3198 patents
Page 18 of 160
Utility
Apparatus, system, and method for non-contact temperature monitoring of substrate supports
5 Sep 23
Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing.
Bhaskar Prasad, Kirankumar Neelasandra Savandaiah, Thomas Brezoczky, Srinivasa Rao Yedla
Filed: 27 Jul 20
Utility
Chamber matching and calibration
5 Sep 23
A method includes receiving a plurality of sets of sensor data associated with a processing chamber of a substrate processing system.
Xuesong Lu, Yu Lei, Anup Phatak, Hyman W. H. Lam, Chong Jiang, Malcolm Emil Delaney, Yufei Hu
Filed: 6 Jul 20
Utility
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5 Sep 23
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup.
Jagan Rangarajan, Edward Golubovsky, Shaun Van Der Veen, Justin Ho Kuen Wong, Steven M. Zuniga
Filed: 9 Jan 20
Utility
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5 Sep 23
Embodiments of the disclosure relate to an apparatus and method for processing semiconductor substrates.
Sultan Malik, Srinivas D. Nemani, Qiwei Liang, Adib M. Khan
Filed: 6 Dec 19
Utility
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5 Sep 23
A method for etching a metal containing feature is provided.
Suketu Arun Parikh
Filed: 10 Jun 21
Utility
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5 Sep 23
Embodiments herein include void-free material depositions on a substrate (e.g., in a void-free trench-filled (VFTF) component) obtained using directional etching to remove predetermined portions of a seed layer covering the substrate.
M. Arif Zeeshan, Kelvin Chan, Shantanu Kallakuri, Sony Varghese, John Hautala
Filed: 22 Sep 20
Utility
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22 Aug 23
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to press an abrasive body against the polishing surface, an in-situ polishing pad monitoring system including an imager disposed above the platen to capture an image of the polishing pad, and a controller configured to receive the image from the monitoring system and generate a measure of polishing pad surface roughness based on the image.
Thomas H. Osterheld, Benjamin Cherian
Filed: 16 Mar 20
Utility
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22 Aug 23
Certain embodiments of the present disclosure relate to ceramic materials with high thermal shock resistance and high erosion resistance.
Ren-Guan Duan, Jennifer Y. Sun
Filed: 4 Aug 20
Utility
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22 Aug 23
A vapor deposition apparatus is described.
Stefan Bangert, Andreas Lopp
Filed: 27 May 21
Utility
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22 Aug 23
Hydrogen free (low-H) silicon dioxide layers are disclosed.
Zeqing Shen, Bo Qi, Abhijit Basu Mallick, Nitin K. Ingle
Filed: 11 Feb 21
Utility
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22 Aug 23
Embodiments of the present disclosure generally relate to protective coatings on an aerospace component and methods for depositing the protective coatings.
Sukti Chatterjee, Lance A. Scudder, Yuriy Melnik, David A. Britz, Thomas Knisley, Kenichi Ohno, Pravin K. Narwankar
Filed: 16 Apr 20
Utility
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22 Aug 23
The present disclosure generally provides methods of providing at least metastable radical molecular species and/or radical atomic species to a processing volume of a process chamber during an electronic device fabrication process, and apparatus related thereto.
Vishwas Kumar Pandey, Eric Kihara Shono, Kartik Shah, Christopher S. Olsen, Agus Sofian Tjandra, Tobin Kaufman-Osborn, Taewan Kim, Hansel Lo
Filed: 24 Oct 19
Utility
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22 Aug 23
Methods of depositing an encapsulation stack without damaging underlying layers are discussed.
Cong Trinh, Mihaela A. Balseanu, Maribel Maldonado-Garcia, Ning Li, Mark Saly, Bhaskar Jyoti Bhuyan, Keenan N. Woods, Lisa J. Enman
Filed: 29 Jul 20
Utility
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22 Aug 23
Process chamber lids, processing chambers and methods using the lids are described.
Muhannad Mustafa, Muhammad M. Rasheed, Mario D. Sanchez, Srinivas Gandikota, Wei V. Tang
Filed: 17 Aug 22
Utility
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22 Aug 23
Embodiments disclosed herein include optical sensor systems and methods of using such systems.
Chuang-Chia Lin, Upendra Ummethala, Steven E. Babayan, Lei Lian
Filed: 3 Sep 21
Utility
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22 Aug 23
Methods of depositing a film selectively onto a first material relative to a second material are described.
Chang Ke, Lei Zhou, Biao Liu, Cheng Pan, Yuanhong Guo, Liqi Wu, Michael S. Jackson, Ludovic Godet, Tobin Kaufman-Osborn, Erica Chen, Paul F. Ma
Filed: 8 Sep 20
Utility
2jqj3w7ft2vzfb5h5etsr95sbhxu4eso76cuuopb2j1oy1z2a
22 Aug 23
A method and apparatus for Marangoni substrate drying is disclosed which includes an adjustable spray bar assembly having mounting brackets coupled to a support structure of a drying system, a base assembly coupled to the mounting brackets and disposed parallel to a face of the support structure, and a mounting assembly coupled to and parallel with the base assembly.
Edwin Velazquez, Jagan Rangarajan
Filed: 2 Dec 19
Utility
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22 Aug 23
Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber.
Tien Fak Tan, Lok Kee Loh, Dmitry Lubomirsky, Soonwook Jung, Martin Yue Choy, Soonam Park
Filed: 9 Dec 19
Utility
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22 Aug 23
Embodiments disclosed herein include a processing tool for semiconductor processing.
Kartik Santhanam, Kartik Shah, Wolfgang Aderhold, Martin Hilkene, Stephen Moffatt
Filed: 20 Oct 20
Utility
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22 Aug 23
Processing methods may be performed to form an airgap spacer on a semiconductor substrate.
Ashish Pal, Gaurav Thareja, Sankuei Lin, Ching-Mei Hsu, Nitin K. Ingle, Ajay Bhatnagar, Anchuan Wang
Filed: 22 Dec 21