3198 patents
Page 17 of 160
Utility
Techniques for improved low dielectric constant film processing
12 Sep 23
A method may include providing a substrate having, on a first surface of the substrate, a low dielectric constant layer characterized by a layer thickness.
Rajesh Prasad, Martin Seamons, Shan Tang, Qi Gao, Deven Raj Mittal, Kyuha Shim
Filed: 12 May 21
Utility
Platen shield cleaning system
12 Sep 23
In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield.
Shantanu Rajiv Gadgil, Sumit Subhash Patankar, Nathan Arron Davis, Allen L. D'Ambra
Filed: 29 Dec 22
Utility
8luty9yvu7g4rkgq0vgqhon1bx23ay0obppmcsj
12 Sep 23
Embodiments of the present disclosure generally relate to apparatus and methods for reducing substrate backside damage during semiconductor device processing.
Liangfa Hu, Abdul Aziz Khaja, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Yoichi Suzuki
Filed: 22 Apr 20
Utility
vm71ova0jb3oje52kqwwkp7f
12 Sep 23
Methods for forming a transition metal material on a substrate and thermal processing such metal containing material in a cluster processing system are provided.
Keith Tatseun Wong, Srinivas D. Nemani, Ellie Y. Yieh
Filed: 20 Nov 18
Utility
35t083f1rt7y hsgm76xn3c
12 Sep 23
A method of transferring micro-devices includes attaching micro-devices to one surface of a first body with a first adhesive layer, and selectively forming a masking layer on an opposite surface of the first body.
Manivannan Thothadri, Arvinder Chadha
Filed: 20 Sep 21
Utility
sp80coeses1sziw2486zx4d4qrasq8w6hkle3v
12 Sep 23
Flexible display devices, such as flexible cover lens films, are discussed and provided herein.
Manivannan Thothadri, Daniel Paul Forster, Robert F. Praino, Jr., Harvey You
Filed: 15 Apr 21
Utility
3mh73ia774qtmqz a74dj4945aw6f4t8l83o55eekrqda
5 Sep 23
A substrate cleaning device may include a chamber body configured to hold a substrate and a brush assembly.
Steven M. Zuniga, Jay Gurusamy, Jagan Rangarajan
Filed: 30 Jan 20
Utility
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5 Sep 23
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same.
Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
Filed: 22 Mar 21
Utility
tplqub3lmcgmvw715gknb559mii7p3pb
5 Sep 23
Gas distribution apparatus, processing chambers and methods using a dead volume-free valve are described.
Ashutosh Agarwal, Sanjeev Baluja
Filed: 20 Sep 22
Utility
1x27rp9m0r4kee46l0m43jatqrxcd9naf
5 Sep 23
A gas is received through an inlet.
Vijay D. Parkhe
Filed: 3 Aug 17
Utility
ntm1r603h41f403ov22u5elj m2v3eru2ip5tc6kz80pm9fwnosugh
5 Sep 23
Methods of forming a DRAM bit line to improve line edge roughness (LER) and lower resistance are described.
Lequn Liu, Priyadarshi Panda, Jonathan C. Shaw
Filed: 11 Apr 22
Utility
zrfdmcwl7pgzfu8yy38wh0b8u3td7zvi206myw0oxnbc
5 Sep 23
Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein.
Ji Young Choung, Chung-chia Chen, Yu Hsin Lin, Jungmin Lee, Dieter Haas, Si Kyoung Kim
Filed: 27 Sep 22
Utility
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5 Sep 23
Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications.
Yangyang Sun, Jinxin Fu, Kazuya Daito, Ludovic Godet
Filed: 4 Oct 21
Utility
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5 Sep 23
Memory devices are described.
Chang Seok Kang, Tomohiko Kitajima, Gill Yong Lee, Sanjay Natarajan, Sung-Kwan Kang, Lequn Liu
Filed: 15 Dec 21
Utility
fx5b1sfn3m8zr1k3ilbvxpawzuofc8mq sp9tb3yq5uepcpt9t5g3c
5 Sep 23
A system and method for controlling an amount of outgassing caused by implanting ions into a photoresist disposed on a workpiece.
Nevin Clay, David Roger Timberlake, Christopher W. Campbell
Filed: 24 Jan 22
Utility
eq5ve9jbxhq63gmnk6xvjt6pgn2ls0xg0h zs8dgjmw
5 Sep 23
Methods and apparatus for supplying radio frequency (RF) power to a process chamber.
Gary Leray
Filed: 28 Feb 18
Utility
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5 Sep 23
Methods and apparatus for processing a substrate are provided herein.
John Poulose, Kartik Ramaswamy
Filed: 23 Feb 21
Utility
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5 Sep 23
Methods and apparatus for processing a substrate are provided.
Hao Jiang, Chi Lu, He Ren, Mehul Naik
Filed: 4 May 21
Utility
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5 Sep 23
Electronic device processing assemblies including an EFEM with at least one side storage pod attached thereto.
Patrick Pannese, Murali Narasimhan, Paul B. Reuter, Nir Merry
Filed: 18 Oct 19
Utility
4x3lv2ugvd1h1hsen5ewnw32ay
5 Sep 23
Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems.
Nir Merry, Jeff Hudgens
Filed: 21 Aug 20