3198 patents
Page 16 of 160
Utility
Ruthenium liner and cap for back-end-of-line applications
19 Sep 23
Electronic devices and methods of forming electronic devices using a ruthenium or doped ruthenium liner and cap layer are described.
Wenjing Xu, Feng Chen, Tae Hong Ha, Xianmin Tang, Lu Chen, Zhiyuan Wu
Filed: 22 Jul 21
Utility
Carrier head with segmented substrate chuck
19 Sep 23
A carrier head for a chemical mechanical polishing apparatus includes a carrier body, an outer membrane assembly, an annular segmented chuck, and an inner membrane assembly.
Steven M. Zuniga, Jay Gurusamy
Filed: 5 May 22
Utility
o1grv4ab8cnli0wgtkcetw0 t4265cofagyasy7i4dlhv
19 Sep 23
Methods and apparatus for processing substrates are provided herein.
Mengxue Wu, Siew Kit Hoi, Jay Min Soh
Filed: 25 May 21
Utility
gnrtazjw 77ujlgyntqw5y
19 Sep 23
Aspects of the present disclosure generally relate to oscillating a boundary layer of a flow of process gas in methods and systems for processing substrates.
Tsung-Han Yang, Christopher S. Olsen
Filed: 5 Jan 21
Utility
wc76dbhpv76bvg72tbz g9tetagdeyarskhm7x5dgzn0rw3
19 Sep 23
Methods for controlling pulse shape in ALD processes improves local non-uniformity issues of films deposited on substrate surface.
Joseph AuBuchon, Kevin Griffin, Hanhong Chen
Filed: 18 Sep 20
Utility
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19 Sep 23
Using the systems and methods discussed herein, CMAS corrosion is inhibited via CMAS interception in an engine environment and/or is prevented or reduced by the formation of a metal oxide protective coating on a hot engine section component.
David Britz, Pravin K. Narwankar, David Thompson, Yuriy Melnik, Sukti Chatterjee
Filed: 6 May 21
Utility
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19 Sep 23
Extreme ultraviolet (EUV) mask blanks, production systems therefor, and methods of reducing roughness are disclosed.
Vibhu Jindal, Herng Yau Yoong, Wen Xiao
Filed: 16 Jun 21
Utility
bjoiluzllle1x952u23i2zq6q58v5 gm06hgj65za2mbnp3nkyjklv
19 Sep 23
Memory devices and methods of forming memory devices are described.
Sung-Kwan Kang, Fredrick Fishburn, Abdul Wahab Mohammed, Gill Yong Lee
Filed: 25 Apr 22
Utility
00wixet903avsk86hcfgzmerntve5cvmqxkv9ebde1lpcv
12 Sep 23
Input data may be received.
Vadim Vereschagin, Roman Kris, Ishai Schwarzband, Boaz Cohen, Evgeny Bal, Ariel Shkalim
Filed: 14 Mar 22
Utility
y5kuz4w5xfnquge2l1s4nu9
12 Sep 23
A method of cleaning a surface of a substrate uses alcohol and water treatments.
Carmen Leal Cervantes, Alexander Jansen, Xiangjin Xie
Filed: 5 Jul 22
Utility
yxss34vrbikwxhutwexsf
12 Sep 23
A high-pressure processing system for processing a layer on a substrate includes a first chamber, a support to hold the substrate in the first chamber, a second chamber adjacent the first chamber, a foreline to remove gas from the second chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, a gas delivery system configured to increase the pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, an exhaust system comprising an exhaust line to remove gas from the first chamber, and a common housing surrounding both the first gas delivery module and the second gas delivery module.
Qiwei Liang, Srinivas D. Nemani, Sean S. Kang, Adib Khan, Ellie Y. Yieh
Filed: 29 Nov 22
Utility
mku7k4x96vrgcjhe4cqanoq7l3l vmqcdu19wutwlhlxu5n4
12 Sep 23
A carrier FOUP and a method of placing a carrier are provided.
Steven Trey Tindel, Alexander N. Lerner, Kim Ramkumar Vellore
Filed: 12 Sep 19
Utility
8p3xmg9saldibfsq25v8on7gn754kirjxsk6zyhy403kvapnjfo
12 Sep 23
Methods and apparatus for processing a substrate are provided herein.
Ying Wang, Ruiping Wang
Filed: 22 Oct 21
Utility
7yen901 sm8twbkurjk39xfmtnic9trrrht3nf1caqwesklrnzy8
12 Sep 23
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system.
Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang
Filed: 15 Apr 20
Utility
eeai08h1uiqh4cp01d25rr331zt37m7kcnqf8gyr76wz4eh38d ch8
12 Sep 23
Apparatus and methods for supplying a vapor to a processing chamber are described.
Kenric Choi, William J. Durand
Filed: 5 Jun 20
Utility
kbnqjoz9omn0w41nkjknhb5gfyp0pclezmnnz92b l4i4fp3bzj20j
12 Sep 23
Using the systems and methods discussed herein, CMAS corrosion is inhibited via CMAS interception in an engine environment and/or is prevented or reduced by the formation of a metal oxide protective coating on a hot engine section component.
David Britz, Pravin K. Narwankar, David Thompson, Yuriy Melnik, Sukti Chatterjee
Filed: 6 May 21
Utility
vpz3yq71bq1fgg9qgtyuyo12j4phsihbykc7uucvwsqne9
12 Sep 23
Using the systems and methods discussed herein, CMAS corrosion is inhibited via CMAS interception in an engine environment and/or is prevented or reduced by the formation of a metal oxide protective coating on a hot engine section component.
David Britz, Pravin K. Narwankar, David Thompson, Yuriy Melnik, Sukti Chatterjee
Filed: 6 May 21
Utility
lqxm7kq5znzhtsktyv8jqgkjvsx5uhp1j w6it79my
12 Sep 23
Extreme ultraviolet (EUV) mask blanks, methods for their manufacture and production systems therefor are disclosed.
Vibhu Jindal
Filed: 12 Apr 21
Utility
w65ugrffgct2tbh17yd4llzklsm24yt4tvqd2t8nu
12 Sep 23
The present disclosure generally relates to methods of forming optical devices comprising nanostructures disposed on transparent substrates.
Yongan Xu, Jinxin Fu, Jhenghan Yang, Ludovic Godet
Filed: 23 Nov 21
Utility
d842scz p7zg89kmsrq8ja2szue4rx4cswka61wmoyzxz1c3dsbq
12 Sep 23
Exemplary methods of semiconductor processing may include etching one or more features partially through a dielectric material to expose material from one or more layer pairs formed on a substrate.
Bhaskar Jyoti Bhuyan, Zeqing Shen, Susmit Singha Roy, Abhijit Basu Mallick
Filed: 20 Aug 21