7578 patents
Page 17 of 379
Utility
Three Dimensional Device Formation Using Early Removal of Sacrificial Heterostructure Layer
16 Nov 23
A method for forming a nanosheet device.
Yan Zhang, Johannes M. van Meer, Sankuei Lin, Baonian Guo, Naushad K. Variam
Filed: 13 May 22
Utility
Plasma Sources and Plasma Processing Apparatus Thereof
16 Nov 23
Embodiments of the present disclosure generally relate to inductively coupled plasma sources and plasma processing apparatus.
Vladimir NAGORNY, Wei LIU, Rene GEORGE
Filed: 19 May 23
Utility
Stress Relaxation Trenches for Gallium Nitride Microled Layers on Silicon Substrates
16 Nov 23
A microLED-quality layer of gallium nitride (GaN) may be formed above a silicon substrate for microLED devices to be formed.
Tyler Sherwood, Raghav Sreenivasan
Filed: 16 May 22
Utility
Hybrid High-k Dielectric Material Film Stacks Comprising Zirconium Oxide Utilized In Display Devices
16 Nov 23
Embodiments of the disclosure generally provide methods of forming a hybrid film stack that may be used as a capacitor layer or a gate insulating layer with a high dielectric constant as well as film qualities for display applications.
Xiangxin RUI, Lai ZHAO, Jrjyan Jerry CHEN, Soo Young CHOI, Yujia ZHAI
Filed: 12 Jul 23
Utility
Methods for Controlling Pulse Shape In Ald Processes
16 Nov 23
Methods for controlling pulse shape in ALD processes improves local non-uniformity issues of films deposited on substrate surface.
Joseph AuBuchon, Kevin Griffin, Hanhong Chen
Filed: 27 Jul 23
Utility
Drug Compositions and Methods of Preparing the Same
16 Nov 23
Methods for providing an inorganic oxide coating to high aspect ratio particles containing an active pharmaceutical ingredient are described as are compositions containing such coated particles.
Miaojun Wang, Jonathan Frankel, Pravin K. Narwankar, Suneel Kumar Rastogi, Shivkumar Chiruvolu, Fei Wang, Balaji Ganapathy, Shrikant Swaminathan
Filed: 19 May 23
Utility
Dose Mapping Using Substrate Curvature to Compensate for Out-of-plane Distortion
16 Nov 23
A method may include generating a residual curvature map for a substrate, the residual curvature map being based upon a measurement of a surface of the substrate.
Pradeep Subrahmanyan
Filed: 8 May 23
Utility
Polishing Pads with Improved Planarization Efficiency
16 Nov 23
Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process.
Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE, Ashwin CHOCKALINGAM
Filed: 24 Apr 23
Utility
Angle Control for Neutral Reactive Species Generated In a Plasma
16 Nov 23
Provided herein are approaches for angle control of neutral reactive species ion beams.
Glen F. R. Gilchrist, Yufeng Qiu
Filed: 13 May 22
Utility
Calibration of an Electronics Processing System
16 Nov 23
A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position.
Nicholas Michael Bergantz, Damon K. Cox, Alexander Berger
Filed: 19 Jul 23
Utility
Recombination Channels for Angle Control of Neutral Reactive Species
16 Nov 23
Provided herein are approaches for angle control of neutral reactive species ion beams.
Glen F. R. Gilchrist
Filed: 13 May 22
Utility
Physically-informed Multi-system Hardware Operating Windows
16 Nov 23
Embodiments disclosed herein include a method for use with a semiconductor processing tool.
Jeong Jin Hong, Mi Hyun Jang, Sidharth Bhatia, Sejune Cheon, Joshua Maher, Upendra Ummethala
Filed: 16 May 22
Utility
Integrated Method and Tool for High Quality Selective Silicon Nitride Deposition
16 Nov 23
Methods of manufacturing memory devices are provided.
Tomohiko Kitajima, Ning Li, Chang Seok Kang, Naomi Yoshida
Filed: 28 Mar 23
Utility
Hybrid Ion Source for Aluminum Ion Generation Using a Target Holder and Organoaluminium Compounds
16 Nov 23
An ion source that is capable of different modes of operation is disclosed.
Graham Wright, Shardul S. Patel
Filed: 10 May 22
Utility
Etch Rate Modulation of FinFET Through High-Temperature Ion Implantation
16 Nov 23
A method of forming a semiconductor device may include forming a plurality of fins extending from a buried oxide layer, wherein a masking layer is disposed atop each of the plurality of fins, and performing a high-temperature ion implant to the semiconductor device.
Qintao Zhang, Rajesh Prasad, Jun-Feng Lu
Filed: 21 Aug 20
Utility
Hybrid Ion Source for Aluminum Ion Generation Using Organoaluminium Compounds and a Solid Target
16 Nov 23
An ion source that is capable of different modes of operation is disclosed.
Graham Wright, Shardul S. Patel
Filed: 10 May 22
Utility
Systems and Methods to Reduce Flow Accuracy Error for Liquid & Gas Mass Flow Controller Devices
16 Nov 23
Exemplary fluid delivery assemblies for a semiconductor processing system may include a liquid delivery source.
Daemian Raj Benjamin Raj, Collen Leng, Syed A. Alam, Tianyang Li
Filed: 13 May 22
Utility
Spot Heating by Moving a Beam with Horizontal Rotary Motion
16 Nov 23
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber.
Shu-Kwan Danny LAU, Toshiyuki NAKAGAWA, Zhiyuan YE
Filed: 19 Jul 23
Utility
Methods for Forming Multi-tier Tungsten Features
16 Nov 23
A method of forming a structure on a substrate includes forming a tungsten nucleation layer within at least one opening within a multi-tier portion of a substrate.
Peiqi WANG, Kai WU
Filed: 13 Apr 23
Utility
System and Method for Dissipating Workpiece Charge Build Up
16 Nov 23
A system and method for reducing charge on a workpiece disposed on a platen is disclosed.
David Morrell, Dawei Sun, Qin Chen
Filed: 10 May 22