 May 23
Utility
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7 Sep 23
Disclosed herein is a method and apparatus for controlling surface characteristics by measuring capacitance of a process kit ring.
Sathyendra GHANTASALA, Leonid DORF, Evgeny KAMENETSKIY, Peter MURAOKA, Denis Martin KOOSAU, Rajinder DHINDSA, Andreas SCHMID
Filed: 15 May 23
Utility
e9kcserx9ojscxvzyjebpncqdvpvsz1j5f
7 Sep 23
A polishing pad includes a sensor assembly surrounded by a lower portion of the polishing pad, and an upper portion including a pad portion disposed on the assembly and at least a portion of a polishing layer disposed on the lower portion.
Nicholas A. Wiswell, Chih Chung Chou, Dominic J. Benvegnu
Filed: 10 May 23
Utility
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7 Sep 23
Embodiments of the present disclosure relate to methods for fabricating optical devices.
Sage Toko Garrett DOSHAY, Rutger MEYER TIMMERMAN THIJSSEN, Ludovic GODET, Chien-An CHEN, Pinkesh Rohit SHAH
Filed: 10 May 23
Utility
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7 Sep 23
A method of cleaning a conditioner head includes bringing two clamps of a cleaning tool inward toward a disk-shaped pad conditioner head to press a sponge against an outer surface of the disk-shaped pad conditioner head, and creating relative motion between the cleaning tool and the pad conditioner head to wipe the sponge against the pad conditioner head.
Shantanu Rajiv Gadgil, Sumit Subhash Patankar, Nathan Arron Davis, Michael J. Coughlin, Allen L. D`Ambra
Filed: 11 May 23
Utility
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7 Sep 23
Provided herein are approaches for providing a more uniform ion flux and ion angular distribution across a wafer to minimize etch yield loss resulting from etch profile variations.
Alexandre Likhanskii, Peter F. Kurunczi, Alan V. Hayes
Filed: 3 Mar 22
Utility
r7laxq4oice74kzwvd6cb5yjtl8ur3
7 Sep 23
Described herein are articles, systems and methods where a halogen resistant coating is deposited onto a surface of a chamber component using an atomic layer deposition (ALD) process.
Prerna Goradia, Jennifer Y. Sun, Xiaowei Wu, Geetika Bajaj, Atul Chaudhari, Ankur Kadam
Filed: 16 Mar 23
Utility
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7 Sep 23
Processing chambers, substrate supports and thermal shields are described.
Youngki Chang, Muhannad Mustafa, Kartik Shah, Dhritiman Subha Kashyap, Dhivanraj Subramanian
Filed: 2 Mar 22
Utility
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7 Sep 23
A reactor for coating particles includes a stationary vacuum chamber that has a lower portion that forms a half-cylinder and an upper portion and that holds a bed of particles to be coated, a vacuum port in the upper portion of the chamber, a paddle assembly, and a gas injection assembly that includes a vaporizer to convert a first liquid to a first reactant or precursor gas, a manifold to receive the first reactant or precursor gas from the vaporizer, and a plurality of channels leading from the manifold to a plurality of apertures located in the lower portion of the chamber.
Jonathan Frankel, Colin C. Neikirk, Pravin K. Narwankar, Quoc Truong, Govindraj Desai, Sekar Krishnasamy, Shrikant Swaminathan
Filed: 9 May 23
Utility
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7 Sep 23
Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing.
Bhaskar PRASAD, Kirankumar Neelasandra SAVANDAIAH, Thomas BREZOCZKY, Srinivasa Rao YEDLA
Filed: 15 May 23
Utility
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7 Sep 23
A method includes receiving, by a processing device, first data indicative of a processing recipe.
Dermot Patrick Cantwell, Hui-Ling Han, Moon Kyu Oh, Weili Li
Filed: 28 Feb 23
Utility
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7 Sep 23
A method includes providing a random or pseudo-random input to a first trained machine learning model trained to generate synthetic sensor time series data for a processing chamber.
Joshua Thomas Maher
Filed: 7 Mar 22
Utility
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7 Sep 23
A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate.
Dominic J. Benvegnu
Filed: 16 May 23
Utility
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7 Sep 23
A plasma doping system including a plasma doping chamber, a platen mounted in the plasma doping chamber for supporting a workpiece, a source of ionizable gas coupled to the chamber, the ionizable gas containing a desired dopant for implantation into the workpiece, a plasma source for producing a plasma having a plasma sheath in a vicinity of the workpiece, the plasma containing positive ions of the ionizable gas, and accelerating said positive ions across the plasma sheath toward the platen for implantation into the workpiece, a shield ring surrounding the platen and adapted to extend the plasma sheath beyond an edge of the workpiece, and a cover ring disposed on top of the shield ring and adapted to mitigate sputtering of the shield ring, wherein the cover ring comprises a crystalline base layer and a non-crystalline top layer.
Vikram M. Bhosle, Timothy J. Miller, Eric D. Hermanson, Christopher J. Leavitt, Jordan B. Tye
Filed: 5 Mar 22
Utility
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7 Sep 23
The present disclosure relates to systems and methods for fabricating semiconductor packages, and more particularly, for forming features in semiconductor packages by laser ablation.
Kurtis LESCHKIES, Jeffrey L. FRANKLIN, Wei-Sheng LEI, Steven VERHAVERBEKE, Jean DELMAS, Han-Wen CHEN, Giback PARK
Filed: 9 May 23
Utility
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7 Sep 23
Asaf SCHLEZINGER, Markus J. STOPPER
Filed: 12 May 23
Utility
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7 Sep 23
Embodiments disclosed herein include an electrostatic chuck.
Anantha Subramani, Yang Guo, Seyyed Fazeli, Ramcharan Sundar, Arun Kumar Kotrappa
Filed: 2 Mar 22
Utility
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7 Sep 23
An enclosure system includes multiple walls forming an interior volume.
Phillip Alfred Criminale, Zhiqiang Guo, Andrew S.C. Ho, Rachel Sara Stolzman, Michael Carl Hankes
Filed: 2 Mar 22
Utility
iao8n3u6khuicavgo40fga3nwiwy7p
7 Sep 23
Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display.
Ji-young CHOUNG, Dieter HAAS, Yu-hsin LIN, Jungmin LEE, Seong Ho YOO, Si Kyoung KIM
Filed: 10 May 23