7578 patents
Page 19 of 379
Utility
Multi-wafer volume single transfer chamber facet
14 Nov 23
Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers.
William T. Weaver, Andrew J. Constant, Shay Assaf, Jacob Newman
Filed: 22 Sep 20
Utility
CVD based oxide-metal multi structure for 3D NAND memory devices
14 Nov 23
Implementations described herein generally relate to a method for forming a metal layer and to a method for forming an oxide layer on the metal layer.
Susmit Singha Roy, Kelvin Chan, Hien Minh Le, Sanjay Kamath, Abhijit Basu Mallick, Srinivas Gandikota, Karthik Janakiraman
Filed: 29 Aug 19
Utility
Enclosure system with charging assembly
14 Nov 23
An enclosure system includes multiple walls forming an interior volume.
Phillip Alfred Criminale, Zhiqiang Guo, Andrew S. C. Ho, Rachel Sara Stolzman, Michael Carl Hankes
Filed: 2 Mar 22
Utility
Integrated lithium deposition with protective layer tool
14 Nov 23
In one implementation, an integrated processing tool for the deposition and processing of lithium metal in energy storage devices.
Subramanya P. Herle, Dieter Haas
Filed: 24 Feb 21
Utility
RF quadrupole particle accelerator
14 Nov 23
An apparatus may include a drift tube assembly, the drift tube assembly defining a triple gap configuration, and arranged to accelerate and transmit an ion beam along abeam path.
Frank Sinclair, Wai-Ming Tam, Costel Biloiu, William Davis Lee
Filed: 29 Jan 21
Utility
Three-dimensional dynamic random access memory (DRAM) and methods of forming the same
14 Nov 23
Examples herein relate to three-dimensional (3D) dynamic random access memory (DRAM) and corresponding methods.
Chang Seok Kang, Tomohiko Kitajima, Sung-Kwan Kang, Fredrick Fishburn, Gill Yong Lee, Nitin K. Ingle
Filed: 27 Sep 21
Utility
Heater assembly with purge gap control and temperature uniformity for batch processing chambers
14 Nov 23
A heater assembly having a backside purge gap formed between a top plate and a heater of the heater assembly, the top plate having a top plate wall.
Dhritiman Subha Kashyap, Amit Rajendra Sherekar, Kartik Shah, Ashutosh Agarwal, Eric J. Hoffmann, Sanjeev Baluja, Vijay D. Parkhe
Filed: 26 Mar 21
Utility
Methods for forming structures for MRAM applications
14 Nov 23
Embodiments of the disclosure provide methods and apparatus for fabricating magnetic tunnel junction (MTJ) structures on a substrate in for hybrid (or called integrated) spin-orbit-torque magnetic spin-transfer-torque magnetic random access memory (SOT-STT MRAM) applications.
Hsin-wei Tseng, Chando Park, Jaesoo Ahn, Lin Xue, Mahendra Pakala
Filed: 19 Jul 21
Utility
Carrier Head Membrane With Regions of Different Roughness
9 Nov 23
An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus.
Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
Filed: 12 Jul 23
Utility
Compliant Inner Ring for a Chemical Mechanical Polishing System
9 Nov 23
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body.
Jeonghoon Oh, Andrew Nagengast, Steven M. Zuniga, Eric L. Lau, Hari Prasath Rajendran, Satish Radhakrishnan, Kuen-Hsiang Chen, Ekaterina A. Mikhaylichenko
Filed: 3 May 22
Utility
Polishing Head with Local Inner Ring Downforce Control
9 Nov 23
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body.
Jeonghoon Oh, Brian J. Brown, Huanbo Zhang, Andrew Nagengast, Steven M. Zuniga, Ekaterina A. Mikhaylichenko, Eric L. Lau, Jay Gurusamy, David J. Lischka
Filed: 3 May 22
Utility
Low Temperature Carbon Gapfill
9 Nov 23
Exemplary methods of semiconductor processing may include providing a carbon-containing precursor to a processing region of a semiconductor processing chamber.
Supriya Ghosh, Susmit Singha Roy, Abhijit Basu Mallick, Shuchi Sunil Ojha, Praket Prakash Jha, Rui Cheng
Filed: 5 May 22
Utility
Ozone-based Low Temperature Silicon Oxide Coating for Pharmaceutical Applications
9 Nov 23
This disclosure pertains to coated drug compositions and methods of preparing coated drug compositions with a low temperature o-zone based silicon oxide coating.
Fei Wang, Geetika Bajaj, Pravin K. Narwankar
Filed: 19 May 23
Utility
Wafer Film Frame Carrier
9 Nov 23
Exemplary semiconductor substrate carrier frames may include a frame body defining a central aperture.
Jason A. Rye
Filed: 3 May 22
Utility
Chemical Mechanical Polishing Temperature Scanning Apparatus for Temperature Control
9 Nov 23
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system.
Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang
Filed: 21 Jul 23
Utility
Conformal Metal Dichalcogenides
9 Nov 23
Transition metal dichalcogenide films and methods for depositing transition metal dichalcogenide films on a substrate are described.
Chandan Das, Susmit Singha Roy, Supriya Ghosh, John Sudijono, Abhijit Basu Mallick, Jiecong Tang
Filed: 9 May 22
Utility
Methods, Systems, and Apparatus for Inkjet Printing Self-assembled Monoloayer (Sam) Structures on Substrates
9 Nov 23
Embodiments of the present disclosure relate to methods, systems, and apparatus for inkjet printing self-assembled monolayer (SAM) structures on substrates.
Yingdong LUO, Rami HOURANI, Xiaopei DENG, Kang LUO, Erica CHEN, Ludovic GODET
Filed: 2 May 23
Utility
Dry Treatment for Surface Loss Removal In Micro-led Structures
9 Nov 23
A mesa etch may form the geometry of microLED structures.
Michel Khoury, Archana Kumar, Jeffrey W. Anthis, Ryan Ley, Alfredo Granados
Filed: 4 May 22
Utility
Autonomous Frequency Retrieval from Plasma Power Sources
9 Nov 23
Embodiments disclosed herein include a processing tool.
David Coumou, Valeriy Serebryanskiy
Filed: 5 May 22
Utility
Silicon-and-carbon-containing Materials with Low Dielectric Constants
9 Nov 23
Exemplary methods of semiconductor processing may include providing a silicon-containing precursor and a carbon-containing precursor to a processing region of a semiconductor processing chamber.
Zeqing Shen, Susmit Singha Roy, Abhijit Basu Mallick
Filed: 5 May 22