28912 patents
Page 34 of 1446
Utility
Semiconductor Device and Method of Forming the Same
14 Dec 23
Provided are a semiconductor device and a method of forming the same.
Yi-Ruei Jhan, Kuan-Ting Pan, Yu-Wei Lu, Shi-Ning Ju, Kuo-Cheng Chiang, Chih-Hao Wang
Filed: 29 May 22
Utility
Method of Using Wafer Stage
14 Dec 23
A method of controlling a wafer stage includes moving the wafer stage to position an immersion hood over a first sensor in the wafer stage.
Yung-Yao LEE, Wei Chih LIN, Chih Chien LIN
Filed: 10 Aug 23
Utility
Graphene-clad Metal Interconnect
14 Dec 23
A graphene-clad metal interconnect extends material properties of graphene to both damascene and patterned interconnect structures at lower metal layers, leading to significant reductions in resistance.
Jian-Hong LIN, Yinlung LU, Jun HE, An Shun TENG, Chun-Wei CHANG
Filed: 10 Jun 22
Utility
Systems and Methods for Context Aware Circuit Design
14 Dec 23
Systems and methods for context aware circuit design are described herein.
Li-Chung HSU, Yen-Pin CHEN, Sung-Yen YEH, Jerry Chang-Jui KAO, Chung-Hsing WANG
Filed: 10 Aug 23
Utility
Semiconductor Device Including Dielectrics Made of Porous Organic Frameworks, and Method of Fabricating the Same
14 Dec 23
A semiconductor device includes a substrate and an interconnection layer disposed on the substrate.
Szu-Hua Chen, Wei-Yen Woon, Szuya Liao
Filed: 13 Jun 22
Utility
Pin Access Hybrid Cell Height Design and System
14 Dec 23
A method of generating a layout diagram for an integrated circuit includes arranging a plurality of cells in the layout diagram, wherein each cell of the plurality of cells comprises a first power rail along a first boundary and a second power rail along a second boundary, and the first boundary is spaced from the second boundary in a first direction.
Kam-Tou SIO, Jiann-Tyng TZENG
Filed: 31 Jul 23
Utility
Semiconductor Package and Manufacturing Method of Semiconductor Package
14 Dec 23
A semiconductor package includes an interconnect structure, a plurality of dies disposed on the interconnect structure in a side-by-side manner, an underfill filling between the interconnect structure and the plurality of dies and filling a lower part of a gap between adjacent two of the plurality of dies, a conductive layer at least covering back surfaces of the adjacent two of the plurality of dies and filling an upper part of the gap, and an encapsulating material laterally encapsulating the plurality of dies and the conductive layer.
Hsien-Wei Chen, Meng-Liang Lin, Kuan Liang Liu, Shin-Puu Jeng
Filed: 17 May 22
Utility
Reduced Area Standard Cell Abutment Configurations
14 Dec 23
A method of designing a semiconductor device including the operations of analyzing a vertical abutment between a first standard cell block and a second cell block and, if a mismatch is identified between the first standard cell block and the second cell block initiating the selection of a first modified cell block that reduces the mismatch and a spacing between the first modified cell block and the second cell block, the first modified cell block comprising a first abutment region having a continuous active region arranged along a first axis parallel to an edge of the vertical abutment, and replacing the first standard cell block with the first modified cell block to obtain a first modified layout design and devices manufactured according to the method.
Chi-Yu LU, Hui-Zhong ZHUANG, Pin-Dai SUE, Yi-Hsin KO, Li-Chun TIEN
Filed: 9 Aug 23
Utility
Protection Layer for Semiconductor Device
14 Dec 23
The present disclosure describes a method to form a semiconductor structure having an oxide structure on a wafer edge.
I-Han Huang, Fu-Cheng Chang, Wen-Ting Lan, Shi Ning Ju, Lin-Yu Huang, Kuo-Cheng Chiang
Filed: 20 Mar 23
Utility
Semiconductor Structure and Method for Forming the Same
14 Dec 23
The present disclosure provides a semiconductor structure.
JUN-NAN NIAN, YAO-HSIANG LIANG, JU PO TUNG, CHIEH-MIN LIU, MING-CHING CHUNG
Filed: 10 Jun 22
Utility
Method of Forming Package Structure
14 Dec 23
A method includes attaching a wafer to a wafer chuck having a curved surface.
Wen-Chih Chiou, Yung-Chi Lin, Yen-Ming Chen
Filed: 13 Jun 22
Utility
Semiconductor Device Including Structure Connecting Frontside and Backside Metal and Method of Manufacturing the Same
14 Dec 23
The present disclosure provides a semiconductor device and a method of manufacturing a semiconductor device.
CHIA-TIEN WU, WEI-CHENG LIN
Filed: 9 Jun 22
Utility
Semiconductor Device Structure and Method for Forming the Same
14 Dec 23
A semiconductor device structure is provided.
Sai-Hooi YEONG, Chi-On CHUI, Chien-Ning YAO
Filed: 27 Jul 23
Utility
Memory Device
14 Dec 23
A memory device is provided, the memory device includes multiple cells arranged in a matrix of multiple rows and multiple columns.
CHIEN-AN LAI, CHUNG-CHENG CHOU, YU-DER CHIH
Filed: 18 Aug 23
Utility
Semiconductor Memory Devices and Methods of Manufacturing Thereof
14 Dec 23
A semiconductor device comprises a first conductive structure extending along a vertical direction and a second conductive structure extending along the vertical direction.
Peng-Chun Liou, Ya-Yun Cheng, Yi-Ching Liu, Meng-Han Lin, Chia-En Huang
Filed: 8 Aug 23
Utility
Carbon-based Liner to Reduce Contact Resistance
14 Dec 23
A layer of carbon (e.g., graphite or graphene) at a metal interface (e.g., between an MEOL interconnect and a gate contact or a source or drain region contact, between an MEOL contact plug and a BEOL metallization layer, and/or between BEOL conductive structures) is used to reduce contact resistance at the metal interface, which increases electrical performance of an electronic device.
Po-Hsien CHENG, Chi-Ming YANG, Tze-Liang LEE
Filed: 10 Aug 23
Utility
Epitaxial Structures In Semiconductor Devices
14 Dec 23
A semiconductor device and a method of fabricating the semiconductor device are disclosed.
Cheng-Wei CHANG, Shahaji B. MORE, Lun-Kuang TAN, Chi-Yu CHOU, Yueh-Ching PAI
Filed: 29 Mar 23
Utility
Semiconductor Package and Method
14 Dec 23
A semiconductor package including a cooling system and a method of forming are provided.
Chen Chiang Yu, Tsung-Fu Tsai, Szu-Wei Lu
Filed: 13 Jun 22
Utility
Semiconductor Structure and Method for Forming the Same
14 Dec 23
Semiconductor structures and methods for manufacturing the same are provided.
Li-Zhen YU, Lin-Yu HUANG, Huan-Chieh SU
Filed: 9 Jun 22
Utility
Memory Circuit and Method of Operating Same
14 Dec 23
A method of operating a memory circuit includes turning on a first programming device and turning on a first selection device thereby causing a first current to flow through a first fuse element.
Meng-Sheng CHANG, Chia-En HUANG, Yih WANG
Filed: 31 Jul 23