997 patents
Page 13 of 50
Utility
Power converter
2 Aug 22
A power converter includes a housing that accommodates at least one capacitor inside the housing, a first power conversion module including at least one first positive electrode and at least one first negative electrode, a second power conversion module including at least one second positive electrode and at least one second negative electrode, a first positive electrode busbar that connects a first electrode of the capacitor to the first positive electrode, a first negative electrode busbar that connects a second electrode of the capacitor to the second negative electrode, a second positive electrode busbar that is fixed to the first positive electrode together with the first positive electrode busbar and that is fixed to the second positive electrode, and a second negative electrode busbar that is fixed to the first negative electrode and that is fixed to the second negative electrode together with the first negative electrode busbar.
Akira Ikegami
Filed: 22 Jan 21
Utility
Semiconductor module
26 Jul 22
A semiconductor module includes an insulating substrate having a main wiring layer, positive and negative electrode terminals adjacently arranged in a first direction, a plurality of semiconductor elements forming a first column and another plurality of semiconductor elements forming a second column, each semiconductor element having gate and source electrode on an upper surface thereof, and being disposed on the main wiring layer such that corresponding ones of the gate electrodes in the first and second columns face each other in a second direction orthogonal to the first direction, a control wiring substrate between the first and second columns and having gate and source wiring layers, a gate wiring member connecting ones of the gate electrodes in the first and second columns through the gate wiring layer, and a source wiring member connecting ones of the source electrodes in the first and second columns through the source wiring layer.
Ryoichi Kato, Yuma Murata, Naoyuki Kanai, Akito Nakagome, Yoshinari Ikeda
Filed: 26 Feb 21
Utility
Semiconductor module
26 Jul 22
A semiconductor module includes first to fourth semiconductor elements, each having an upper-surface electrode and a lower-surface electrode, first to fourth conductive layers, each extending in a first direction and being independently disposed side by side in a second direction orthogonal to the first direction, and an output terminal connected to the second and third conductive layers.
Ryoichi Kato, Yuma Murata, Naoyuki Kanai, Akito Nakagome, Yoshinari Ikeda
Filed: 26 Feb 21
Utility
Motor driving apparatus and motor driving method
19 Jul 22
Provided is a motor driving apparatus including: an upper-arm gate driving circuit; a lower-arm gate driving circuit; a first rotation detection unit powered by a first power source; a second rotation detection unit powered by a second power source; a first fail safe circuit that performs, by use of a detection signal from the first rotation detection unit, a fail safe control on a gate driving circuit powered at least by the first power source, from among the upper-arm gate driving circuit and the lower-arm gate driving circuit; and a second fail safe circuit that performs, by use of a detection signal from the second rotation detection unit, a fail safe control on a gate driving circuit powered at least by the second power source, from among the upper-arm gate driving circuit and the lower-arm gate driving circuit.
Masaki Hirakata
Filed: 24 Aug 20
Utility
Power conversion device
19 Jul 22
In a power conversion device, a distance between an output terminal of a first switching module and a cathode terminal of a first diode module in a first direction is arranged to be substantially equal to a distance between an output terminal of a second switching module and an anode terminal of a second diode module in the first direction.
Kohei Matsui
Filed: 8 Jun 20
Utility
Power conversion apparatus having semiconductor modules each including series-connected semiconductor switches and output terminal coupled to node connecting semiconductor switches, and output bar coupling output terminals of semiconductor modules
19 Jul 22
A power conversion apparatus includes N semiconductor modules respectively including a switch part including first and second semiconductor switches coupled in series, and an output terminal coupled to a node that connects the first and second semiconductor switches, where N is an integer greater than or equal to 3, wherein the N semiconductor modules are arranged so that the output terminals thereof are adjacent to each other.
Hong-fei Lu
Filed: 7 Oct 20
Utility
Semiconductor device and method of manufacturing semiconductor device
19 Jul 22
A semiconductor device including a diode region provided in a semiconductor substrate is provided, the diode region including a base region of a first conductivity type exposed on an upper surface of the semiconductor substrate, a cathode region of a second conductivity type exposed on a lower surface of the semiconductor substrate, an inter-cathode region of a first conductivity type exposed on the lower surface of the semiconductor substrate and alternately arranged with the cathode region in a predetermined direction, and a floating region of a second conductivity type provided above the cathode region and above the inter-cathode region.
Kazuki Kamimura, Motoyoshi Kubouchi
Filed: 19 Dec 18
Utility
Semiconductor module and manufacturing method therefor
12 Jul 22
A semiconductor module is provided, including: a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to the upper surface electrode; a metal wiring plate electrically connected to the upper surface electrode of the semiconductor chip; and a sheet-like low elastic sheet provided on the metal wiring plate, the low elastic sheet having elastic modulus lower than that of the metal wiring plate.
Takafumi Yamada, Hiromichi Gohara
Filed: 19 Feb 20
Utility
Semiconductor device and method of manufacturing a semiconductor device
12 Jul 22
A semiconductor device having an active region and a voltage withstand region comprises a first semiconductor layer of a first conductive type, a second semiconductor region of a second conductive type, disposed selectively on the front side of the first semiconductor layer, a plurality of first trench contact (TC) sections disposed at a peripheral section of the active region in the second semiconductor region, being apart from one another and extending in a first direction, a second trench contact (TC) disposed at the peripheral section of the active region in the second semiconductor region, extending in the first direction and being further from the voltage withstand region than the plurality of first trench contact sections, an electric conductor layer electrically connecting together the plurality of first TC sections, and a conductive connection region disposed between the first TC sections and second TC section, having a lower resistivity than the second semiconductor region, and electrically connecting the first TC sections and second TC section.
Isamu Sugai
Filed: 21 Feb 20
Utility
Overcurrent sense control of semiconductor device
12 Jul 22
A control device includes a current detecting section that detects a sense current for a current flowing through a semiconductor element; a transient sensing period detecting section that detects a transient sensing period from a transient rising to a transient falling of a detection signal of the sense current, in response to the semiconductor element being turned ON; and a control section that controls the semiconductor element according to a detection result of the transient sensing period, based on the sense current detection signal.
Masashi Akahane
Filed: 23 Apr 19
Utility
Semiconductor module, vehicle, and method of manufacturing semiconductor module
5 Jul 22
There is provided a semiconductor module including: a base for semiconductor cooling; a stacked substrate provided above the base; a semiconductor chip provided above the stacked substrate; a coating layer provided on an upper surface of the semiconductor chip; and a sealing resin for sealing the semiconductor chip, in which the base is in contact with the sealing resin.
Kohei Yamauchi, Tatsuhiko Asai
Filed: 24 Feb 20
Utility
Semiconductor module
5 Jul 22
A semiconductor module includes a substrate on which first, second, and third circuit boards that are electrically isolated from each other are formed; a semiconductor element arranged on the first circuit board; a connecting member that bridges an upper surface electrode of the semiconductor element and the second circuit board so as to electrically connect the upper surface electrode to the second circuit board; a wire that electrically connects the third circuit board to a first electrode that is located outside of where the first, second and third circuit boards are located in a plan view; and a sealing resin that covers and seals the substrate, the semiconductor element, the connecting member, and the wire, wherein the wire is wired from the third circuit board to the first electrode so as to cross the semiconductor element at a vertical position lower than an upper surface of the connecting member.
Hayato Nakano
Filed: 4 Jan 21
Utility
Semiconductor device
5 Jul 22
Provided is a semiconductor device that includes a first conductivity type well region below a gate runner portion, wherein a diode region includes first contact portions, a first conductivity type anode region, and a second conductivity type cathode region; wherein the well region contacts the diode region in the first direction, and when an end of the well region, an end of at least one of first contact portions, and an end of the cathode region that face one another in the first direction are imaginary projected on an upper surface of the semiconductor substrate, a first distance is longer than a second distance, the first distance being a distance between the end of the well region and the end of the cathode region, and the second distance being a distance between the end of the well region and the end of the at least one first contact portion.
Misaki Takahashi, Yuichi Harada, Kouta Yokoyama
Filed: 27 Jan 20
Utility
Cooling apparatus, semiconductor module, and vehicle
14 Jun 22
The flow speed distribution of a refrigerant in a cooling apparatus is made uniform.
Takahiro Koyama
Filed: 28 Mar 19
Utility
Semiconductor device and manufacturing method thereof
14 Jun 22
There is provided a semiconductor device including: an anode electrode that is provided on a front surface side of a semiconductor substrate; a drift region of a first conductivity type that is provided in the semiconductor substrate; a first anode region of a first conductivity type that is in Schottky contact with the anode electrode; and a second anode region of a second conductivity type that is different from the first conductivity type, in which the first anode region has a doping concentration lower than or equal to a doping concentration of the second anode region, and is spaced from the drift region by the second anode region.
Takahiro Tamura, Michio Nemoto
Filed: 13 Aug 20
Utility
Assembly jig set and manufacturing method of semiconductor module
7 Jun 22
Provided is an assembly jig set of semiconductor module having a plurality of semiconductor chips, the assembly jig set comprising: a first outer frame jig; and a plurality of inner piece jigs positioned by the first outer frame jig and each having a sectioned shape corresponding to the first outer frame jig, wherein one of the inner piece jigs has a plurality of opening portions for positioning the semiconductor chips.
Kazunaga Onishi, Takeshi Yokoyama, Masaki Maruyama
Filed: 24 Feb 20
Utility
Cooling apparatus, semiconductor module, and vehicle
7 Jun 22
Provided is a cooling apparatus for a semiconductor module including a semiconductor chip, the apparatus including a ceiling plate having a bottom surface; and a case portion having two sets of opposing edges in an overhead view, and including a flow portion arranged on the plate's bottom surface side and allowing coolant to flow therethrough, an outer edge portion surrounding the flow portion, and a side wall provided on the outer edge portion's inner side, the side wall including a first constricted portion changing the flow portion's width in a first direction parallel to one of the edge sets, along a second direction orthogonal to the first direction, a fastening portion for fastening the plate and the case portion to an external apparatus provided where the plate and the outer edge portion are overlapped and arranged, and the fastening portion arranged opposite the first constricted portion in the first direction.
Toru Yamada
Filed: 27 May 20
Utility
Semiconductor device and method of manufacturing semiconductor device
7 Jun 22
Directly beneath p−-type base regions, n-type storage regions are provided.
Motoyoshi Kubouchi
Filed: 31 Dec 20
Utility
Motor drive device, motor drive method, and computer-readable medium having recorded thereon motor drive program
7 Jun 22
Provided is a motor drive device comprising a motor control unit that controls a plurality of upper arm-side switching elements and a plurality of lower arm-side switching elements provided to an inverter for driving a motor; a current determination unit that determines whether a motor current flowing through at least one switching element of the plurality of upper arm-side switching elements and the plurality of lower arm-side switching elements is equal to or smaller than a threshold value; and a short-circuit control unit that performs switching between all-on of the plurality of upper arm-side switching elements and all-on of the plurality of lower arm-side switching elements, on condition that the motor current is equal to or smaller than the threshold value, in a short-circuiting operation of alternately switching all-on of the plurality of upper arm-side switching elements and all-on of the plurality of lower arm-side switching elements.
Masaki Hirakata
Filed: 24 Feb 21
Utility
Power supply control device and power supply control method for controlling switching device of boost chopper
31 May 22
A power supply control device includes a switch control unit configured to control ON/OFF of a switching device of a boost chopper by using an oscillation wave, a comparison voltage generating unit configured to charge or discharge comparison capacitor that generates a comparison voltage for comparison with the oscillation wave in correspondence with a DC output voltage outputted from the boost chopper, an input increase detecting unit configured to detect whether a detection value corresponding to current flowing through the boost chopper has increased to or above a detection criterion, an output voltage detecting unit configured to detect whether the DC output voltage is at or above the lower limit voltage, a discharging unit configured to discharge the comparison capacitor when the detection value has increased to or above the detection criterion and the DC output voltage is at or above the lower limit voltage.
Yukihiro Yaguchi
Filed: 27 Sep 20