7578 patents
Page 20 of 379
Utility
Pulsed Etch Process
9 Nov 23
Described herein is a method for etching a sample.
Yifeng Zhou, Qian Fu
Filed: 6 May 22
Utility
Large Area Gapfill Using Volumetric Expansion
9 Nov 23
Exemplary methods of semiconductor processing may include providing a silicon-containing precursor to a processing region of a semiconductor processing chamber.
Supriya Ghosh, Susmit Singha Roy, Abhijit Basu Mallick
Filed: 5 May 22
Utility
Control and Prediction of Multiple Plasma Coupling Surfaces and Corresponding Power Transfer
9 Nov 23
Embodiments disclosed herein include a process power controller for a plasma processing tool.
David Coumou, Zhi Wang, Tao Zhang, David Peterson
Filed: 5 May 22
Utility
Ald Cycle Time Reduction Using Process Chamber Lid with Tunable Pumping
9 Nov 23
Process chamber lids having a pumping liner with a showerhead and gas funnel within an open central region are described.
Muhannad Mustafa, Muhammad M. Rasheed, Mario D. Sanchez, Anqing Cui
Filed: 20 Jul 23
Utility
Coaxial Lift Device with Dynamic Leveling
9 Nov 23
Embodiments described herein generally relate to process chambers with coaxial lift devices.
Jason M. SCHALLER, Jeffrey Charles BLAHNIK, Amit Kumar BANSAL
Filed: 21 Jul 23
Utility
Impedance Tuning Utility of Vector Space Defined by Transmission Line Quantities
9 Nov 23
Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool.
David Coumou, David Peterson
Filed: 5 May 22
Utility
Optical Device Improvement
9 Nov 23
A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide.
Yue CHEN, Jinyu LU, Yongmei CHEN, Jinxin FU, Zihao YANG, Mingwei ZHU, Takashi KURATOMI, Rami HOURANI, Ludovic GODET, Qun JING, Jingyi YANG, David Masayuki ISHIKAWA
Filed: 7 Apr 23
Utility
Coaxial Lift Device with Dynamic Leveling
9 Nov 23
Embodiments described herein generally relate to process chambers with coaxial lift devices.
Jason M. SCHALLER, Jeffrey Charles BLAHNIK, Amit Kumar BANSAL
Filed: 21 Jul 23
Utility
High Bandwidth Architecture for Centralized Coherent Control at the Edge of Processing Tool
9 Nov 23
Embodiments disclosed herein include a processing tool.
David Coumou
Filed: 5 May 22
Utility
Temperature and Bias Control of Edge Ring
9 Nov 23
Embodiments described herein provide methods and apparatus used to control a processing result profile proximate to a circumferential edge of a substrate during the plasma-assisted processing thereof.
James ROGERS, Linying CUI, Rajinder DHINDSA
Filed: 21 Jul 23
Utility
Self-alignment Etching of Interconnect Layers
9 Nov 23
A method for etching a metal containing feature is provided.
Suketu Arun PARIKH
Filed: 21 Jul 23
Utility
Apparatus and Methods to Promote Wafer Edge Temperature Uniformity
9 Nov 23
A shadow ring for a processing chamber, such as a semiconductor processing chamber, is an annular member including a body with a radially inwardly projecting lip.
Zubin HUANG, Jallepally RAVI, Cheng CHENG, Peiqi WANG, Kai WU
Filed: 11 Jul 22
Utility
Methods and Mechanisms for Adjusting Film Deposition Parameters During Substrate Manufacturing
9 Nov 23
An electronic device manufacturing system capable of obtaining metrology data associated with a deposition process performed on a substrate according to a process recipe, wherein the deposition process generates a plurality of layers on a surface of the substrate.
Mitesh Sanghvi, Venkatanarayana Shankarmurthy, Yulian Yao, Chuan Ying Wang, Xinhai Han
Filed: 5 May 22
Utility
RF Measurement from a Transmission Line Sensor
9 Nov 23
Embodiments disclosed herein include a sensor.
David Coumou, Xiaopu Li, Michelle SanPedro
Filed: 5 May 22
Utility
Advanced polishing pads and related polishing pad manufacturing methods
7 Nov 23
Embodiments herein generally relate to polishing pads and method of forming polishing pads.
Puneet Narendra Jawali, Nandan Baradanahalli Kenchappa, Jason G. Fung, Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage, Rajeev Bajaj, Adam Wade Manzonie, Andrew Scott Lawing
Filed: 19 Jun 20
Utility
Slurry distribution device for chemical mechanical polishing
7 Nov 23
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system.
Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
Filed: 22 Mar 21
Utility
Multifunctional printhead service station with multi-axis motions
7 Nov 23
Embodiments described herein relate to an inkjet service station and methods of servicing an inkjet printer with the inkjet service station.
Daihua Zhang, Kang Luo, Kazuya Daito, Kenneth S. Ledford, Elsa Massonneau, Alexey Stepanov, Ludovic Godet, Mahendran Chidambaram, Visweswaren Sivaramakrishnan, Bahubali S. Upadhye, Hemantha Raju
Filed: 12 Jan 22
Utility
Ion beam source for optical device fabrication using a segmented ion source having one or more angled surfaces
7 Nov 23
Aspects of the disclosure relate to apparatus for the fabrication of waveguides.
Ludovic Godet, Joseph C. Olson, Rutger Meyer Timmerman Thijssen
Filed: 17 Dec 19
Utility
Protection of aluminum process chamber components
7 Nov 23
Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber.
Karthikeyan Balaraman, Sathyanarayana Bindiganavale, Rajasekhar Patibandla, Balamurugan Ramasamy, Kartik Shah, Umesh M. Kelkar, Mats Larsson, Kevin A. Papke, William M. Lu
Filed: 2 May 19
Utility
Variable thickness ion source extraction plate
7 Nov 23
An ion source having an extraction plate with a variable thickness is disclosed.
Alexandre Likhanskii, Alexander S. Perel, Jay T. Scheuer, Bon-Woong Koo, Robert C. Lindberg, Peter F. Kurunczi, Graham Wright
Filed: 13 Sep 21