3198 patents
Page 23 of 160
Utility
Tungsten defluorination by high pressure treatment
18 Jul 23
An annealing system is provided that includes a chamber body that defines a chamber, a support to hold a workpiece and a robot to insert the workpiece into the chamber.
Keith Tatseun Wong, Thomas Jongwan Kwon, Sean Kang, Ellie Y. Yieh
Filed: 26 Nov 19
Utility
Substrate handling systems
18 Jul 23
An apparatus for transferring a substrate is disclosed herein.
Gee Sun Hoey, Balasubramaniam Coimbatore Jaganathan, Jagan Rangarajan
Filed: 13 Nov 20
Utility
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18 Jul 23
The present disclosure relates to micro-via structures for interconnects in advanced wafer level semiconductor packaging.
Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho, Tapash Chakraborty, Han-Wen Chen, Steven Verhaverbeke
Filed: 18 May 21
Utility
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18 Jul 23
Exemplary methods of forming a semiconductor structure may include forming a doped silicon layer on a semiconductor substrate.
Ashish Pal, El Mehdi Bazizi, Siddarth Krishnan, Xing Chen, Lan Yu, Tyler Sherwood
Filed: 8 Feb 21
Utility
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11 Jul 23
A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.
Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung, Hui Chen, Hari Soundararajan, Benjamin Cherian
Filed: 15 Apr 20
Utility
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11 Jul 23
The present disclosure generally provides methods of providing at least metastable radical molecular species and/or radical atomic species to a processing volume of a process chamber during an electronic device fabrication process, and apparatus related thereto.
Vishwas Kumar Pandey, Eric Kihara Shono, Kartik Shah, Christopher S. Olsen, Agus Sofian Tjandra, Tobin Kaufman-Osborn, Taewan Kim, Hansel Lo
Filed: 24 Oct 19
Utility
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11 Jul 23
Embodiments of the disclosure relate to faceplates for a processing chamber.
Amit Kumar Bansal, Saket Rathi, Tuan Anh Nguyen
Filed: 28 Dec 21
Utility
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11 Jul 23
Embodiments of the present disclosure generally relate to protective coatings on aerospace components and methods for depositing the protective coatings.
Sukti Chatterjee, Kenichi Ohno, Lance A. Scudder, Yuriy Melnik, David A. Britz, Pravin K. Narwankar, Thomas Knisley, Mark Saly, Jeffrey Anthis
Filed: 4 Sep 19
Utility
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11 Jul 23
Electroplating systems may include an electroplating chamber.
Nolan L. Zimmerman, Charles Sharbono, Gregory J. Wilson, Paul R. McHugh, Paul Van Valkenburg, Deepak Saagar Kalaikadal, Kyle M. Hanson
Filed: 23 Oct 20
Utility
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11 Jul 23
Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
Eric J. Bergman, Stuart Crane, Tricia A. Youngbull, Timothy G. Stolt
Filed: 23 May 22
Utility
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11 Jul 23
Embodiments of the present disclosure relate to a carrier mechanism for retaining optical devices.
Benjamin B. Riordon, Kangkang Wang
Filed: 4 May 21
Utility
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11 Jul 23
A method of performing an ion implantation process using a beam-line ion implanter, including disposing a substrate on a platen, analyzing the substrate using metrology components, communicating data relating to the analysis of the substrate to a feedforward controller, processing the data using a predictive model executed by the feedforward controller to compensate for variations in the substrate and to compensate for variations in components of the beam-line ion implanter based on historical data collected from previous implantation operations, and using output from the predictive model to adjust operational parameters of the beam-line ion implanter.
Supakit Charnvanichborikarn, Wei Zou, Hans-Joachim L. Gossmann, Qintao Zhang, Aseem Kumar Srivastava, William Robert Bogiages, Jr., Wei Zhao
Filed: 7 Feb 22
Utility
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11 Jul 23
Exemplary semiconductor substrate supports may include a pedestal shaft.
Khokan Chandra Paul, Ravikumar Patil, Vijet Patil, Carlaton Wong, Adam J. Fischbach, Timothy Franklin, Tsutomu Tanaka, Canfeng Lai
Filed: 8 Sep 20
Utility
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11 Jul 23
Embodiments of this disclosure describe a feedback loop that can be used to maintain a nearly constant sheath voltage and thus creating a mono-energetic IEDF at the surface of the substrate.
Leonid Dorf, Evgeny Kamenetskiy, James Rogers, Olivier Luere, Rajinder Dhindsa, Viacheslav Plotnikov
Filed: 22 Jan 20
Utility
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11 Jul 23
Exemplary methods of treating a chamber may include delivering a cleaning precursor to a remote plasma unit.
Sarah Michelle Bobek, Ruiyun Huang, Abdul Aziz Khaja, Amit Bansal, Dong Hyung Lee, Ganesh Balasubramanian, Tuan Anh Nguyen, Sungwon Ha, Anjana M. Patel, Ratsamee Limdulpaiboon, Karthik Janakiraman, Kwangduk Douglas Lee
Filed: 25 May 21
Utility
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11 Jul 23
Embodiments of the present disclosure generally relate to methods of forming hardmasks.
Jui-Yuan Hsu, Pramit Manna, Bhaskar Kumar, Karthik Janakiraman
Filed: 21 Oct 20
Utility
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11 Jul 23
A substrate cleaning system includes a cleaner module to clean a substrate after polishing of the substrate, a drier module to dry the substrate after cleaning by the cleaner module, a substrate support movable along a first axis from a first position in the drier module to a second position outside the drier module, and an in-line metrology station including a line-scan camera positioned to scan the substrate as the substrate is held by the substrate support and the substrate support is between the first position to the second position.
Dominic J. Benvegnu, Jun Qian, Boguslaw A. Swedek, Thomas H. Osterheld
Filed: 25 Feb 21
Utility
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11 Jul 23
Exemplary substrate support assemblies may include a platen characterized by a first surface configured to support a semiconductor substrate.
Jian Li, Edward P. Hammond, Viren Kalsekar, Vidyadharan Srinivasa Murthy Bangalore, Juan Carlos Rocha-Alvarez
Filed: 7 Jul 20
Utility
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11 Jul 23
A body of an electrostatic chuck comprises mesas disposed on a polished surface of the body.
Wendell Glenn Boyd, Jr., Stanley Wu, Matthew Boyd
Filed: 23 Feb 21
Utility
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11 Jul 23
Embodiments of the present technology may include semiconductor processing methods that include depositing a film of semiconductor material on a substrate in a substrate processing chamber.
Mandar B. Pandit, Man-Ping Cai, Wenhui Li, Michael Wenyoung Tsiang, Praket Prakash Jha, Jingmin Leng
Filed: 14 Oct 20