7578 patents
Page 16 of 379
Utility
Indexable side storage pod apparatus, heated side storage pod apparatus, systems, and methods
21 Nov 23
A side storage pod includes an outer enclosure having a sealing surface configured to couple to an EFEM and a side storage pod chamber having a body coupled to vertically-spaced storage members.
Patrick Pannese
Filed: 8 Nov 21
Utility
Calibration of an aligner station of a processing system
21 Nov 23
A calibration object is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber and placed in a load lock connected to the transfer chamber.
Nicholas Michael Bergantz, Andreas Schmid, Leon Volfovski, Sanggyum Kim, Damon Cox, Paul Wirth
Filed: 11 Aug 20
Utility
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21 Nov 23
Methods for aligning a processing chamber using a centering ring and processing chambers having the centering ring are describes.
Kwok Feng Wong, Rakesh Ramadas, Ashutosh Agarwal
Filed: 21 Sep 21
Utility
1l900xmlrkfwt36nfgycq7e17owuqzloj1nm0ghxzxnp0w9qrp33hsgj8f
21 Nov 23
The present invention relates to a method for manufacturing an electrostatic chuck comprising: a base member of a metal material; and a dielectric layer, formed on an upper surface of the base member, including an electrode layer to the inside of which a DC power is applied.
Saeng Hyun Cho
Filed: 1 Jun 16
Utility
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21 Nov 23
A drift tube may include a middle portion, arranged as a hollow cylinder, and coupled to receive an RF voltage signal.
William Davis Lee, Charles T. Carlson
Filed: 13 Sep 21
Utility
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21 Nov 23
Embodiments of the present disclosure provide nanopore devices, such as nanopore sensors and/or other nanofluidic devices.
Ryan Scott Smith, Roger Quon, David Collins, George Odlum, Raghav Sreenivasan, Joseph R. Johnson
Filed: 20 Jul 20
Utility
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21 Nov 23
Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein.
Sumit Agarwal, Timothy Joseph Franklin, Joseph F. Sommers
Filed: 2 Aug 21
Utility
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21 Nov 23
Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein.
Chih Chung Chou, Anand Nilakantan Iyer, Ekaterina Mikhaylichenko, Christopher Heung-Gyun Lee, Erik Rondum, Tiffany Yu-Nung Cheung, Shou-Sung Chang
Filed: 25 Jun 21
Utility
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21 Nov 23
Methods of depositing metal films comprising exposing a substrate surface to a first metal precursor followed by a non-oxygen containing reducing agent comprising a second metal to form a zero-valent first metal film are described.
Nasrin Kazem, Muthukumar Kaliappan, Jeffrey W. Anthis, Michael Haverty
Filed: 11 Nov 20
Utility
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21 Nov 23
Methods of depositing a molybdenum sulfide film with increased sulfur:molybdenum ratio are described.
Keith T. Wong, HyoJin Kim
Filed: 22 Sep 20
Utility
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21 Nov 23
Exemplary methods of semiconductor processing may include forming a silicon oxide material on exposed surfaces of a processing region of a semiconductor processing chamber.
Xiaoquan Min, Byung Ik Song, Hyung Je Woo, Venkata Sharat Chandra Parimi, Prashant Kumar Kulshreshtha, Kwangduk Lee
Filed: 27 Oct 20
Utility
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21 Nov 23
Apparatus and methods for spatial atomic layer deposition including at least one first exhaust system and at least one second exhaust system.
Ning Li, Steven D. Marcus, Tai T. Ngo, Kevin Griffin
Filed: 28 Dec 21
Utility
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21 Nov 23
Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface are described.
Bhaskar Jyoti Bhuyan, Mark Saly, David Thompson, Tobin Kaufman-Osborn, Kurt Fredrickson, Thomas Knisley, Liqi Wu
Filed: 23 Feb 21
Utility
1q7qpewespbhj8xj9wl3k6c1klgpcsgq1smcr 1ggepknhpjz7umfs9rz
21 Nov 23
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber.
Shu-Kwan Lau, Koji Nakanishi, Toshiyuki Nakagawa, Zuoming Zhu, Zhiyuan Ye, Joseph M. Ranish, Nyi O. Myo, Errol Antonio C. Sanchez, Schubert S. Chu
Filed: 26 May 21
Utility
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21 Nov 23
Methods, systems and apparatus for decreasing total distortion of a maskless lithography process are disclosed.
Joseph Johnson, Christopher Bencher
Filed: 10 May 22
Utility
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16 Nov 23
Aspects generally relate to methods, systems, and apparatus for conducting a calibration operation for a plurality of mass flow controllers (MFCs) of a substrate processing system.
Bindusagar MARATH SANKARATHODI, Zhiyuan YE, Jyothi RAJEEVAN, Ala MORADIAN, Zuoming ZHU, Errol Antonio C. SANCHEZ, Patricia M. LIU
Filed: 19 Jul 23
Utility
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16 Nov 23
A method may include generating a residual curvature map for a substrate, the residual curvature map being based upon a measurement of the substrate.
Pradeep Subrahmanyan
Filed: 8 May 23
Utility
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16 Nov 23
A method includes receiving, by a processing device, first data.
Chao Liu, Yudong Hao, Shifang Li, Andreas Schulze
Filed: 11 May 22
Utility
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16 Nov 23
Embodiments herein include void-free material depositions on a substrate (e.g., in a void-free trench-filled (VFTF) component) obtained using directional etching to remove predetermined portions of a seed layer covering the substrate.
M. Arif Zeeshan, Kelvin Chan, Shantanu Kallakuri, Sony Varghese, John Hautala
Filed: 21 Jul 23
Utility
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16 Nov 23
An ion source that is capable of different modes of operation is disclosed.
Graham Wright, Shardul S. Patel
Filed: 10 May 22