3198 patents
Page 15 of 160
Utility
High temperature vacuum seal
26 Sep 23
Gas distribution assemblies and process chambers comprising gas distribution assemblies are described.
Muhannad Mustafa, Muhammad M. Rasheed
Filed: 20 Sep 22
Utility
Parameter sensing and computer modeling for gas delivery health monitoring
26 Sep 23
A method includes receiving measurement data from multiple sensors positioned along a delivery line that delivers a liquid as a gas to one of a gas panel or a processing chamber; simulating, using a computer-generated model, one or more process parameters associated with the delivery line and a plurality of heater jackets positioned around the delivery line; comparing the measurement data with values of the one or more process parameters; and determining, based on at least a threshold deviation between the measurement data and the values of the one or more process parameters, that a fault exists that is associated with maintaining temperature within the delivery line consistent with a gaseous state of the liquid.
Ala Moradian, James Omer L'Heureux, Shuran Sheng, Rohit Mahakali, Karthik Ramanathan, Lin Zhang, Umesh Madhav Kelkar, Gopalakrishna B. Prabhu, Zheng Yuan, Jeonghoon Oh
Filed: 22 Sep 20
Utility
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26 Sep 23
An ion source for extracting a ribbon ion beam with improved height uniformity is disclosed.
Adam M. McLaughlin
Filed: 28 Oct 21
Utility
1o7iqm4p8xcscz9ks1zun1nd37wkw5pd983y4j7gdsc8clm5falder0
26 Sep 23
Exemplary semiconductor processing methods may include forming a p-type silicon-containing material on a substrate including a first n-type silicon-containing material defining one or more features.
Amirhasan Nourbakhsh, Raman Gaire, Tyler Sherwood, Lan Yu, Roger Quon, Siddarth Krishnan
Filed: 11 Jan 22
Utility
zf543f4z1otd8zrdfhoynglc0bltsrcpxd7nzewhwmx6dcw
26 Sep 23
Methods for selective silicon film deposition on a substrate comprising a first surface and a second surface are described.
Rui Cheng, Fei Wang, Abhijit Basu Mallick, Robert Jan Visser
Filed: 19 Jul 21
Utility
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26 Sep 23
Exemplary etching methods may include flowing a fluorine-containing precursor and a hydrogen-containing precursor into a remote plasma region of a semiconductor processing chamber.
Zhenjiang Cui, Anchuan Wang
Filed: 11 Sep 20
Utility
9y2vef2cat756ezg2r4qolq8iuwnzeosgrksk8bg
26 Sep 23
A coated chamber component comprises a body and a protective ceramic coating deposited over a surface of the body, the protective ceramic coating being amorphous and comprising about 8-20% by weight yttrium, about 20-32% by weight aluminum, and about 60-70% by weight oxygen.
Wendell Glenn Boyd, Jr., Vijay D. Parkhe, Teng-Fang Kuo, Zhenwen Ding
Filed: 25 Apr 22
Utility
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26 Sep 23
Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described.
Tejas Ulavi, Vijay D. Parkhe, Naveen Kumar Nagaraja, Sanjeev Baluja, Surajit Kumar, Dhritiman Subha Kashyap, Ashutosh Agarwal
Filed: 13 Dec 22
Utility
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26 Sep 23
A robot device includes a first link and a second link coupled to the first link via an elbow.
Alexander Berger, Paul Lawrence Korff, William Paul Laceky, Jeffrey C. Hudgens, Rajkumar Thanu, Damon K. Cox, Matvey Farber
Filed: 23 Sep 20
Utility
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26 Sep 23
A method of encapsulating an organic light emitting diode (OLED) is provided.
Tae Kyung Won, Soo Young Choi, Sanjay D. Yadav
Filed: 25 Mar 21
Utility
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19 Sep 23
A calibration object is placed at a target orientation in a station of an electronics processing device by a first robot arm, and then retrieved from the station by the first robot arm.
Nicholas Michael Bergantz, Damon K. Cox, Alexander Berger
Filed: 28 Apr 20
Utility
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19 Sep 23
Molybdenum(0) and coordination complexes are described.
Chandan Kr Barik, John Sudijono, Chandan Das, Doreen Wei Ying Yong, Mark Saly, Bhaskar Jyoti Bhuyan, Feng Q. Liu
Filed: 21 Apr 21
Utility
fjcfm364aezp6kjx8lubjthtleszsb7sfzs9idtgbb9qq26n7f
19 Sep 23
Examples disclosed herein relate to a method and apparatus for inspecting lamp dimensions.
Govinda Raj, Vilen K. Nestorov
Filed: 19 Sep 22
Utility
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19 Sep 23
A complete, unified material-to-systems simulation, design, and verification method for semiconductor design and manufacturing may include evaluating effects of semiconductor material or process changes on software algorithms.
Bhuvaneshwari Ayyagari, Angada Bangalore Sachid
Filed: 20 Sep 21
Utility
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19 Sep 23
Memory devices are described.
Sung-Kwan Kang, Gill Yong Lee, Chang Seok Kang
Filed: 18 May 21
Utility
do6ten1c570q330jjv84ojqo
19 Sep 23
Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein.
Alvaro Garcia De Gorordo, Daniel Sang Byun, Andreas Schmid, Stephen Donald Prouty, Andrew Antoine Noujaim
Filed: 15 Jun 20
Utility
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19 Sep 23
Methods of reducing wafer bowing in 3D DRAM devices are described using a 3-color process.
Arvind Kumar, Mahendra Pakala, Ellie Y. Yieh, John Tolle, Thomas Kirschenheiter, Anchuan Wang, Zihui Li
Filed: 28 Sep 21
Utility
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19 Sep 23
Water soluble organic-inorganic hybrid masks and mask formulations, and methods of dicing semiconductor wafers are described.
Wenguang Li, James S. Papanu
Filed: 17 Nov 21
Utility
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19 Sep 23
Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate.
Jimin Zhang, Brian J. Brown, Eric Lau, Ekaterina Mikhaylichenko, Jeonghoon Oh, Gerald J. Alonzo
Filed: 1 Jun 21
Utility
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19 Sep 23
Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein.
Ludovic Godet, Rutger Meyer Timmerman Thijssen
Filed: 28 Mar 22