3198 patents
Page 30 of 160
Utility
Ground electrode formed in an electrostatic chuck for a plasma processing chamber
2 May 23
Disclosed herein is a substrate support assembly having a ground electrode mesh disposed therein along a side surface of the substrate support assembly.
Michael R. Rice, Vijay D. Parkhe
Filed: 14 Oct 19
Utility
Implant to form vertical FETs with self-aligned drain spacer and junction
2 May 23
Disclosed herein are methods for forming vertical field-effect-transistor (vFET).
Andrew Michael Waite
Filed: 4 Feb 21
Utility
skie8r7imv4x4nbx26 128a3ag7tw00rx3710o0i50q9i43bnqaj
25 Apr 23
A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.
Haosheng Wu, Jianshe Tang, Hari Soundararajan, Shou-Sung Chang, Paul D. Butterfield, Hui Chen, Chih Chung Chou, Alexander John Fisher
Filed: 28 May 20
Utility
0de0v7tu0g7jeqdq27tyu93164cecdqmea41lx5p1tqbjzv29yuysf9hgh
25 Apr 23
Embodiments of the present disclosure provide apparatuses for improving gas distribution during thermal processing.
Eric Kihara Shono
Filed: 30 Nov 21
Utility
cv0l19egk6heg4kwwjyjjsody5tx1igjymnmzheq
25 Apr 23
Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall surfaces.
Jing Xu, John L. Klocke, Marvin L. Bernt, Eric J. Bergman, Kwan Wook Roh
Filed: 25 Aug 21
Utility
lpbq dorld7ddn4heu5gdcog5n0sx39w7m1mix57s
25 Apr 23
Methods and apparatus for detecting a vacuum leak within a processing chamber are described herein.
Martin A. Hilkene, Surendra Singh Srivastava
Filed: 23 Oct 20
Utility
262hjyn7w4cpeakak9w6q
25 Apr 23
There is provided a system and method of inspecting a specimen.
Dan Koronel, Liat Shalom Mermelstein
Filed: 30 Dec 20
Utility
k2q2pchnzu5cvfpf8dk84rr9qjk c2jmsyk7f7awhctss
25 Apr 23
A method of evaluating a region of a sample that includes two or more sub-regions adjacent to each other that have different milling rates.
Yehuda Zur
Filed: 1 Jul 20
Utility
f7os2ayw54fljvej2uuqqr71l664snm3fh3ayz4hdxe
25 Apr 23
A semiconductor processing chamber may include a remote plasma region, and a processing region fluidly coupled with the remote plasma region.
Saravjeet Singh, Alan Tso, Jingchun Zhang, Zihui Li, Hanshen Zhang, Dmitry Lubomirsky
Filed: 26 Nov 14
Utility
ojt5387ts8qt21nsv6w0ryy2ecs5z5eo3i
25 Apr 23
An alignment module for housing and cleaning masks.
Alexander N. Lerner, Michael P. Karazim, Andrew J. Constant, Jeffrey A. Brodine, Kim Ramkumar Vellore, Kevin Moraes, Roey Shaviv
Filed: 14 Apr 20
Utility
frk2xvz94 7s6fwixw788q5hmy
25 Apr 23
A load port of a factory interface of an electronic device manufacturing system can include a purge apparats, a docking tray configured to receive a substrate carrier including a substrate carrier door and a substrate carrier housing, a backplane located adjacent to the docking tray, and a carrier door configured to seal an opening in the backplane when the carrier door opener is closed.
Paul B Reuter
Filed: 15 Jul 21
Utility
4abl43xwhe2jw1feaewidfjqb318epmgoklz0amqundhh59n4xqtczktc
25 Apr 23
Methods, systems, and non-transitory computer readable medium are described for generating assessment maps for corrective action.
Wenjiao Wang, Joshua Maher, Xinhai Han, Deenesh Padhi, Tza-Jing Gung
Filed: 3 Nov 20
Utility
nobr0ack1cbgf7ssx0vjk19nmdsgxei71xzx4lp2vjltxpfkda
25 Apr 23
Bit line stacks and methods of forming bit line stacks are described herein.
Tom Ho Wing Yu, Nobuyuki Sasaki, Jianxin Lei, Wenting Hou, Rongjun Wang, Tza-Jing Gung
Filed: 17 Jun 21
Utility
38wp76sj udwn25jb065t5mm1nz0vrptjp1eavk0jpedzx7rr8kmt1em
25 Apr 23
An apparatus includes a first processing line.
Marco Galiazzo, Luigi De Santi
Filed: 8 Mar 18
Utility
fmc0n4ylrjtgeuupv9p9chef33gba42cyzp qtx7radpcewxcy0
25 Apr 23
Apparatuses and methods to provide a patterned substrate are described.
Tejinder Singh, Takehito Koshizawa, Abhijit Basu Mallick, Pramit Manna, Nancy Fung, Eswaranand Venkatasubramanian, Ho-yung David Hwang, Samuel E. Gottheim
Filed: 14 Apr 22
Utility
qfb49vvhg826swjlwljo44f47fek2zs6ojds5rf0 h2a7h9vm37uuv
25 Apr 23
Electronic devices and methods of forming electronic devices using a reduced number of hardmask materials and reusing lithography reticles are described.
Russell Chin Yee Teo
Filed: 4 Mar 22
Utility
b1mhbcdcrh1qm2boi7qhtkfq4k dmi8fkc
25 Apr 23
Electronic devices and methods of forming the electronic devices are described.
Takehito Koshizawa
Filed: 13 Sep 20
Utility
411jiq2ws3c2cvlybi8szkz0c512u0
18 Apr 23
Ampoules for a semiconductor manufacturing precursors and methods of use are described.
Kenric Choi, Xiaoxiong Yuan, Daping Yao, Mei Chang
Filed: 17 Jun 21
Utility
crsxmw744zf x7kyc78d409fpl0h4ecw82xc8s6nfr4foyytqm58n0xkv
18 Apr 23
A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.
Haosheng Wu, Jianshe Tang, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou, Alexander John Fisher, Paul D. Butterfield
Filed: 28 May 20
Utility
6xj58ihpmh0qdmb06rm31mfdb0ezyg1e4o19nihncjuf
18 Apr 23
Embodiments of the present disclosure generally relate to processing an optical workpiece containing grating structures on a substrate by deposition processes, such as atomic layer deposition (ALD).
Jinrui Guo, Ludovic Godet, Rutger Meyer Timmerman Thijssen
Filed: 24 Feb 21