28912 patents
Page 14 of 1446
Utility
Ferroelectric memory cell
9 Jan 24
A ferroelectric memory cell (FeRAM) is disclosed that includes an active device (e.g., a transistor) and a passive device (e.g., a ferroelectric capacitor) integrated in a substrate.
Chung-Liang Cheng, Huang-Lin Chao
Filed: 10 Sep 21
Utility
Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls
9 Jan 24
Various embodiments of the present application are directed towards an integrated circuit comprising a resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls to mitigate the effect of sidewall plasma damage.
Yuan-Tai Tseng, Shih-Chang Liu
Filed: 7 Mar 22
Utility
Semiconductor Device and Manufacturing Method Thereof
4 Jan 24
A memory device and a manufacturing method thereof is described.
Po-Ting Lin, Wei-Chih Wen, Kai-Wen Cheng, Wu-Wei Tsai, Yu-Ming Hsiang, Yan-Yi Chen, Hai-Ching Chen, Yu-Ming Lin, Chung-Te Lin
Filed: 4 Jul 22
Utility
PCM Device
4 Jan 24
In various embodiments, an improved structure for a PCM device is provided.
Chang-Chih Huang, Han-Yu Chen, Yu-Sheng Chen, Kuo-Chyuan Tzeng
Filed: 29 Jun 22
Utility
Memory Device and Fabrication Method Thereof
4 Jan 24
A memory device and a fabrication method thereof are provided.
Yu-Chao Lin, Tung-Ying Lee, Shao-Ming Yu
Filed: 3 Jul 22
Utility
Systems and Methods for Actinic Mask Inspection and Review In Vacuum
4 Jan 24
In a mask review method, a vacuum is drawn in a vacuum chamber that contains an extreme ultraviolet (EUV) actinic mask review system including an EUV illuminator, a mask stage, a projection optics box, and an EUV imaging sensor.
Chien-Lin Chen, Danping Peng, Chih-Chiang Tu, Chih-Wei Wen, Hsin-Fu Tseng
Filed: 4 Jan 23
Utility
Gap Filling Method In Semiconductor Manufacturing Process
4 Jan 24
A method for filling a gap in a semiconductor structure includes: forming the gap between two raised portions of the semiconductor structure, the gap having a bottom surface and two lateral surfaces each extending upwardly from the bottom surface along one of the raised portions to terminate at an upper surface of a corresponding one of the raised portions; and forming a filler element in the gap in a bottom-up manner that avoids the filler element being formed laterally.
Yi-Hsiu CHEN, Shao-An WANG, Kenichi SANO, Andrew Joseph KELLY
Filed: 30 Jun 22
Utility
Lithography System and Method Including Thermal Management
4 Jan 24
The present disclosure provides a method for lithography system that includes one or more thermal sensors that provide feedback to a thermal management controller.
Chia-Wei WANG
Filed: 25 Jan 23
Utility
Semiconductor Device and Method of Forming the Same
4 Jan 24
A semiconductor device includes a first electrode, a first dielectric layer, a second electrode and an insulating layer.
Yu-Chao Lin, Jung-Piao Chiu, Bo-Jiun Lin, Chih-Sheng Chang
Filed: 4 Jul 22
Utility
Semiconductor Structure and Method for Forming the Same
4 Jan 24
A semiconductor structure includes a waveguide and an optical attenuator.
WEI-KANG LIU, LEE-SHIAN JENG, CHIH-TSUNG SHIH, HAU-YAN LU, YINGKIT FELIX TSUI
Filed: 1 Jul 22
Utility
Semiconductor Device
4 Jan 24
A semiconductor device includes first and second conductive layers, a first epitaxial structure and a first via structure.
Ching-Yu HUANG, Shih-Wei PENG, Chia-Tien WU, Wei-Cheng LIN, Jiann-Tyng TZENG
Filed: 30 Jun 22
Utility
Optical Waveguide Termination
4 Jan 24
The present disclosure relates to optical waveguide termination devices.
Cheng-Tse TANG, Chewn-Pu JOU, Chia-Ju YU, CHENG HSIAO
Filed: 30 Jun 22
Utility
Protective Package Assembly
4 Jan 24
A protective package assembly includes middle, upper, and lower packages.
Ming-Chien CHIU, En-Nien SHEN, Chia-Ho CHUANG, Kuo-Hua LEE, Jyun-Ming LYU, Tzu Ang CHIANG, Yi-Feng HUANG, Tsung-Yi LIN
Filed: 5 Jun 23
Utility
Photonic Circuitry Having Stacked Optical Resonators
4 Jan 24
An optical device includes a first ring resonator positioned in a first plane, a first optical waveguide positioned in the first plane and configured to provide photons to the first ring resonator, a second ring resonator positioned in a second plane that is below the first plane, and a second optical waveguide positioned in the second plane.
Wen-Hao Cheng
Filed: 22 Mar 23
Utility
Package Structure and Method of Fabricating the Same
4 Jan 24
A package structure includes a circuit substrate, a semiconductor device, a plurality of cooling pins, a cooler lid, an anti-fouling coating and a top lid.
Chen-Chiang Yu, Tsung-Fu Tsai, Szu-Wei Lu
Filed: 30 Jun 22
Utility
Embedded Silicon Photonics Chip In a Multi-die Package
4 Jan 24
A semiconductor package includes a base substrate structure having a top surface that includes conductive regions disposed in a dielectric region.
Jen-Yuan Chang
Filed: 8 Aug 23
Utility
Semiconductor Stack Structure and Manufacturing Method Thereof
4 Jan 24
Disclosed are a semiconductor stack structure and a manufacturing method of a semiconductor stack structure.
Chuei-Tang Wang, Chien-Yuan Huang, Shih-Chang Ku
Filed: 30 Jun 22
Utility
Pellicle Membrane with Improved Properties
4 Jan 24
A pellicle assembly includes a pellicle membrane with a nanotube layer formed from thick nanotube bundles.
Pei-Cheng Hsu, Wei-Hao Lee, Ting-Pi Sun, Chia-Tung Kuo, Huan-Ling Lee, Hsin-Chang Lee, Chin-Hsiang Lin
Filed: 30 Jun 22
Utility
Semiconductor Structure
4 Jan 24
A semiconductor structure is provided.
Jhon-Jhy LIAW
Filed: 29 Jun 22
Utility
Radiation Collector
4 Jan 24
Methods and apparatuses for a lithography exposure process are described.
Cheng Hung TSAI, Sheng-Kang YU, Shang-Chieh CHIEN, Heng-Hsin LIU, Li-Jui CHEN
Filed: 30 Jun 22